公开(公告)号：US20190025697A1

公开(公告)日：2019-01-24

申请号：US16084496

申请日：2017-03-24

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yohei KIUCHI ,  Yu SHOJI ,  Kimio ISOBE

IPC: G03F7/037 ,  G03F7/075

Abstract: A photosensitive resin composition which is excellent in chemical resistance and electrical insulation property and which can form a cured relief pattern having a cross-sectional shape of a forward taper after curing is provided. The present invention is a photosensitive resin composition, comprising an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B), wherein the (meth)acryl group-containing compound (B) comprises a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by the general Formula (1), which is a condensate of compounds having a structure represented by the general Formula (1) and at least one structure selected from the general Formula (2-1), the general Formula (2-2), and the general Formula (2-3), and the compound (B1) has a weight average molecular weight of 1,000 to 20,000. (wherein in the general Formula (1), R1 is a hydrogen atom or a methyl group. m is an integer in a range of 1≤m≤4. The symbol * indicates a binding site. In the general Formulas (2-1), (2-2) and (2-3), R2 is a methyl group or an ethyl group. n is an integer in a range of 1≤n≤4. The symbol * indicates a binding site.)

公开(公告)号：US20170327644A1

公开(公告)日：2017-11-16

申请号：US15529408

申请日：2015-11-19

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Yohei KIUCHI ,  Ryoji OKUDA

IPC: C08G73/10 ,  G03F7/039 ,  H01L21/78 ,  H01L23/00 ,  G03F7/32 ,  H01L21/027 ,  C09D179/08 ,  G03F7/022 ,  G03F7/075 ,  G03F7/16 ,  G03F7/20 ,  G03F7/40

CPC classification number: G03F7/039 ,  C08G69/42 ,  C08G73/10 ,  C08G73/1064 ,  C09D179/08 ,  G03F7/022 ,  G03F7/0233 ,  G03F7/075 ,  G03F7/0755 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L21/027 ,  H01L21/0274 ,  H01L21/78 ,  H01L24/02 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/13024

Abstract: Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).