公开(公告)号：US09947640B2

公开(公告)日：2018-04-17

申请号：US14287065

申请日：2014-05-26

申请人： UNITED MICROELECTRONICS CORP.

发明人： Chien-Li Kuo

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L25/00 ,  H01L21/78 ,  H01L23/00 ,  H01L25/18 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16148 ,  H01L2224/16268 ,  H01L2224/32145 ,  H01L2224/32265 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48145 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/207 ,  H01L2924/00012

摘要： The present invention provides a method of manufacturing a package structure. An array chip including a plurality of first dies is provided. A wafer including a plurality of second dies is provided. A package step is carried out to package the array chip onto the wafer so as to electrically connect the first die and the second die. The present invention further provides a semiconductor wafer and a package structure.

公开(公告)号：US20170148705A1

公开(公告)日：2017-05-25

申请号：US15425614

申请日：2017-02-06

申请人： Infineon Techonologies Americas Corp.

发明人： Eung San Cho

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01F1/03 ,  H01L23/498 ,  H01F27/24 ,  H01L25/18 ,  H01L23/31

CPC分类号： H01L23/3675 ,  H01F1/0306 ,  H01F27/24 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/645 ,  H01L24/31 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/32265 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/41173 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/49173 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14252 ,  H01L2924/1426 ,  H01L2924/1427 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/19011 ,  H01L2924/19042 ,  H01L2924/19102 ,  H05K1/0209 ,  H05K1/165 ,  H05K1/181 ,  H05K1/184 ,  H05K1/185 ,  H05K2201/1003 ,  H05K2201/10166 ,  H01L2924/00014

摘要： A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.

公开(公告)号：US20170040271A1

公开(公告)日：2017-02-09

申请号：US15299525

申请日：2016-10-21

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： An-Jhih Su ,  Hsien-Wei Chen

IPC分类号： H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H01L25/00 ,  H01L21/3105 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/03 ,  H01L21/31053 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/01 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/83005 ,  H01L2224/92124 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00014

摘要： According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes: a chip having a plurality of joint pads; a component having a plurality of metal caps on one side and having a grinded surface on the other side, wherein the metal caps are in contact with the joint pads of the chip.

摘要翻译： 根据示例性实施例，提供半导体封装。 半导体封装包括：具有多个接头焊盘的芯片; 在一侧具有多个金属盖并且在另一侧具有磨削表面的部件，其中金属帽与芯片的接合焊盘接触。

公开(公告)号：US09530761B2

公开(公告)日：2016-12-27

申请号：US13597973

申请日：2012-08-29

申请人： Alan Roth ,  Eric Soenen ,  Chaohao Wang

发明人： Alan Roth ,  Eric Soenen ,  Chaohao Wang

IPC分类号： H05K7/00 ,  H01L25/16 ,  H05K1/18 ,  H01L23/00

CPC分类号： H02M3/158 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L28/10 ,  H01L28/40 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/29025 ,  H01L2224/2919 ,  H01L2224/32265 ,  H01L2224/4502 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0479 ,  H01L2924/048 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/10337 ,  H01L2924/10339 ,  H01L2924/10342 ,  H01L2924/10351 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14252 ,  H01L2924/1427 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H05K1/111 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00

摘要： A package system includes at least one active circuitry disposed over a substrate. A passivation structure is disposed over the at least one active circuitry. The passivation structure has at least one opening that is configured to expose at least one first electrical pad. At least one passive electrical component is disposed over the passivation structure. The at least one passive electrical component is electrically coupled with the at least one first electrical pad.

摘要翻译： 封装系统包括设置在衬底上的至少一个有源电路。 钝化结构设置在至少一个有源电路上。 钝化结构具有至少一个开口，其被配置为暴露至少一个第一电垫。 在钝化结构上方设置至少一个无源电组件。 所述至少一个无源电部件与所述至少一个第一电焊盘电耦合。

公开(公告)号：US20160261048A1

公开(公告)日：2016-09-08

申请号：US15155096

申请日：2016-05-16

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Yukie SUZUKI ,  Yasuyuki ARAI ,  Shunpei YAMAZAKI

IPC分类号： H01Q9/04 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/22

CPC分类号： H01Q9/0407 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L27/088 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01M10/0436 ,  H01M10/465 ,  H01M2220/30 ,  H01Q1/2208 ,  H01Q1/2283 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： It is an object to provide a wireless chip which can increase a mechanical strength, and a wireless chip with a high durability. A wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, and a conductive layer connecting the chip and the antenna. Further, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a sensor device, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the sensor device. Moreover, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a battery, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the battery.

