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公开(公告)号:CN105514076A
公开(公告)日:2016-04-20
申请号:CN201410552488.9
申请日:2014-10-17
申请人: 兴勤电子工业股份有限公司
IPC分类号: H01L23/49
CPC分类号: H01L2224/4918
摘要: 本发明提供了一种平躺式电子元件,该平躺式电子元件包含有一芯片元件、二电极层、二引脚及一绝缘层。该二电极层分别设置于该芯片元件的两相对表面,而该二引脚的一端分别弯折后,各别平贴焊接于该二电极层,且该二引脚的另一端共同朝向该芯片元件的轴向弯折。该绝缘层则包覆该二电极层、该二引脚与该电极层焊接的一端及该芯片元件。当该平躺式电子元件焊接至一印刷电路板时,该芯片元件便可平躺与该印刷电路板上,以缩小该印刷电路板的整体体积。
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公开(公告)号:CN102074640A
公开(公告)日:2011-05-25
申请号:CN200910224245.1
申请日:2009-11-25
申请人: 台湾应解股份有限公司
发明人: 吴嘉泯
CPC分类号: H01L33/54 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/4918 , H01L2924/18165 , H01L2924/00012 , H01L2924/00014
摘要: 一种发光二极管模块,包括基板、发光二极管、第一封装件以及第二透光封装件。基板具有第一表面、第二表面、电路层以及开孔,其中开孔贯穿第一表面和第二表面,且电路层包括至少一个设置于第一表面的第一导电接点。发光二极管设置于开孔,并与第一导电接点电性连接。第一封装件以及第二透光封装件分别设置于基板的第一表面和第二表面,以封装发光二极管和第一导电接点。上述发光二极管模块可从发光二极管的背面出光,因此,可改善发光二极管模块的出光效率。同时,也公开一种上述发光二极管模块的制造方法。
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公开(公告)号:CN101071810A
公开(公告)日:2007-11-14
申请号:CN200710102279.4
申请日:2007-05-09
申请人: 株式会社瑞萨科技
IPC分类号: H01L25/00 , H01L25/065 , H01L25/18 , H01L23/488
CPC分类号: H01L25/0657 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/80 , H01L24/83 , H01L24/85 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/4918 , H01L2224/83121 , H01L2224/85399 , H01L2225/06506 , H01L2225/0651 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/78 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: 关于可以在功能上直接连接的电极焊盘之间的互连,提供了可以有助于模块衬底小型化的半导体器件。进行了叠置的第一半导体芯片和第二半导体芯片以与模块衬底之间中心位置相互左右偏离的方式安装在模块衬底上。在从偏离的半导体芯片的边缘到模块衬底的边缘的距离较短的一侧上,第一半导体芯片上的电极焊盘和相互对应的第二半导体芯片上的电极焊盘利用导线直接连接。在从偏离的半导体芯片的边缘到模块衬底的边缘的距离较长的一侧上,第一半导体芯片上的电极焊盘和第二半导体芯片上的电极焊盘利用导线与模块衬底上对应的键合引线相结合。
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公开(公告)号:CN105514076B
公开(公告)日:2018-08-17
申请号:CN201410552488.9
申请日:2014-10-17
申请人: 兴勤电子工业股份有限公司
IPC分类号: H01L23/49
CPC分类号: H01L2224/4918
摘要: 本发明提供了一种平躺式电子元件,该平躺式电子元件包含有一芯片元件、二电极层、二引脚及一绝缘层。该二电极层分别设置于该芯片元件的两相对表面,而该二引脚的一端分别弯折后,各别平贴焊接于该二电极层,且该二引脚的另一端共同朝向该芯片元件的轴向弯折。该绝缘层则包覆该二电极层、该二引脚与该电极层焊接的一端及该芯片元件。当该平躺式电子元件焊接至一印刷电路板时,该芯片元件便可平躺与该印刷电路板上,以缩小该印刷电路板的整体体积。
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公开(公告)号:CN101919071A
公开(公告)日:2010-12-15
申请号:CN200880015935.X
申请日:2008-03-22
申请人: 旭明光电股份有限公司
IPC分类号: H01L33/00
CPC分类号: H01L33/501 , H01L33/0079 , H01L33/44 , H01L33/508 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4918 , H01L2924/01021 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: 一种垂直型发光二极管(light emitting diode,LED)包含:一金属基底;一连接于该金属基底的p型电极;一连接于该p型电极的p型接点(面);一连接于该p型电极的p型GaN部分;一连接于该p型GaN部分的活性区域;一连接于该活性区域的n型GaN部分;以及一连接于该n型GaN的荧光体层。
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公开(公告)号:CN101652858A
