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公开(公告)号：CN1180929A
公开(公告)日：1998-05-06
申请号：CN97111464.1
申请日：1997-05-30
申请人： 三菱电机株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05669 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/4554 , H01L2224/45669 , H01L2224/4807 , H01L2224/48091 , H01L2224/48247 , H01L2224/48451 , H01L2224/48453 , H01L2224/48465 , H01L2224/48505 , H01L2224/48507 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48669 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48769 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48869 , H01L2224/73265 , H01L2224/78301 , H01L2224/85099 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/15747 , H01L2924/20106 , H01L2924/20107 , H01L2924/20303 , H01L2924/20753 , Y10S228/904 , H01L2924/00012 , H01L2224/78 , H01L2924/00
摘要： 目的在于提高微小丝焊焊接部的可靠性。在金属球3b接触压焊区2后,将第1键合压力大幅度地提高到120gf,在金属丝3a与压焊区2的接合界面处使其相互迅速产生塑性流动。接着将第2键合压力控制为40gf的低值,以确保与焊接核6a有关的金属球3b与压焊区2的接触。其次,超声振动施加后,以10～20gf施加第3键合压力约10ms,能够均匀地生长出多个岛状焊接部6b。最后,以25～40gf施加第4键合压力约3～5ms,这样就能形成带状焊接部7。
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公开(公告)号：CN105140136B
公开(公告)日：2018-02-13
申请号：CN201510438605.3
申请日：2010-03-11
申请人： 高通股份有限公司
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18
CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要： 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
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公开(公告)号：CN102903694B
公开(公告)日：2017-09-08
申请号：CN201210263016.2
申请日：2012-07-26
申请人： 英飞凌科技股份有限公司
IPC分类号： H01L23/495 , H01L21/60 , H01L29/40
CPC分类号： H01L24/73 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/02166 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05553 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/2732 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/37147 , H01L2224/3716 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/85439 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/30107 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/00012 , H01L2924/01023 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/00 , H01L2224/05552 , H01L2924/01005
摘要： 本发明涉及在一个面上具有两层金属层的功率半导体芯片。该半导体芯片包括具有多个有源晶体管元件的功率晶体管电路。第一负载电极和控制电极布置在半导体芯片的第一面上，其中，第一负载电极包括第一金属层。第二负载电极布置在半导体芯片的第二面上。第二金属层布置在第一金属层上方，其中第二金属层与功率晶体管电路电绝缘，第二金属层布置在功率晶体管电路的包括多个有源晶体管元件中的至少一个的区域的上方。
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公开(公告)号：CN104205315A
公开(公告)日：2014-12-10
申请号：CN201380015827.3
申请日：2013-03-12
申请人： 住友电木株式会社
发明人： 伊藤慎吾
IPC分类号： H01L21/60
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/3171 , H01L23/4952 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48869 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2924/00014 , H01L2924/01047 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/01204 , H01L2924/01205 , H01L2924/01203 , H01L2924/01056 , H01L2924/0102 , H01L2924/01038 , H01L2924/01004 , H01L2924/01013 , H01L2924/00015 , H01L2924/01016 , H01L2924/01017 , H01L2924/20752 , H01L2924/013 , H01L2924/20751 , H01L2924/20753 , H01L2224/4554
摘要： 本发明提供一种耐湿性和高温保存特性优异的半导体装置。半导体装置具有包括芯片焊盘部和内引线部的引线框作为基板，该半导体装置还具有：搭载于芯片焊盘部的半导体元件；设置于半导体元件的电极焊盘；将设置于基板的内引线部和电极焊盘连接的铜线；和封装半导体元件和铜线的封装树脂。在深度方向上距离与铜线的接合面至少3μm以下的范围内的电极焊盘的区域，含有离子化倾向比铝小的金属作为主要成分，铜线中的硫含量相对于铜线整体为15ppm以上100ppm以下。
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公开(公告)号：CN103843133A
公开(公告)日：2014-06-04
申请号：CN201280039935.X
申请日：2012-07-03
申请人： 联达科技控股有限公司
发明人： P·E·罗根
IPC分类号： H01L23/498 , H01L23/495
CPC分类号： H01L21/4828 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48669 , H01L2224/48684 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48869 , H01L2224/48884 , H01L2224/73265 , H01L2224/85207 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/85464 , H01L2224/85469 , H01L2224/85484 , H01L2224/92247 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： 一种引线载体，在制造期间为半导体器件提供支撑。该引线载体包括具有多个封装位点的临时支撑部件。每一个封装位点包括被多个端子垫包围的管芯附接垫。这些垫在下部分上由可熔固定材料形成。芯片被安装在管芯附接垫上，并且，接合线从芯片延伸到端子垫。垫、芯片和接合线全部被封装在模制化合物内。临时支撑部件可以被加热到高于可熔固定材料的熔化温度，并且被剥离掉，然后，可以将各个封装位点相互隔离，以提供包括用于安装在电子系统板内的多个表面安装接头的完整的封装。