摘要翻译： 本发明的目的是提供一种能够提高机械强度的无线芯片，以及具有高耐久性的无线芯片。 无线芯片包括具有场效应晶体管的晶体管，包含夹在导电层之间的电介质层的天线以及连接芯片和天线的导电层。 此外，无线芯片包括具有场效应晶体管的晶体管，包含夹在导电层之间的电介质层的天线，传感器装置，连接芯片和天线的导电层以及连接芯片和传感器的导电层 设备。 此外，无线芯片包括具有场效应晶体管的晶体管，包含夹在导电层之间的电介质层的天线，电池，连接芯片和天线的导电层以及连接芯片和电池的导电层。

公开(公告)号：US20160233188A1

公开(公告)日：2016-08-11

申请号：US14952958

申请日：2015-11-26

申请人： SMARTRAC TECHNOLOGY GmbH

发明人： Frank Kriebel ,  Carsten Nieland

IPC分类号： H01L23/00 ,  H01L23/66

CPC分类号： H01L24/16 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/95 ,  H01L2223/6677 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13599 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/2731 ,  H01L2224/27418 ,  H01L2224/278 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32265 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75348 ,  H01L2224/75349 ,  H01L2224/81005 ,  H01L2224/81014 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81206 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8149 ,  H01L2224/8181 ,  H01L2224/81898 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/206 ,  H01L2924/2064 ,  Y10T29/49018 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate. The rough surface can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

摘要翻译： 接触焊盘和基板之间的接触凸块可以包括可与基板的材料配合的粗糙表面。 粗糙表面可以增强接触件的接合强度，例如抗剪切力和张力，特别是对于柔性系统如智能卡。

公开(公告)号：US09350079B2

公开(公告)日：2016-05-24

申请号：US14269772

申请日：2014-05-05

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Yukie Suzuki ,  Yasuyuki Arai ,  Shunpei Yamazaki

IPC分类号： H01L29/00 ,  H01Q9/04 ,  G06K19/077 ,  H01Q1/22 ,  H01Q23/00

CPC分类号： H01Q9/0407 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L27/088 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01M10/0436 ,  H01M10/465 ,  H01M2220/30 ,  H01Q1/2208 ,  H01Q1/2283 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： It is an object to provide a wireless chip which can increase a mechanical strength, and a wireless chip with a high durability. A wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, and a conductive layer connecting the chip and the antenna. Further, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a sensor device, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the sensor device. Moreover, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a battery, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the battery.

摘要翻译： 本发明的目的是提供一种能够提高机械强度的无线芯片，以及具有高耐久性的无线芯片。 无线芯片包括具有场效应晶体管的晶体管，包含夹在导电层之间的电介质层的天线以及连接芯片和天线的导电层。 此外，无线芯片包括具有场效应晶体管的晶体管，包含夹在导电层之间的电介质层的天线，传感器装置，连接芯片和天线的导电层以及连接芯片和传感器的导电层 设备。 此外，无线芯片包括具有场效应晶体管的晶体管，包含夹在导电层之间的电介质层的天线，电池，连接芯片和天线的导电层以及连接芯片和电池的导电层。

公开(公告)号：US20150326221A1

公开(公告)日：2015-11-12

申请号：US14409848

申请日：2013-07-18

申请人： AISIN AW CO., LTD.

