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公开(公告)号：CN103918076B
公开(公告)日：2016-11-16
申请号：CN201380003722.6
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K1/09 , H01L23/142 , H01L23/3735 , H01L23/49582 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/0271 , H05K1/05 , H05K1/181 , H05K3/3431 , H05K2201/10166 , H05K2201/1028 , H05K2201/1031 , H05K2201/10409 , H05K2201/10946 , H05K2201/10962 , Y02P70/611 , Y02P70/613 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： 半导体模块(30)具有通过焊锡(34b、34c)使形成于晶体管裸芯片(35)的上表面的电极(S、G)和多个布线图案(33a～33d)中的布线图案(33b、33c)接合的铜连接器(36a、36b)。铜连接器(36bb)具有与晶体管裸芯片(35)的电极(G)接合的电极接合部(36bb)和与电极接合部(36bb)以相对置的方式而配置的、与布线图案(33c)接合的基板接合部(36bc)。电极接合部(36bb)的与单向正交的方向上的宽度W1比基板接合部(36bb)的与单向正交的方向上的宽度W2窄。
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公开(公告)号：CN103918066B
公开(公告)日：2016-08-24
申请号：CN201380003701.4
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H01L23/49551 , B62D5/0406 , H01L23/49524 , H01L23/49562 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40106 , H01L2224/40159 , H01L2224/40225 , H01L2224/4103 , H01L2224/41175 , H01L2224/73263 , H01L2224/77272 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84095 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/92246 , H01L2224/92247 , H01L2924/014 , H01L2924/13055 , H01L2924/1306 , H01L2924/15724 , H01L2924/19041 , H01L2924/19105 , H01L2924/351 , H01L2924/00 , H01L2924/1305 , H01L2924/00012 , H01L2924/00014
摘要： 提供了一种在实现缩短制造节拍的和降低制造成本的同时能够确保接合部的可靠性的半导体模块。半导体模块(30)具有：金属制的基板(31)；形成于基板(31)之上的绝缘层(32)；形成于绝缘层(32)上的多个布线图案(33a～33d)；通过焊锡(34a)封装于布线图案(33a)的晶体管裸芯片(35)；以及通过焊锡(34b、34c)使晶体管裸芯片(35)的电极(S，G)和布线图案(33b、33c)接合的铜连接器(36a、36b)。铜连接器(36a、36b)是桥形，在与电极(S，G)接合的接合面(36af)附近设置窄幅部(36ag)，并且在与电极(S，G)接合的接合面(36af)设置应力缓和部(36ak)。
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公开(公告)号：CN103930981B
公开(公告)日：2016-07-13
申请号：CN201380003694.8
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： 提供了一种在实现缩短制造节拍和降低制造成本的同时能够提高组装性的半导体模块。半导体模块(30)具备：金属制的基板(31)；形成于基板(31)之上的绝缘层(32)；形成于绝缘层(32)上的多个布线图案(33a～33d)；通过焊锡(34a)封装于布线图案(33a)上的晶体管裸芯片(35)；以及通过焊锡(34b、34c)使晶体管裸芯片(35)的电极(S、G)上和布线图案(33b、33c)上接合的金属板连接器(36a、36b)。金属板连接器(36a、36b)是桥形，在部件中央部具有平整面和重心。
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公开(公告)号：CN103930981A
公开(公告)日：2014-07-16
申请号：CN201380003694.8
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00 , H01L2224/8302
摘要： 提供了一种在实现缩短制造节拍和降低制造成本的同时能够提高组装性的半导体模块。半导体模块(30)具备：金属制的基板(31)；形成于基板(31)之上的绝缘层(32)；形成于绝缘层(32)上的多个布线图案(33a～33d)；通过焊锡(34a)封装于布线图案(33a)上的晶体管裸芯片(35)；以及通过焊锡(34b、34c)使晶体管裸芯片(35)的电极(S、G)上和布线图案(33b、33c)上接合的金属板连接器(36a、36b)。金属板连接器(36a、36b)是桥形，在部件中央部具有平整面和重心。
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公开(公告)号：CN105765715B
公开(公告)日：2018-08-03
申请号：CN201480064539.1
申请日：2014-07-31
申请人： 三菱电机株式会社
发明人： 田屋昌树
IPC分类号： H01L25/07 , H01L21/60 , H01L21/607 , H01L23/28 , H01L25/18