公开(公告)日:2010-02-17
申请号:CN200880008401.4
申请日:2008-03-17
申请人: 马维尔国际贸易有限公司
发明人: 塞哈特·苏塔迪嘉
IPC分类号: H01L23/482 , H01L27/092 , H01L23/538
CPC分类号: H01L23/50 , H01L21/823475 , H01L21/823871 , H01L23/142 , H01L23/367 , H01L23/4824 , H01L23/49541 , H01L23/49838 , H01L23/544 , H01L24/16 , H01L24/40 , H01L24/49 , H01L2224/16 , H01L2224/16245 , H01L2224/4918 , H01L2224/83801 , H01L2224/84801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 一种集成电路包括N个平面状金属层,其中N是大于1的整数。第一平面状金属层包括分别与N个平面状金属层通信的M个触点部分,其中M是大于1的整数。第一平面状金属层和N个平面状金属层位于分开的平面中。第一源极、第一漏极和第二源极中的至少两个与N个平面状金属层中的至少两个通信。第一栅极被布置在第一源极和第一漏极之间。第二栅极被布置在第一漏极和第二源极之间。第一和第二栅极在第一漏极中限定交替的第一和第二区域,并且其中第一和第二栅极在第一区域中被布置地比在第二区域中更远离开。
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公开(公告)号:CN1380665A
公开(公告)日:2002-11-20
申请号:CN02106079.7
申请日:2002-04-09
申请人: 株式会社村田制作所
CPC分类号: H01G4/228 , H01C1/144 , H01L23/4827 , H01L41/0477 , H01L2224/4847 , H01L2224/4918
摘要: 一种陶瓷电子元件,它包括陶瓷体、形成于陶瓷体上的端电极、和将端电极与含Sn的焊料相连的引线端子。各端电极包括形成于陶瓷体上的第一电极层和形成于第一电极层上的第二电极层。第二电极层含有至少含Zn、Ag和/或Cu和Sn的导电成分。第二电极层中的Zn含量相对于100重量%的导电成分约不小于4重量%,并在不形成AgZn和/或CuZn金属互化物的溶解度极限内。
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公开(公告)号:CN105140136A
公开(公告)日:2015-12-09
申请号:CN201510438605.3
申请日:2010-03-11
申请人: 高通股份有限公司
IPC分类号: H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18
CPC分类号: G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231 , H01L24/10
摘要: 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装,其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案,所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构,例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
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公开(公告)号:CN102379037B
公开(公告)日:2015-08-19
申请号:CN201080015041.8
申请日:2010-03-11
申请人: 高通股份有限公司
IPC分类号: H01L23/522 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/00 , H01L25/065 , H01L25/18
CPC分类号: G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要: 本发明揭示集成电路芯片和芯片封装,其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案,所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构,例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
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公开(公告)号:CN101228640B
公开(公告)日:2012-05-30
申请号:CN200680002125.1
申请日:2006-01-09
申请人: 美商旭明国际股份有限公司
IPC分类号: H01L33/00 , H01L29/26 , H01L21/00 , H01L31/12 , H01L23/495
CPC分类号: H01L33/505 , H01L33/0079 , H01L33/44 , H01L33/641 , H01L2224/48091 , H01L2224/4918 , H01L2924/01019 , H01L2924/01021 , H01L2924/12041 , H01L2924/00014
摘要: 一种垂直型发光二极管(LED)包含:金属基板;连接于该金属基板的p型电极;连接于该p型电极的p型接点(面),该p型接点(面)包含反光器;连接于该p型电极的p型GaN部分;连接于该p型GaN部分的活性区域;连接于该活性区域的n型GaN部分,该n型GaN部分具有一光滑及平坦的表面;以及涂布于该n型GaN的该光滑及平坦的表面上的荧光体层。
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