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公开(公告)号：US20190322906A1
公开(公告)日：2019-10-24
申请号：US16463688
申请日：2017-11-29
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Matthew R.D. Smith , Matthew S. Stay , Mikhail L. Pekurovsky , Daniel J. Theis , Thomas J. Metzler , Shawn C. Dodds
Abstract: Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.
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公开(公告)号：US10414186B2
公开(公告)日：2019-09-17
申请号：US16063472
申请日：2016-12-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Eric A. Vandre , Matthew S. Stay , Matthew R. D. Smith , Ann M. Gilman , Shawn C. Dodds , Jon E. Dable , Evan D. Brutinel
Abstract: Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to attach the particles to the substrate.
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公开(公告)号：US20190187746A1
公开(公告)日：2019-06-20
申请号：US16281274
申请日：2019-02-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Shawn C. Dodds , Matthew S. Stay , Mikhail L. Pekurovsky , Matthew H. Frey , Mark J. Pellerite , John P. Baetzold
Abstract: A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.
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公开(公告)号：US09980394B2
公开(公告)日：2018-05-22
申请号：US14897521
申请日：2014-07-18
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Matthew S. Stay , Mikhail L. Pekurovsky , Shawn C. Dodds , Ann M. Gilman , Daniel J. Theis
IPC: G02F1/1345 , H05K3/28 , G06F3/041 , G06F3/047 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/04 , H05K3/32 , H05K1/03
CPC classification number: H05K3/284 , G06F3/041 , G06F3/0412 , G06F3/047 , G06F2203/04103 , G06F2203/04112 , H05K1/028 , H05K1/0296 , H05K1/0393 , H05K1/09 , H05K1/097 , H05K3/048 , H05K3/103 , H05K3/323 , H05K2201/026 , H05K2201/10128 , H05K2203/0143 , H05K2203/1469 , H05K2203/1545
Abstract: A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.
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公开(公告)号：US20180133742A1
公开(公告)日：2018-05-17
申请号：US15579980
申请日：2016-06-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Shawn C. Dodds , Mikhail L. Pekurovsky , James N. Dobbs , Graham M. Clarke , Michele A. Craton , Adam W. Kiefer , Matthew R.D. Smith , Brian E. Schreiber
CPC classification number: B05C1/0808 , B05C1/0869 , B05C1/0895 , B05C11/1005 , B05D1/28
Abstract: Methods and apparatuses for applying liquid coatings are provided. A first roll (14), a second roll (16), and a nip (146) formed between the first and second rolls are provided. A coating liquid (22) is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer (22a) of liquid coating which is transferred to a substrate (12). The second roll (16) includes a thin metal shell (40) and a resilient layer (30), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll (14).
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Patent Agency Ranking
6.发明申请PROTECTIVE COATING FOR PRINTED CONDUCTIVE PATTERN ON PATTERNED NANOWIRE TRANSPARENT CONDUCTORS 审中-公开印刷导电图案的保护涂层在图案纳米透明导体上公开(公告)号：US20160249461A1
公开(公告)日：2016-08-25
申请号：US15025696
申请日：2014-09-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ann M. Gilman , Mikhail L. Pekurovsky , Matthew S. Stay , Shawn C. Dodds , Daniel J. Theis
CPC classification number: H05K3/285 , B82Y15/00 , B82Y40/00 , G02F1/13338 , G02F2001/133302 , G06F3/041 , G06F2203/04103 , G06F2203/04107 , H01L21/823871 , H01L29/0669 , H05K1/0296 , H05K1/097 , H05K3/027 , H05K3/06 , H05K2203/1377 , Y10S977/762 , Y10S977/89 , Y10S977/956
Abstract: A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.
Abstract translation: 制造电子组件的方法包括将包含有机硫化合物的保护层施加到图案化导电互连电路的至少一部分，其中导电互连电路覆盖在衬底上的导电层的至少一部分上，并且其中导电 层包括纳米线; 以及将电子部件的电接触与所述保护层接合以电连接所述电子部件和所述图案化导电层。
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公开(公告)号：US20150118457A1
公开(公告)日：2015-04-30
申请号：US14407480
申请日：2013-06-10
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ranjith Divigalpitiya , Mikhail L. Pekurovsky , Shawn C. Dodds
CPC classification number: B05D1/327 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , H01B13/0036 , H01L29/1606 , Y10T428/24802 , Y10T428/24893
Abstract: A method of forming an article is provided. The method can include providing a substrate comprising a surface. The method can further include forming a solvent soluble layer on or over the surface of the substrate in a pattern, the pattern defining one or more first portions of the surface that are overlaid by the solvent soluble layer, and one or more second portions of the surface that are free of the solvent soluble layer. The method can further include forming a second layer on or over at least one of the first portions and at least one of the second portions, wherein the step of forming the second layer includes buffing an exfoliatable material on or over at least one of the first portions and at least one of the second portions. The method can further include removing the solvent soluble layer by applying a solvent to the substrate.
Abstract translation: 提供了一种形成物品的方法。 该方法可以包括提供包括表面的基底。 所述方法还可以包括以图案形式在基材表面上或上方形成溶剂可溶层，所述图案限定由溶剂可溶层覆盖的表面的一个或多个第一部分，以及所述表面的一个或多个第二部分 表面没有溶剂可溶层。 该方法还可以包括在第一部分和第二部分中的至少一个上至少一个上形成第二层，其中形成第二层的步骤包括在第一部分和/或第二部分中的至少一个上或之上抛光可剥离材料 部分和至少一个第二部分。 该方法还可以包括通过向基材施加溶剂来除去溶剂可溶层。
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公开(公告)号：US20210106937A1
公开(公告)日：2021-04-15
申请号：US17053079
申请日：2019-05-06
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Austin D. Groth , Derek M. Maanum , Reyad A. Abdulqader , Shawn C. Dodds , Ann M. Gilman , Duane D. Fansler , Britton G. Billingsley
IPC: B01D46/00 , B01D46/24 , B01D39/14 , B01J20/20 , B01J20/28 , B32B5/02 , B32B7/12 , B32B5/16 , B32B5/24 , B32B5/32
Abstract: Various embodiments of a filter cartridge are disclosed. The filter cartridge includes a first filter media layer having first and second major surfaces, a second filter media layer having first and second major surfaces, and a plenum disposed between the first and second filter media layers. The filter cartridge further includes functional material disposed on the first major surface of each of the first and second filter media layers within a filter region of the filter cartridge, where the functional material includes active particles disposed on an adhesive layer; and a perimeter seal region that defines at least a portion of a perimeter of the filter cartridge, where at least the first and second filter media layers are connected together in the perimeter seal region. The functional material is not disposed in at least a portion of the perimeter seal region.
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公开(公告)号：US10971468B2
公开(公告)日：2021-04-06
申请号：US16461015
申请日：2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gilman , Shawn C. Dodds , Thomas J. Metzler , Matthew R. D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00 , H01L23/498 , B81C3/00 , H01L23/544
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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公开(公告)号：US10773275B2
公开(公告)日：2020-09-15
申请号：US16063460
申请日：2016-12-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Evan D. Brutinel , Jon E. Dable , Shawn C. Dodds , Ann M. Gilman , Matthew R. D. Smith , Matthew S. Stay , Eric A. Vandre
Abstract: Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to adhesively bond the particles to a pressure-sensitive adhesive surface of the substrate.
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