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公开(公告)号：CN102867804A
公开(公告)日：2013-01-09
申请号：CN201210236310.4
申请日：2012-07-06
申请人： 英飞凌科技股份有限公司
发明人： 拉尔夫·奥特伦巴
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/32245 , H01L2224/33181 , H01L2224/35831 , H01L2224/37011 , H01L2224/37147 , H01L2224/3716 , H01L2224/4007 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/83986 , H01L2224/84801 , H01L2224/92147 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2224/48227 , H01L2924/00 , H01L2924/01005
摘要： 本发明公开了一种包括具有突出体的接触片的半导体器件及其制造方法。该半导体器件包括：具有晶片焊垫和第一引线的引线框、具有第一电极的半导体芯片、以及具有第一接触区和第二接触区的接触片。半导体芯片置于晶片焊垫之上。第一接触区置于第一引线之上，以及第二接触区置于半导体芯片的第一电极之上。多个突出体从各第一接触区和第二接触区延伸，并且每个突出体具有至少5μm的高度。
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公开(公告)号：CN102379037A
公开(公告)日：2012-03-14
申请号：CN201080015041.8
申请日：2010-03-11
申请人： 米辑电子股份有限公司
IPC分类号： H01L23/522 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/00 , H01L25/065 , H01L25/18
CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要： 本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
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公开(公告)号：CN1921085A
公开(公告)日：2007-02-28
申请号：CN200610090120.0
申请日：2006-06-23
申请人： 米辑电子股份有限公司
IPC分类号： H01L21/768 , H01L21/60 , H01L21/28 , H01L23/52 , H01L23/48
CPC分类号： H01L23/5227 , H01L21/2885 , H01L21/563 , H01L21/76801 , H01L21/76885 , H01L23/3114 , H01L23/5223 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05173 , H01L2224/05176 , H01L2224/05183 , H01L2224/05548 , H01L2224/05571 , H01L2224/05572 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/1147 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45173 , H01L2224/45176 , H01L2224/45183 , H01L2224/48091 , H01L2224/48463 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/83101 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2224/48869 , H01L2224/83851 , H01L2224/05552 , H01L2224/05599
摘要： 本发明涉及一种线路组件结构制造方法及其结构，该方法包括提供一基板，在该基板上设置至少第一金属柱及第二金属柱，此第一金属柱的最大横向尺寸除以第一金属柱及第二金属柱高度的比值小于4，且第一金属柱的高度介于20微米至300微米之间，且第一金属柱的中心点至第二金属柱的中心点之间的距离介于10微米至250微米之间。本发明因可将金属柱体之间距缩小至250微米以下，且可达到针孔数目少于400个的目标。并能有效改善集成电路的性能，且可大幅降低低电源IC组件的IC金属连接线路的阻抗及荷载。
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公开(公告)号：CN1832159A
公开(公告)日：2006-09-13
申请号：CN200510112677.5
申请日：2005-10-13
申请人： 台湾积体电路制造股份有限公司
IPC分类号： H01L23/522
CPC分类号： H01L23/53238 , H01L24/05 , H01L2224/05083 , H01L2224/05144 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05176 , H01L2224/05181 , H01L2224/05184 , H01L2224/05644 , H01L2224/05655 , H01L2224/05657 , H01L2224/05664 , H01L2224/05669 , H01L2224/05676 , H01L2224/05681 , H01L2224/05684 , H01L2224/45124 , H01L2224/45147 , H01L2224/48744 , H01L2224/48755 , H01L2224/48757 , H01L2224/48764 , H01L2224/48769 , H01L2224/48781 , H01L2224/48784 , H01L2224/48844 , H01L2224/48855 , H01L2224/48857 , H01L2224/48864 , H01L2224/48869 , H01L2224/48881 , H01L2224/48884 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2224/48 , H01L2924/00011
摘要： 本发明提供一种半导体元件，其包括：一具有开口的介电层；一铜基第一金属层，填满该介电层的该开口并具有一上表面；以及一第一导电性高分子，覆盖该铜基第一金属层的该上表面。本发明还提供一种半导体元件，其包括：一铜基金属层，埋设于一介电层并具有一上表面；一导电性高分子，覆盖该铜基金属层的该上表面；以及一铝基金属垫，设置于该导电性高分子上。该导电性高分子夹置于两金属层间，可作为粘着层，阻障层或活化晶种层。该导电性高分子可包覆铜连线结构以避免铜扩散至其上层，以及增加铜与其上层的附着力。
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公开(公告)号：CN103843133B
公开(公告)日：2017-10-27
申请号：CN201280039935.X
申请日：2012-07-03
申请人： 联达科技控股有限公司
发明人： P·E·罗根
IPC分类号： H01L23/498 , H01L23/495
CPC分类号： H01L21/4828 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48669 , H01L2224/48684 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48869 , H01L2224/48884 , H01L2224/73265 , H01L2224/85207 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/85464 , H01L2224/85469 , H01L2224/85484 , H01L2224/92247 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： 一种引线载体，在制造期间为半导体器件提供支撑。该引线载体包括具有多个封装位点的临时支撑部件。每一个封装位点包括被多个端子垫包围的管芯附接垫。这些垫在下部分上由可熔固定材料形成。芯片被安装在管芯附接垫上，并且，接合线从芯片延伸到端子垫。垫、芯片和接合线全部被封装在模制化合物内。临时支撑部件可以被加热到高于可熔固定材料的熔化温度，并且被剥离掉，然后，可以将各个封装位点相互隔离，以提供包括用于安装在电子系统板内的多个表面安装接头的完整的封装。
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