The invention provides a lying-type electronic component. The lying-type electronic component comprises a chip component, two electrode layers, two pins and an insulation layer. The electrode layers are respectively arranged on two opposite surfaces of the chip component. After being bent, ends of the pins are welded to the electrode layers respectively in a flatly attached manner, and the other ends are axially bent towards the chip component together. The insulation layer covers the electrode layers, the pins, the ends welded to the electrode layers, and the chip component. When the lying-type electronic component is welded to a printed circuit board, the chip component can lie on the printed circuit board, so the overall size of the printed circuit board is reduced.