公开(公告)号：US20160300988A1

公开(公告)日：2016-10-13

申请号：US15038042

申请日：2014-11-20

Applicant: LUMENS CO., LTD.

Inventor： Seung-Hyun OH ,  Sung-Sik JO ,  Jung-A LIM ,  Sung-Yole YUN ,  Ji-Yeon LEE ,  Bo-Young KIM

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L33/46 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/27312 ,  H01L2224/29015 ,  H01L2224/29019 ,  H01L2224/3015 ,  H01L2224/32227 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2924/15156 ,  H01L2933/0066

Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate having a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side thereof; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant molded and installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members.

Abstract translation: 本文公开了一种发光器件封装，背光单元，照明装置和制造能够用于显示应用或照明应用的发光器件封装的方法。 发光器件封装包括：倒装芯片型发光器件，其具有安装在其下的第一端子和第二端子; 具有形成在电极分离空间的一侧的第一电极和在其另一侧形成的第二电极的基板; 第一导电接合构件，其安装在所述基板的所述第一电极上，以便电连接到所述发光器件的第一端子; 安装在所述基板的所述第二电极上以与所述发光器件的第二端子电连接的第二导电接合部件; 模制并安装在所述基板上的反射密封剂，以形成反射在所述发光器件中产生的光的反射杯部分，并填充在所述电极分离空间中以形成电极分离部; 以及填充在反射杯部分和第一和第二导电接合部件之间的填料。

公开(公告)号：US20160254255A1

公开(公告)日：2016-09-01

申请号：US15150938

申请日：2016-05-10

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Motohito HORI ,  Yoshinari IKEDA

IPC: H01L25/11 ,  H01L23/00 ,  H01L23/16 ,  H01L23/40 ,  H01L23/492 ,  H01L23/498 ,  H01L23/538 ,  H01L23/367 ,  H01L23/049 ,  H01L23/31

CPC classification number: H01L25/115 ,  H01L23/049 ,  H01L23/053 ,  H01L23/15 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/48 ,  H01L23/4924 ,  H01L23/49805 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49866 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/07 ,  H01L25/18 ,  H01L2023/4087 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/16257 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/12032 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014 ,  H01L2224/48

Abstract: A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin.

Abstract translation: 功率半导体模块包括将壳体中的半导体元件的前表面电极和绝缘基板的电路板电连接的布线构件。 设置在壳体中的树脂覆盖布线构件，并且在布线构件附近具有高度。 覆盖外部端子周边的盖子设置在树脂和壳体中的第一盖子之间。 第二盖在壳体的开口部分中进一步设置在第一盖的外侧，并且第二盖和第一盖之间的空间填充有另一种树脂。

公开(公告)号：US09425176B2

公开(公告)日：2016-08-23

申请号：US14587916

申请日：2014-12-31

Applicant: National Taiwan University

Inventor： Jian-Jang Huang ,  Liang-Yu Su ,  Chih-Hao Wang

IPC: H01L25/18 ,  H01L23/498 ,  H01L25/07 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/32 ,  H01L24/45 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32227 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device comprises a substrate, a patterned conductive layer, a first transistor structure and a second transistor structure. The patterned conductive layer is formed on the substrate. The first transistor structure includes a first source, a first gate and a first drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The second transistor structure includes a second source, a second gate and a second drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The first gate is electrically connected to the second source through the patterned conductive layer, and the first source is electrically connected to the second drain through the patterned conductive layer.

Abstract translation: 半导体器件包括衬底，图案化导电层，第一晶体管结构和第二晶体管结构。 图案化导电层形成在基板上。 第一晶体管结构包括第一源极，第一栅极和第一漏极，并且通过倒装芯片接合与图案化的导电层电连接。 第二晶体管结构包括第二源极，第二栅极和第二漏极，并且通过倒装芯片接合与图案化导电层电连接。 第一栅极通过图案化的导电层电连接到第二源极，并且第一源极通过图案化的导电层电连接到第二漏极。

公开(公告)号：US20160240505A1

公开(公告)日：2016-08-18

申请号：US15024682

申请日：2014-11-11

Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION ,  WASEDA UNIVERSITY

Inventor： Kohei TATSUMI ,  Shinji ISHIKAWA ,  Norie MATSUBARA ,  Masamoto TANAKA

IPC: H01L23/00

CPC classification number: H01L24/32 ,  B22F7/08 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/28 ,  B23K35/30 ,  B23K35/3033 ,  C22C5/06 ,  C22C5/08 ,  C22C19/00 ,  C22C21/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2741 ,  H01L2224/29083 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2949 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/83055 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8384 ,  H01L2224/85207 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00015 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/0104 ,  H01L2924/01026 ,  H01L2924/01025 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/00012

Abstract: The present invention can give a joining structure using metal nanoparticles to join the same types or different types of metal where when one surface metal is Al based, the parts are joined through a joining layer containing Ni nanoparticles, whereby a good joining strength is obtained. Further, by using two joining layers (6, 8) including metal nanoparticles to sandwich metal foil (7) so as to form a joining layer and joining the same type or different types of surface metals (3-4) through this joining layer, it is possible to ease the thermal stress due to the difference in amounts of thermal expansion of joined members which have two surface metals.