CPC分类号： H01L23/053 , H01L21/4853 , H01L23/24 , H01L23/293 , H01L23/3142 , H01L23/3735 , H01L23/49811 , H01L23/49844 , H01L23/535 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L25/07 , H01L25/18 , H01L2224/04026 , H01L2224/05624 , H01L2224/05647 , H01L2224/291 , H01L2224/32227 , H01L2224/35847 , H01L2224/37005 , H01L2224/37011 , H01L2224/37012 , H01L2224/37032 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40137 , H01L2224/40245 , H01L2224/4046 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48245 , H01L2224/73263 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84205 , H01L2224/84447 , H01L2224/85447 , H01L2924/00014 , H01L2924/00015 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/35121 , H01L2924/00 , H01L2224/48 , H01L2924/014 , H01L2924/00012 , H01L2924/207 , H01L2924/2076
摘要： 本发明得到提高制造成品率并且确保稳定的接合强度来提高可靠性的功率模块。种功率模块,具备:基体材料部(3),在个面形成电极部(4);导体部(5),与该基体材料部(3)的形成有电极部(4)的个面对置地配置,并与外部电连接;以及布线部(7),接合到形成于基体材料部(3)的个面的电极部(4)和导体部(5)的与基体材料部(3)的个面对置的面,对电极部(4)和导体部(5)进行电连接。
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公开(公告)号：CN106783786A
公开(公告)日：2017-05-31
申请号：CN201611144761.X
申请日：2016-12-13
申请人： 苏州和林微纳科技有限公司
IPC分类号： H01L23/492 , H01L21/48
CPC分类号： H01L2224/97 , H01L24/37 , H01L24/35 , H01L2224/352 , H01L2224/35825 , H01L2224/37011
摘要： 本发明揭示了一种用于CPU引线的产品预制件及其加工方法，包括一金属料带，所述金属料带设置有至少两个用于对产品预制件进行定位的定位孔，所述金属料带上还设置有至少两个用于对产品预制件进行选镀的选镀区；所述定位孔等间距地分布于所述选镀区的两侧；所述选镀区为矩阵排布，相邻的两个选镀区横向间距为2mm，相邻的两个选镀区纵向间距为2mm。该技术方案可杜绝产品预制件在选镀时电镀液流入产品凹槽产生溢镀，选镀包裹材料可重复使用，产品预制件选镀成型后选镀尺寸稳定精度高等特点，产品预制件选镀合格率百分之百，极大程度上节约了制造成本。
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公开(公告)号：CN104821303A
公开(公告)日：2015-08-05
申请号：CN201410302823.X
申请日：2014-06-30
申请人： 株式会社东芝
发明人： 宫川毅
IPC分类号： H01L23/495 , H01L23/31
CPC分类号： H01L23/49537 , H01B1/02 , H01B5/00 , H01L23/3107 , H01L23/49503 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49568 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/291 , H01L2224/29147 , H01L2224/29294 , H01L2224/29339 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37012 , H01L2224/37013 , H01L2224/37147 , H01L2224/40245 , H01L2224/40499 , H01L2224/4103 , H01L2224/41051 , H01L2224/73263 , H01L2224/83143 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84143 , H01L2224/84801 , H01L2224/84815 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要： 本发明涉及连接器框架以及半导体装置。连接器框架具备框架部、从所述框架部突出并一体地设置于所述框架部的第1连接器、以及从所述框架部突出并一体地设置于所述框架部的第2连接器。所述第1连接器具有第1部分、和设置于所述第1部分与所述框架部之间且比所述第1部分薄的第2部分。所述第2连接器的厚度与所述第1连接器的所述第2部分相同。
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公开(公告)号：CN103367313A
公开(公告)日：2013-10-23
申请号：CN201310100325.2
申请日：2013-03-26
申请人： 英飞凌科技股份有限公司
IPC分类号： H01L23/522 , H01L21/768
