公开(公告)号：US20240239988A1

公开(公告)日：2024-07-18

申请号：US18408733

申请日：2024-01-10

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Hiroki HORIGOME

IPC: C08K3/22 ,  C08G73/10 ,  C08K3/36 ,  H01L23/29

CPC classification number: C08K3/22 ,  C08G73/10 ,  C08K3/36 ,  H01L23/295 ,  C08K2003/2206 ,  C08K2003/2227 ,  C08K2003/2237

Abstract: Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, is superior in low warpage property, and has a high relative permittivity and a low dielectric tangent. The encapsulation resin composition of the present invention contains:



(A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule;
(B) a reaction initiator;
(C) a high-relative permittivity inorganic filler having a relative permittivity of not lower than 10 at 1 MHz, the inorganic filler (C) being an inorganic filler other than the following component (D); and
(D) silica particles and/or alumina particles.

公开(公告)号：US11904533B2

公开(公告)日：2024-02-20

申请号：US16737626

申请日：2020-01-08

Applicant: The Boeing Company

Inventor： Nishant Sinha

IPC: B29C64/00 ,  B29C64/153 ,  C08G73/10 ,  C08J7/04 ,  B29C64/30 ,  B29C64/205 ,  B22F12/00 ,  B33Y50/00 ,  B29C64/393 ,  B29C64/10 ,  B33Y80/00 ,  B33Y40/10 ,  B29C64/176 ,  B33Y40/20 ,  B33Y50/02 ,  B29C64/307 ,  B05D5/08 ,  B22F10/85 ,  B29C64/227 ,  B33Y30/00 ,  B01D67/00 ,  B29C64/245 ,  B33Y99/00 ,  B29C64/25 ,  B29C64/255 ,  B22F10/00 ,  B29C64/182 ,  B33Y40/00 ,  B29C64/40 ,  B29C64/386 ,  B29C64/20 ,  B22F12/82 ,  B33Y10/00 ,  B33Y70/00 ,  B29K29/00 ,  B29K279/00 ,  G03F7/00

CPC classification number: B29C64/153 ,  B01D67/00045 ,  B01D67/00415 ,  B05D5/083 ,  B22F10/00 ,  B22F10/85 ,  B22F12/00 ,  B22F12/82 ,  B29C64/00 ,  B29C64/10 ,  B29C64/176 ,  B29C64/182 ,  B29C64/20 ,  B29C64/205 ,  B29C64/227 ,  B29C64/245 ,  B29C64/25 ,  B29C64/255 ,  B29C64/30 ,  B29C64/307 ,  B29C64/386 ,  B29C64/393 ,  B29C64/40 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y80/00 ,  B33Y99/00 ,  C08G73/10 ,  C08J7/04 ,  B29K2029/04 ,  B29K2279/08 ,  B33Y10/00 ,  B33Y70/00 ,  C08J2329/04 ,  C08J2379/08 ,  G03F7/70416 ,  G03G2215/2054 ,  G05B2219/49023 ,  G05B2219/49246 ,  H05K2201/015 ,  Y10T156/1722 ,  Y10T156/1798

Abstract: A coated powder for use in additive manufacturing includes a base polymer layer formed of a base polymer material and a coating polymer layer formed of a coating polymer material. At least the coating polymer material is susceptible to dielectric heating in response to electromagnetic radiation, thereby promoting fusion between adjacent particles of coated powder that are deposited during the additive manufacturing process. Specifically, when electromagnetic radiation is applied to at least an interface area between adjacent particles of coated powder, the polymer coating layer melts to diffuse across the interface area, thereby preventing formation of voids. The base polymer material and the coating polymer material also may have similar melting points and compatible solubility parameters to further promote fusion between particles.

公开(公告)号：US20230407021A1

公开(公告)日：2023-12-21

申请号：US18034983

申请日：2021-11-02

Applicant: PI Advanced Materials Co., Ltd.

Inventor： Dong-Young KIM ,  Dae-Geon YOO ,  Dong-Young WON

IPC: C08J5/18 ,  C08G73/10

CPC classification number: C08J5/18 ,  C08G73/10 ,  C08J2379/08

Abstract: The present invention provides: a polyimide film having excellent dimensional stability; and a method for manufacturing same, wherein the polyimide film has a coefficient of thermal expansion of 1 ppm/° C. to 5 ppm/° C., an elastic modulus of 9 GPa to 11.5 GPa, and a glass transition temperature of 340° C. to 400° C.

公开(公告)号：US20230312828A1

公开(公告)日：2023-10-05

申请号：US18031734

申请日：2021-10-01

Applicant: Arisawa MFG. Co., Ltd.

Inventor： Yoshinori Sato ,  Hiroyuki Matsuyama ,  Yoshihiko Konno

IPC: C08G73/10 ,  H05K1/03

CPC classification number: C08G73/10 ,  H05K1/0346 ,  H05K2201/0154

Abstract: A polyimide resin precursor is obtained by allowing a diamine and an acid anhydride to react with each other. The diamine includes p-phenylenediamine, a bis(aminophenoxy)benzene, and 2-(4-aminophenyl)benzoxazol-5-amine. The acid anhydride includes a biphenyl tetracarboxylic dianhydride. The content of the p-phenylenediamine is 30 to 75% by mol, the content of the bis(aminophenoxy)benzene is 10 to 30% by mol, and the content of the 2-(4-aminophenyl)benzoxazol-5-amine is 10 to 50% by mol, with respect to the total of the diamine. The content of the biphenyl tetracarboxylic dianhydride is 78% by mol or more with respect to the total of the acid anhydride.