Abstract translation: 本发明可以使用金属纳米粒子连接相同类型或不同类型的金属的接合结构，其中当一个表面金属为Al时，通过包含Ni纳米颗粒的接合层将部件接合，从而获得良好的接合强度。 此外，通过使用包含金属纳米颗粒的两个接合层（6,8）夹住金属箔（7）以形成接合层并通过该接合层接合相同类型或不同类型的表面金属（3-4） 由于具有两个表面金属的接合部件的热膨胀量的差异，可以减轻热应力。

公开(公告)号：US20160197023A1

公开(公告)日：2016-07-07

申请号：US15071195

申请日：2016-03-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HISAO TESHIMA

IPC: H01L23/31 ,  H01L23/528 ,  H01L29/78

CPC classification number: H01L23/3192 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/528 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L29/41716 ,  H01L29/41741 ,  H01L29/41766 ,  H01L29/732 ,  H01L29/7396 ,  H01L29/7397 ,  H01L29/7398 ,  H01L29/74 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7827 ,  H01L29/8611 ,  H01L2224/02371 ,  H01L2224/02381 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05001 ,  H01L2224/05111 ,  H01L2224/05113 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/0518 ,  H01L2224/05184 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05613 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05684 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/10145 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32105 ,  H01L2224/32227 ,  H01L2224/81143 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83907 ,  H01L2224/94 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/35121 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01051 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor layer, a first conductor film, a second conductor film, and a first protective film. The semiconductor layer has a semiconductor element. The first conductor film is formed on an upper surface of the semiconductor layer and is electrically. connected to the semiconductor element. The second conductor film is formed on an outer side surface of the semiconductor layer and is electrically connected to the semiconductor element. The first protective film is formed on the first conductor film and has an opening to expose the first conductor film. A height from the upper surface of the semiconductor layer to an upper surface of the second conductor film is equal to or smaller than a height from the upper surface of the semiconductor layer to an upper surface of the first conductor film.

Abstract translation: 半导体器件包括半导体层，第一导体膜，第二导体膜和第一保护膜。 半导体层具有半导体元件。 第一导体膜形成在半导体层的上表面上并且是电气的。 连接到半导体元件。 第二导体膜形成在半导体层的外侧表面上并与半导体元件电连接。 第一保护膜形成在第一导体膜上，并且具有露出第一导体膜的开口。 从半导体层的上表面到第二导体膜的上表面的高度等于或小于从半导体层的上表面到第一导体膜的上表面的高度。

公开(公告)号：US09378986B2

公开(公告)日：2016-06-28

申请号：US14511353

申请日：2014-10-10

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Seung Ho Park

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L21/563 ,  H01L21/4825 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/562 ,  H01L24/11 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/1134 ,  H01L2224/1183 ,  H01L2224/13144 ,  H01L2224/291 ,  H01L2224/32013 ,  H01L2224/32227 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/92227 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Provided is a method of mounting a chip. The method includes: forming a bump at one surface of a cavity formed concavely in an inner direction of a substrate; performing a coining process to flatten a surface of the bump; coating a solder material on the bump subjected to the coining process; and bonding a chip and the bump by melting the solder material, wherein an electrode portion or a metal portion is formed on a bottom of the chip. For a metal substrate according to the present invention, wherein a vertical insulating layer is included, since the electrode portion of the chip and the electrode portion of the substrate have to be electrically connected, the metal substrate is bonded to the electrode portion of the chip using the bump additionally formed on the metal substrate, so the heat generated in the chip can be rapidly transferred to the substrate, and the junction temperature of the chip can be decreased, thereby enhancing the light efficiency and the. In addition, cracking due to the difference of thermal expansion coefficient between solder materials can be prevented by sealing the bonding portion of the chip using the solder materials. Further, since oxidation of the bonding portion is prevented by blocking the contact with the outside, the chip packaging process can be performed without an additional process of filling an inert gas into the internal space wherein the chip is mounted.

Abstract translation: 提供了一种安装芯片的方法。 该方法包括：在衬底的内部方向上凹入地形成的空腔的一个表面上形成凸块; 执行压印工艺以平坦化凸块的表面; 在经过压印加工的凸块上涂覆焊料; 并且通过熔化焊料材料来接合芯片和凸块，其中在芯片的底部上形成电极部分或金属部分。 对于根据本发明的金属基板，其中包括垂直绝缘层，由于芯片的电极部分和基板的电极部分必须电连接，金属基板被接合到芯片的电极部分 使用另外形成在金属基板上的凸块，使得芯片中产生的热量可以快速转移到基板，并且可以降低芯片的结温，从而提高光效率。 此外，通过使用焊料材料密封芯片的接合部分，可以防止由于焊料材料之间的热膨胀系数的差异导致的破裂。 此外，由于通过阻挡与外部的接触来防止接合部的氧化，所以可以进行芯片封装处理，而不需要在安装芯片的内部空间中填充惰性气体的附加处理。

公开(公告)号：US09373653B2

公开(公告)日：2016-06-21

申请号：US14665084

申请日：2015-03-23

Applicant: Optiz, Inc.

