Patent search cpc:"H01L2924/0134" Page 1

1.

发明授权
电子设备、固态成像装置及制造用于该设备的电极的方法有权

公开(公告)号：CN104103760B

公开(公告)日：2018-04-06

申请号：CN201410143904.X

申请日：2014-04-10

Applicant: 索尼公司

Inventor： 森胁俊贵 , 宇高融

IPC: H01L51/44 , H01L27/30

CPC classification number: H01L31/0224 , H01L27/14665 , H01L31/022466 , H01L31/022475 , H01L31/035209 , H01L2924/0134

Abstract: 本发明公开了电子设备、固态成像装置及制造用于该设备的电极的方法。所述电子设备包括：第一电极、第二电极和被夹持在所述第一电极和所述第二电极之间的光电变换层，所述第一电极包括非晶氧化物，所述非晶氧化物由铟、镓和/或铝、锌和氧的至少四元化合物构成，以及所述第二电极的功函数值与所述第一电极的功函数值之间的差为0.4eV以上。

2.

发明授权
高温焊锡和高温焊锡膏材料以及功率半导体装置失效复审申请

公开(公告)号：CN1978122B

公开(公告)日：2011-07-20

申请号：CN200610164237.9

申请日：2006-12-05

Applicant: 株式会社日立制作所

Inventor： 梶原良一 , 伊藤和利

IPC: B23K35/26 , B23K35/02 , H01L23/488

CPC classification number: C22C13/02 , B23K35/02 , B23K35/025 , B23K35/22 , B23K35/262 , B23K35/3006 , B23K35/302 , H01L23/49513 , H01L24/01 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/84 , H01L2224/0401 , H01L2224/05111 , H01L2224/05639 , H01L2224/05647 , H01L2224/13147 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/376 , H01L2224/40091 , H01L2224/40225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48747 , H01L2224/4911 , H01L2224/73265 , H01L2224/81065 , H01L2224/81075 , H01L2224/81097 , H01L2224/81805 , H01L2224/83065 , H01L2224/83075 , H01L2224/83097 , H01L2224/83203 , H01L2224/83211 , H01L2224/83447 , H01L2224/83455 , H01L2224/83801 , H01L2224/84801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/20108 , H01L2924/30105 , H01L2924/351 , Y10T428/12528 , Y10T428/12708 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929

Abstract: 提供一种使用了在大于等于280℃的耐热性、小于等于400℃时的接合性、焊锡的供给性、润湿性、高温保持可靠性以及温度循环可靠性方面优良的高温无铅焊锡材料的功率半导体装置。本发明的功率半导体装置由以Sn、Sb、Ag和Cu为主要构成元素、具有42wt％≤Sb/(Sn+Sb)≤48wt％、5wt％≤Ag＜20wt％、3wt％≤Cu＜10wt％且5wt％≤Ag+Cu≤25wt％的组成、剩下的部分由其它的不可避免的杂质元素构成的高温焊锡材料接合了半导体元件与金属电极构件。

3.

发明授权
电子器件失效转让

公开(公告)号：CN100578778C

公开(公告)日：2010-01-06

申请号：CN200610095821.3

申请日：2001-12-19

Applicant: 株式会社日立制作所

Inventor： 曾我太佐男 , 秦英惠 , 石田寿治 , 中塚哲也 , 冈本正英 , 三浦一真

IPC: H01L25/00 , H01L23/488 , H01L21/60 , H05K1/18 , H05K3/34 , B23K35/22

CPC classification number: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298

Abstract: 将含有作为金属颗粒的Cu等颗粒和作为焊锡颗粒的Sn颗粒的焊锡材料压延而形成的箔适用于温度分层焊接中的高温侧的锡焊，用这种锡焊方法获得的半导体器件、电子器件在机械特性等方面具有优良的可靠性。

4.

发明公开
倒装片安装方法及凸块形成方法失效

公开(公告)号：CN101156236A

公开(公告)日：2008-04-02

申请号：CN200680011434.5

申请日：2006-03-16

Applicant: 松下电器产业株式会社

Inventor： 北江孝史 , 中谷诚一 , 辛岛靖治 , 山下嘉久 , 一柳贵志

IPC: H01L21/60 , H05K3/34

CPC classification number: H01L24/16 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29299 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0264 , H05K2203/087 , H05K2203/1178 , Y02P70/613 , H01L2924/01031 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/00011 , H01L2924/00015 , H01L2924/066 , H01L2924/06 , H01L2924/0675 , H01L2924/0695 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556

Abstract: 在第1电子元件(2)上载置含有焊料粉(5a)和树脂(4)的焊料树脂组合物(6)，第1电子元件(2)的连接端子(3)和第2电子元件(8)的电极端子(7)相对置地配置，加热第1电子元件(2)和焊料树脂组合物以使从包含在第1电子元件(2)中的气体发生源(1)喷出气体，通过使气体(9a)在焊料树脂组合物(6)中对流，从而使焊料粉(5a)在焊料树脂组合物(6)中流动，使其自己集合在连接端子(3)及电极端子(7)上，从而使连接端子(3)及电极端子(7)电连接。由此，提供一种能够将以窄节距布线的半导体芯片的电极端子和电路基板的连接端子高连接可靠性地连接的倒装片安装方法、以及用于安装在电路基板上的凸块形成方法。

5.