CPC分类号： H01L21/76877 , H01L21/76816 , H01L23/13 , H01L23/3107 , H01L23/4334 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49833 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/04034 , H01L2224/04105 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/224 , H01L2224/24011 , H01L2224/2402 , H01L2224/24105 , H01L2224/24155 , H01L2224/24175 , H01L2224/24246 , H01L2224/244 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29294 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32225 , H01L2224/32245 , H01L2224/35 , H01L2224/352 , H01L2224/3701 , H01L2224/37113 , H01L2224/37118 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37164 , H01L2224/37169 , H01L2224/40095 , H01L2224/40155 , H01L2224/40175 , H01L2224/40245 , H01L2224/40499 , H01L2224/41171 , H01L2224/48155 , H01L2224/48175 , H01L2224/49171 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83447 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84447 , H01L2224/92244 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/07811 , H01L2924/01028 , H01L2924/00012 , H01L2924/01023 , H01L2224/45099
摘要： 本申请提供了一种电子装置及制造电子装置的方法，该电子装置包括第一芯片承载件和与所述第一芯片承载件分隔的第二芯片承载件。第一功率半导体芯片安装在所述第一芯片承载件上并且与其电连接。第二功率半导体芯片安装在所述第二芯片承载件上并且与其电连接。电绝缘材料配置成至少部分地包围所述第一功率半导体芯片和所述第二功率半导体芯片。将电互连装置配置成电连接所述第一功率半导体芯片和所述第二功率半导体芯片，其中，所述电互连装置具有接触夹和电流沉积导体中的至少一个。
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公开(公告)号：CN102867804A
公开(公告)日：2013-01-09
申请号：CN201210236310.4
申请日：2012-07-06
申请人： 英飞凌科技股份有限公司
发明人： 拉尔夫·奥特伦巴
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/32245 , H01L2224/33181 , H01L2224/35831 , H01L2224/37011 , H01L2224/37147 , H01L2224/3716 , H01L2224/4007 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/83986 , H01L2224/84801 , H01L2224/92147 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2224/48227 , H01L2924/00 , H01L2924/01005
摘要： 本发明公开了一种包括具有突出体的接触片的半导体器件及其制造方法。该半导体器件包括：具有晶片焊垫和第一引线的引线框、具有第一电极的半导体芯片、以及具有第一接触区和第二接触区的接触片。半导体芯片置于晶片焊垫之上。第一接触区置于第一引线之上，以及第二接触区置于半导体芯片的第一电极之上。多个突出体从各第一接触区和第二接触区延伸，并且每个突出体具有至少5μm的高度。
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公开(公告)号：CN100418217C
公开(公告)日：2008-09-10
申请号：CN02808408.X
申请日：2002-04-17
申请人： 株式会社东芝
IPC分类号： H01L23/495 , H01L21/60 , H01L21/607
CPC分类号： H01L24/84 , H01L23/49524 , H01L23/49562 , H01L24/29 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/77 , H01L24/83 , H01L24/85 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/2919 , H01L2224/37011 , H01L2224/37124 , H01L2224/37147 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/7865 , H01L2224/8319 , H01L2224/83801 , H01L2224/84205 , H01L2224/84801 , H01L2224/8485 , H01L2224/85205 , H01L2224/85895 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01039 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： 提供一种半导体器件，包括：具有多个电极的半导体元件；引线框架的多个键合部分；电连接多个电极的至少之一和多个键合部分之一的板状电流通路部件；以及将具有多个电极的半导体元件、引线框架的多个键合部分和电流通路材料封装起来的外壳，其中板状电流通路材料设置成直接键合到多个电极之一和多个键合部分之一上，并且电流通路部件的中间部分与半导体元件的表面隔开。还提供一种半导体器件的制造方法。
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