Inventor： Vage Oganesian

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/73217 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/82106 ,  H01L2224/83101 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/15156 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/00

Abstract: An image sensor package includes a crystalline handler having opposing first and second surfaces, and a cavity formed into the first surface. At least one step extends from a sidewall of the cavity, wherein the cavity terminates in an aperture at the second surface. A cover is mounted to the second surface and extends over and covers the aperture. The cover is optically transparent to at least one range of light wavelengths. A sensor chip is disposed in the cavity and mounted to the at least one step. The sensor chip includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors.

Abstract translation: 图像传感器封装包括具有相对的第一和第二表面的结晶处理器和形成在第一表面中的空腔。 至少一个步骤从空腔的侧壁延伸，其中腔终止于第二表面处的孔中。 盖安装到第二表面并且延伸并覆盖孔。 该盖对于至少一个光波长范围是光学透明的。 传感器芯片设置在空腔中并安装在至少一个台阶上。 传感器芯片包括具有前后相对表面的基板，形成在前表面处的多个光电检测器，以及形成在前表面处的电耦合到光电检测器的多个接触焊盘。

公开(公告)号：US09330941B2

公开(公告)日：2016-05-03

申请号：US13469079

申请日：2012-05-10

Applicant: Shih-Hao Sun

Inventor： Shih-Hao Sun

IPC: H05K3/34 ,  H01L21/48 ,  H01L23/498 ,  H01L21/683 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/186 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A manufacturing method of a package carrier is provided. A supporting board having an upper surface which a patterned circuit layer formed thereon is provided. A portion of the upper surface is exposed by the patterned circuit layer. An insulating layer and a conducting layer located at a first surface of the insulating layer are laminated onto the patterned circuit layer. The patterned circuit layer and the exposed portion of the upper surface are covered by the insulating layer. Plural conductive connection structures are formed on the patterned circuit layer. Plural of pads respectively connecting the conductive connection structures and exposing a portion of the first surface of the insulating layer is defined by patterning the conductive layer. The supporting board is removed so as to expose a second surface of the insulating layer. The second surface and a bonding surface of the patterned circuit layer are coplanar.

Abstract translation: 提供了一种封装载体的制造方法。 提供具有形成在其上的图案化电路层的上表面的支撑板。 上表面的一部分被图案化电路层曝光。 位于绝缘层的第一表面的绝缘层和导电层被层叠在图案化电路层上。 图案化电路层和上表面的露出部分被绝缘层覆盖。 在图案化电路层上形成多个导电连接结构。 分别连接导电连接结构和暴露绝缘层的第一表面的一部分的多个焊盘通过图案化导电层来限定。 移除支撑板以暴露绝缘层的第二表面。 图案化电路层的第二表面和接合表面是共面的。

公开(公告)号：US09318475B2

公开(公告)日：2016-04-19

申请号：US14278778

申请日：2014-05-15

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L25/16 ,  H01L27/15 ,  G09F9/30 ,  H01L25/075 ,  H01L27/12 ,  H05K1/18

CPC classification number: H01L25/167 ,  G09F9/301 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81444 ,  H01L2224/81466 ,  H01L2224/81486 ,  H01L2224/8149 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83444 ,  H01L2224/83466 ,  H01L2224/83486 ,  H01L2224/8349 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/18161 ,  H01L2924/18162 ,  H05K1/189 ,  H05K3/4682 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0781 ,  H01L2924/01038 ,  H01L2924/053 ,  H01L2924/06 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01071 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

Abstract: A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.

Abstract translation: 描述了柔性显示面板及其形成方法。 柔性显示系统的制造方法包括在载体基板上形成牺牲层。 在牺牲层上形成柔性显示基板，其中多个释放开口延伸穿过柔性显示基板至牺牲层。 将LED阵列和多个微芯片转移到柔性显示基板上以形成柔性显示面板。 选择性地去除牺牲层，使得柔性显示面板通过多个支撑柱附接到载体基板。 柔性显示面板从载体基板移除并与显示部件电耦合以形成柔性显示系统。

公开(公告)号：US20160087179A1

公开(公告)日：2016-03-24

申请号：US14952294

申请日：2015-11-25

Applicant: Michael A. TISCHLER

Inventor： Michael A. TISCHLER

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/505 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/06102 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32227 ,  H01L2224/73104 ,  H01L2224/80001 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01014

Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.