发明人： Hirohisa TOTANI

IPC分类号： H03K17/687

CPC分类号： H03K17/687 ,  H01G4/40 ,  H01L23/49822 ,  H01L25/07 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32265 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/40265 ,  H01L2224/73263 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00 ,  H01L2224/37099

摘要： A switching element unit is implemented which can include a smoothing capacitor while achieving reduction in overall size. A smoothing capacitor is a ceramic capacitor whose dielectric portions are formed of a ceramic material, and outer surfaces of the smoothing capacitor include an element placement surface formed integrally with the dielectric portions. A positive-side connection electrode P1 that is electrically connected to a positive terminal of the smoothing capacitor and a negative-side connection electrode that is electrically connected to a negative terminal of the smoothing capacitor are formed on the element placement surface. A switching element and a diode element which form a series element unit are placed over the element placement surface, a positive-side terminal portion of the series element unit is electrically connected to the positive-side connection electrode, and a negative-side terminal portion of the series element unit is electrically connected to the negative-side connection electrode.

摘要翻译： 实现开关元件单元，其可以包括平滑电容器，同时实现总体尺寸的减小。 平滑电容器是陶瓷电容器，其电介质部分由陶瓷材料形成，并且平滑电容器的外表面包括与电介质部分一体形成的元件放置表面。 在元件放置面上形成有与平滑电容器的正极电连接的正极侧连接电极P1和与平滑电容器的负极端子电连接的负极侧连接电极。 形成串联元件单元的开关元件和二极管元件放置在元件放置表面上，串联元件单元的正侧端子部分电连接到正侧连接电极，负极端子部分 串联元件单元电连接到负侧连接电极。

公开(公告)号：US20150221624A1

公开(公告)日：2015-08-06

申请号：US14422152

申请日：2013-01-09

申请人： SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. ,  SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

发明人： Ning Ye ,  Chin-Tien Chiu ,  Suresh Upadhyayula ,  Peng Fu ,  Zhong Lu ,  Cheeman Yu ,  Yuang Zhang ,  Li Wang ,  Pradeep Kumar Rai ,  Weili Wang ,  Enyong Tai ,  King Hoo Ong ,  Kim Lee Bock

IPC分类号： H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16

CPC分类号： H01L25/18 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/00 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83986 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/143 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

摘要翻译： 公开了一种包括多个堆叠半导体管芯的半导体封装以及形成半导体封装的方法。 为了减轻控制器管芯上的引线接合要求，控制器管芯可以以不需要引线键合或覆盖在控制器管芯外部的倒装芯片布置直接安装到衬底。 此后，可以在控制器管芯周围的衬底上固定隔离层，以提供安装一个或多个闪存管芯的水平表面。 间隔层可以以各种不同的构型设置。

公开(公告)号：US08783577B2

公开(公告)日：2014-07-22

申请号：US11885634

申请日：2006-03-09

申请人： Yukie Suzuki ,  Yasuyuki Arai ,  Shunpei Yamazaki

发明人： Yukie Suzuki ,  Yasuyuki Arai ,  Shunpei Yamazaki

IPC分类号： G06K19/06

CPC分类号： H01L24/32 ,  H01L21/6836 ,  H01L21/84 ,  H01L23/64 ,  H01L23/66 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/1214 ,  H01L27/1266 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/03002 ,  H01L2224/03009 ,  H01L2224/06181 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29464 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/32501 ,  H01L2224/33181 ,  H01L2224/83005 ,  H01L2224/83007 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/142 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/83

摘要： It is an object of the present invention to provide a wireless chip of which mechanical strength can be increased. Moreover, it is an object of the present invention to provide a wireless chip which can prevent an electric wave from being blocked. The invention is a wireless chip in which a layer having a thin film transistor is fixed to an antenna by an anisotropic conductive adhesive or a conductive layer, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer. The dielectric layer is sandwiched between the first conductive layer and the second conductive layer. The first conductive layer serves as a radiating electrode and the second conductive layer serves as a ground contact body.

摘要翻译： 本发明的目的是提供一种可以增加其机械强度的无线芯片。 此外，本发明的目的是提供一种能够防止电波被阻挡的无线芯片。 本发明是一种无线芯片，其中具有薄膜晶体管的层通过各向异性导电粘合剂或导电层固定到天线，并且薄膜晶体管连接到天线。 天线具有电介质层，第一导电层和第二导电层。 电介质层夹在第一导电层和第二导电层之间。 第一导电层用作辐射电极，第二导电层用作接地体。