公开(公告)号：US20230303773A1

公开(公告)日：2023-09-28

申请号：US18020130

申请日：2021-07-21

Applicant: EASTMAN CHEMICAL COMPANY

Inventor： IGOR TOKAREV ,  CORY JAMES FLYNN ,  MONIKA KARIN WIEDMANN BOGGS ,  KARA DAWN GARRETT

IPC: C08G73/10 ,  C08J7/044 ,  C08J7/04 ,  C08J5/18 ,  C09D5/24 ,  C09D1/00

CPC classification number: C08G73/10 ,  C08J5/18 ,  C08J7/0423 ,  C08J7/044 ,  C09D1/00 ,  C09D5/24 ,  C08J2379/08

Abstract: Transparent, conductive barrier films are disclosed that include a polymeric substrate; an optional planarization layer, atop the polymeric substrate, and at least one dyad, atop the optional planarization layer if present, or atop the polymeric substrate, that comprises an inorganic oxide layer, and a polymethylglutarimide layer. The films of the invention are further provided with a conductive layer, atop the at least one dyad.

公开(公告)号：US20230213858A1

公开(公告)日：2023-07-06

申请号：US18184697

申请日：2023-03-16

Applicant: FUJIFILM Corporation

Inventor： Misaki TAKASHIMA ,  Kazuto SHIMADA ,  Atsuyasu NOZAKI ,  Naoki SATO

IPC: G03F7/038 ,  G03F7/42 ,  G03F7/32 ,  C08G73/10 ,  C08G73/22 ,  H01L21/027

CPC classification number: G03F7/0387 ,  G03F7/422 ,  G03F7/32 ,  C08G73/10 ,  C08G73/22 ,  H01L21/0274

Abstract: A manufacturing method for a cured substance includes a film forming step of applying a specific photosensitive resin composition onto a base material to form a film, an exposure step of selectively exposing the film, a development step of developing the exposed film with a developer to form a pattern, a treatment step of bringing a treatment liquid into contact with the pattern, and a heating step of heating the pattern after the treatment step, in which at least one of the developer or the treatment liquid contains at least one compound selected from the group consisting of a base and a base generator.

公开(公告)号：US11692066B2

公开(公告)日：2023-07-04

申请号：US16850099

申请日：2020-04-16

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Daisuke Kori ,  Keisuke Niida ,  Takashi Sawamura ,  Takeru Watanabe ,  Seiichiro Tachibana ,  Tsutomu Ogihara

IPC: C08G73/10 ,  G03F7/09 ,  G03F7/004 ,  G03F7/16

CPC classification number: C08G73/10 ,  G03F7/0045 ,  G03F7/162 ,  G03F7/168 ,  G03F7/094

Abstract: An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent,




noting that in the general formula (1A), when W1 represents any of





R1 does not represent any of

公开(公告)号：US20190185481A1

公开(公告)日：2019-06-20

申请号：US16305981

申请日：2017-06-19

Applicant: King Abdullah University of Science and Technology

Inventor： Xiaohua MA ,  Ingo PINNAU

IPC: C07D487/08 ,  B01D71/64 ,  C08G73/10 ,  B01D53/22

CPC classification number: C07D487/08 ,  B01D53/228 ,  B01D67/0006 ,  B01D71/64 ,  B01D2325/02 ,  C08G73/10 ,  C08G73/1014 ,  C08G73/1075

Abstract: Embodiments of the present disclosure provide compounds derived by Troger's amine as shown below, microporous structures, membranes, methods of making said compounds, structures, and membranes, methods of use for gas separation, and the like (Formula A1).

公开(公告)号：US20190100499A1

公开(公告)日：2019-04-04

申请号：US16112847

申请日：2018-10-11

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Lingli DUAN ,  Chen CHEN ,  Shaoguang FENG ,  Zhkhra I. NIAZIMBETOVA ,  Maria Anna RZEZNIK

IPC: C07D265/33 ,  C07D413/12 ,  C25D7/00 ,  C25D7/12 ,  C07D241/04 ,  C09D179/08 ,  C25D3/32 ,  C08G73/10 ,  C08G73/02 ,  C25D3/38

CPC classification number: C07D265/33 ,  C07D241/04 ,  C07D413/12 ,  C08G73/028 ,  C08G73/0293 ,  C08G73/10 ,  C09D179/08 ,  C25D3/32 ,  C25D3/38 ,  C25D7/00 ,  C25D7/123

Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

公开(公告)号：US20180355172A1

公开(公告)日：2018-12-13

申请号：US15778800

申请日：2016-11-25

Applicant: KANEKA CORPORATION

Inventor： Mari UNO

IPC: C08L79/08 ,  C08K3/36 ,  B32B7/02 ,  B32B27/28 ,  C08G73/10

CPC classification number: C08L79/08 ,  B32B7/02 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2457/08 ,  B32B2457/12 ,  B32B2457/20 ,  B82Y30/00 ,  C08G73/10 ,  C08G73/1007 ,  C08G73/1078 ,  C08K3/36

Abstract: Provided are a nanosilica-containing polyamide acid and a nanosilica-containing polyimide. The nanosilica-containing polyamide acid contains a polyamide acid, which is a polymer of an alicyclic tetracarboxylic acid dianhydride and an aromatic diamine containing a carboxyl group, and nanosilica, and is excellent in heat resistance, low thermal expansion and transparency, and exhibits low double refraction. Also provided is a product or a member that meets requirements of high heat resistance and high transparency by using the nanosilica-containing polyamide acid and the nanosilica-containing polyimide.