公开(公告)号：US20190081258A1

公开(公告)日：2019-03-14

申请号：US15765596

申请日：2016-09-21

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Yu SHOJI ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: H01L51/05 ,  C08L79/08 ,  C08K5/13 ,  G03F7/075 ,  G03F7/20

Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

公开(公告)号：US20190025697A1

公开(公告)日：2019-01-24

申请号：US16084496

申请日：2017-03-24

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yohei KIUCHI ,  Yu SHOJI ,  Kimio ISOBE

IPC: G03F7/037 ,  G03F7/075

Abstract: A photosensitive resin composition which is excellent in chemical resistance and electrical insulation property and which can form a cured relief pattern having a cross-sectional shape of a forward taper after curing is provided. The present invention is a photosensitive resin composition, comprising an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B), wherein the (meth)acryl group-containing compound (B) comprises a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by the general Formula (1), which is a condensate of compounds having a structure represented by the general Formula (1) and at least one structure selected from the general Formula (2-1), the general Formula (2-2), and the general Formula (2-3), and the compound (B1) has a weight average molecular weight of 1,000 to 20,000. (wherein in the general Formula (1), R1 is a hydrogen atom or a methyl group. m is an integer in a range of 1≤m≤4. The symbol * indicates a binding site. In the general Formulas (2-1), (2-2) and (2-3), R2 is a methyl group or an ethyl group. n is an integer in a range of 1≤n≤4. The symbol * indicates a binding site.)

公开(公告)号：US20190004423A1

公开(公告)日：2019-01-03

申请号：US16063893

申请日：2017-01-10

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/023 ,  G03F7/022 ,  G03F7/40 ,  C08G73/22

Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

公开(公告)号：US20180203353A1

公开(公告)日：2018-07-19

申请号：US15744676

申请日：2016-09-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/038 ,  C08G69/02 ,  C08G69/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/00

CPC classification number: G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.