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公开(公告)号：CN1282286A
公开(公告)日：2001-01-31
申请号：CN98812250.2
申请日：1998-12-09
Applicant: 株式会社日立制作所
CPC classification number: H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2101/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
Abstract: 一种无Pb焊料连接结构和电子装置,该无Pb焊料连接结构具有足够高的连接强度,获得即使在随时间的推移的情况下仍保持稳定的界面,保持足够的浸润性和对纤维状结晶的抵抗性。特别是,无Pb焊料的特征在于:作为代表性的无Pb焊料的Sn－Ag－Bi与电极连接,该电极的表面上形成有Sn－Bi层。最好,按照重量百分比计,上述Sn－Bi层中的Bi浓度在1—20%的范围内,以便获得足够高的浸润性。当要求更加可靠的接缝时,在上述Sn－Bi层的下面形成Cu层,以便获得具有足够高的界面强度的连接部。
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公开(公告)号：CN100578778C
公开(公告)日：2010-01-06
申请号：CN200610095821.3
申请日：2001-12-19
Applicant: 株式会社日立制作所
CPC classification number: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
Abstract: 将含有作为金属颗粒的Cu等颗粒和作为焊锡颗粒的Sn颗粒的焊锡材料压延而形成的箔适用于温度分层焊接中的高温侧的锡焊，用这种锡焊方法获得的半导体器件、电子器件在机械特性等方面具有优良的可靠性。
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公开(公告)号：CN1482956A
公开(公告)日：2004-03-17
申请号：CN01821243.3
申请日：2001-12-19
Applicant: 株式会社日立制作所
CPC classification number: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
Abstract: 将含有作为金属颗粒的Cu等颗粒和作为焊锡颗粒的Sn颗粒的焊锡材料压延而形成的箔适用于温度分层焊接中的高温侧的锡焊，用这种锡焊方法获得的半导体器件、电子器件在机械特性等方面具有优良的可靠性。
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公开(公告)号：CN1873971A
公开(公告)日：2006-12-06
申请号：CN200610095821.3
申请日：2001-12-19
Applicant: 株式会社日立制作所
CPC classification number: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
Abstract: 将含有作为金属颗粒的Cu等颗粒和作为焊锡颗粒的Sn颗粒的焊锡材料压延而形成的箔适用于温度分层焊接中的高温侧的锡焊，用这种锡焊方法获得的半导体器件、电子器件在机械特性等方面具有优良的可靠性。
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公开(公告)号：CN1449029A
公开(公告)日：2003-10-15
申请号：CN03101963.3
申请日：2003-01-30
Applicant: 株式会社日立制作所
CPC classification number: H05K3/3452 , H01L2224/16225 , H05K3/3442 , H05K2201/0989 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2203/0588 , Y02P70/611 , Y02P70/613
Abstract: 本发明是关于电路基板、电子机器、以及前述电路基板和电子机器的制造方法。本发明的电路基板具有和芯片组件的电极相连的第1电极和第2电极、以及在对应该第1电极和该第2电极的位置形成开口部的第1绝缘层，该第1绝缘层的开口部的形状，至少在该第1电极的边缘部和该第2电极的边缘部当中，位于该芯片组件下方区域不被该第1绝缘层覆盖。
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Patent Agency Ranking
公开(公告)号：CN1298051C
公开(公告)日：2007-01-31
申请号：CN02128644.2
申请日：1998-12-09
Applicant: 株式会社日立制作所
CPC classification number: H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2101/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
Abstract: 一种无Pb焊料连接结构和半导体装置，该无Pb焊料连接结构具有足够高的连接强度，获得即使在随时间的推移的情况下仍保持稳定的界面，保持足够的浸润性和对纤维状结晶的抵抗性。特别是，无Pb焊料的特征在于：作为代表性的无Pb焊料的Sn-Ag-Bi与电极连接，该电极的表面上形成有Sn-Bi层。最好，按照重量百分比计，上述Sn-Bi层中的Bi浓度在1～20%的范围内，以便获得足够高的浸润性。当要求更加可靠的接缝时，在上述Sn-Bi层的下面形成Cu层，以便获得具有足够高的界面强度的连接部。
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公开(公告)号：CN1269612C
公开(公告)日：2006-08-16
申请号：CN01821243.3
申请日：2001-12-19
Applicant: 株式会社日立制作所
CPC classification number: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
Abstract: 将含有作为金属颗粒的Cu等颗粒和作为焊锡颗粒的Sn颗粒的焊锡材料压延而形成的箔适用于温度分层焊接中的高温侧的锡焊，用这种锡焊方法获得的半导体器件、电子器件在机械特性等方面具有优良的可靠性。
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公开(公告)号：CN1505137A
公开(公告)日：2004-06-16
申请号：CN02128644.2
申请日：1998-12-09
Applicant: 株式会社日立制作所
CPC classification number: H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2101/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
Abstract: 一种无Pb焊料连接结构和半导体装置，该无Pb焊料连接结构具有足够高的连接强度，获得即使在随时间的推移的情况下仍保持稳定的界面，保持足够的浸润性和对纤维状结晶的抵抗性。特别是，无Pb焊料的特征在于：作为代表性的无Pb焊料的Sn－Ag－Bi与电极连接，该电极的表面上形成有Sn－Bi层。最好，按照重量百分比计，上述Sn－Bi层中的Bi浓度在1～20％的范围内，以便获得足够高的浸润性。当要求更加可靠的接缝时，在上述Sn－Bi层的下面形成Cu层，以便获得具有足够高的界面强度的连接部。
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公开(公告)号：CN1897789A
公开(公告)日：2007-01-17
申请号：CN200610101633.7
申请日：1998-12-09
Applicant: 株式会社日立制作所
IPC: H05K1/09 , H01L23/482
CPC classification number: H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2101/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
Abstract: 一种无Pb焊料连接结构和半导体装置，该无Pb焊料连接结构具有足够高的连接强度，获得即使在随时间的推移的情况下仍保持稳定的界面，保持足够的浸润性和对纤维状结晶的抵抗性。特别是，无Pb焊料的特征在于：作为代表性的无Pb焊料的Sn－Ag－Bi与电极连接，该电极的表面上形成有Sn－Bi层。最好，按照重量百分比计，上述Sn－Bi层中的Bi浓度在1～20％的范围内，以便获得足够高的浸润性。当要求更加可靠的接缝时，在上述Sn－Bi层的下面形成Cu层，以便获得具有足够高的界面强度的连接部。
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公开(公告)号：CN1279612C
公开(公告)日：2006-10-11
申请号：CN03101963.3
申请日：2003-01-30
Applicant: 株式会社日立制作所
CPC classification number: H05K3/3452 , H01L2224/16225 , H05K3/3442 , H05K2201/0989 , H05K2201/09909 , H05K2201/10636 , H05K2201/10674 , H05K2203/0588 , Y02P70/611 , Y02P70/613
Abstract: 本发明的电路基板具有和芯片组件的电极相连的第1电极和第2电极、以及在对应该第1电极和该第2电极的位置形成开口部的第1绝缘层，该第1绝缘层的开口部的形状，至少在该第1电极的边缘部和该第2电极的边缘部当中，位于该芯片组件下方区域不被该第1绝缘层覆盖。
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