发明公开
焊锡箔、半导体器件及电子器件失效转让

公开(公告)号：CN1482956A

公开(公告)日：2004-03-17

申请号：CN01821243.3

申请日：2001-12-19

Applicant: 株式会社日立制作所

Inventor： 曾我太佐男 , 秦英惠 , 石田寿治 , 中塚哲也 , 冈本正英 , 三浦一真

IPC: B23K35/14 , H01L21/52

CPC classification number: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298

Abstract: 将含有作为金属颗粒的Cu等颗粒和作为焊锡颗粒的Sn颗粒的焊锡材料压延而形成的箔适用于温度分层焊接中的高温侧的锡焊，用这种锡焊方法获得的半导体器件、电子器件在机械特性等方面具有优良的可靠性。

6.

发明公开
各向异性导电材料及包括其的电子装置有权

公开(公告)号：CN106486183A

公开(公告)日：2017-03-08

申请号：CN201610306096.3

申请日：2016-05-10

Applicant: 三星电子株式会社 , 延世大学校原州产学协力团

Inventor： 周建模 , 张元硕 , 郑灿文

IPC: H01B5/16 , H01B1/20

CPC classification number: H01L24/33 , H01B1/22 , H01L23/53276 , H01L23/5328 , H01L24/09 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29028 , H01L2224/29105 , H01L2224/29198 , H01L2224/2929 , H01L2224/29305 , H01L2224/29309 , H01L2224/29313 , H01L2224/29393 , H01L2224/29394 , H01L2224/29398 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/2957 , H01L2224/29691 , H01L2224/32225 , H01L2224/32227 , H01L2224/73204 , H01L2224/81026 , H01L2224/81193 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81801 , H01L2224/83101 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/01006 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/1426 , H01R4/04 , H01R13/2414 , H05K3/323 , H05K3/3436 , H05K2201/0224 , H05K2201/026 , H05K2201/0323 , H05K2201/10674 , H05K2203/0425 , H01L2924/01049 , H01L2924/0105 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/00 , H01B5/16 , H01B1/20

Abstract: 本公开涉及各向异性导电材料及包括其的电子装置。各向异性导电材料、包括各向异性导电材料的电子装置和/或制造电子装置的方法被提供。一种各向异性导电材料可以包括基体材料层中的多个颗粒。颗粒中的至少一些可以包括芯部分和覆盖芯部分的壳部分。芯部分可以包括在高于15℃且低于或等于约110℃或更低的温度处于液态的导电材料。例如，芯部分可以包括液态金属、低熔点焊料和纳米填料中的至少一种。壳部分可以包括绝缘材料。通过使用各向异性导电材料形成的接合部分可以包括从颗粒流出的芯部分，并且还可以包括金属间化合物。

7.

发明公开
一种贵金属复合线及其制备方法失效

公开(公告)号：CN105869703A

公开(公告)日：2016-08-17

申请号：CN201610370569.6

申请日：2016-05-30

Applicant: 秦斌 , 秦文烨

Inventor： 秦斌

IPC: H01B1/02 , H01B13/00 , H01L23/49 , H01L21/48

CPC classification number: H01B1/02 , H01B13/00 , H01L24/43 , H01L24/45 , H01L2224/4321 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45169 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2924/01024 , H01L2924/01026 , H01L2924/01045 , H01L2924/01046 , H01L2924/01077 , H01L2924/0134

Abstract: 本发明公开了一种贵金属复合线及其制备方法，其中的复合线包括内层线芯和包覆在线芯上的包覆外层，该包覆外层为镍合金层，内层线芯为贵金属线芯，两者复合形成贵金属复合线。在制备该贵金属复合线时，将镍合金原料制备成空心管坯；将贵金属原料制备成线芯；最后将线芯嵌入空心管坯中，并拉拔成贵金属复合线。本贵金属复合线，有效降低贵金属的使用量，大大降低生产成本；同时本贵金属复合线性能和使用寿命与单独用贵金属材料一致，能够很好的达到测电极中的使用要求工艺要求。