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    Semiconductor probe pin
    2.
    外观设计
    Semiconductor probe pin 有权

    公开(公告)号：USD1030689S1

    公开(公告)日：2024-06-11

    申请号：US29858093

    申请日：2022-10-28

    Applicant: POINT ENGINEERING CO., LTD.

    Designer： Bum Mo Ahn

    Abstract: FIG. 1 is a perspective view of a semiconductor probe pin showing my new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top view thereof; and,
    FIG. 7 is a bottom view thereof.

    Probe head and probe card having same
    3.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11860192B2

    公开(公告)日：2024-01-02

    申请号：US17161460

    申请日：2021-01-28

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073

    CPC classification number: G01R1/07314

    Abstract: Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.

    Guide plate for probe card and probe card having same
    6.
    发明授权
    Guide plate for probe card and probe card having same 有权

    公开(公告)号：US11193955B2

    公开(公告)日：2021-12-07

    申请号：US16794147

    申请日：2020-02-18

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073

    Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

    Micro LED transfer head
    7.
    发明授权
    Micro LED transfer head 有权

    公开(公告)号：US11145788B2

    公开(公告)日：2021-10-12

    申请号：US16734175

    申请日：2020-01-03

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L33/00 ,  H01L33/64 ,  H01L25/075

    Abstract: The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

    Micro sensor
    8.
    发明授权
    Micro sensor 有权

    公开(公告)号：US10539526B2

    公开(公告)日：2020-01-21

    申请号：US15674463

    申请日：2017-08-10

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01N27/12

    Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.

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