Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.