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109 条记录 (耗时 0.027 秒)

    Probe head and probe card having same
    1.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11860192B2

    公开(公告)日：2024-01-02

    申请号：US17161460

    申请日：2021-01-28

    申请人： POINT ENGINEERING CO., LTD.

    发明人： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC分类号： G01R1/073

    CPC分类号： G01R1/07314

    摘要： Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.

    Guide plate for probe card and probe card having same
    4.
    发明授权
    Guide plate for probe card and probe card having same 有权

    公开(公告)号：US11193955B2

    公开(公告)日：2021-12-07

    申请号：US16794147

    申请日：2020-02-18

    申请人： POINT ENGINEERING CO., LTD.

    发明人： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC分类号： G01R1/073

    摘要： The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

    Micro LED transfer head
    5.
    发明授权
    Micro LED transfer head 有权

    公开(公告)号：US11145788B2

    公开(公告)日：2021-10-12

    申请号：US16734175

    申请日：2020-01-03

    申请人： POINT ENGINEERING CO., LTD.

    发明人： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC分类号： H01L33/00 ,  H01L33/64 ,  H01L25/075

    摘要： The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

    Micro sensor
    6.
    发明授权
    Micro sensor 有权

    公开(公告)号：US10539526B2

    公开(公告)日：2020-01-21

    申请号：US15674463

    申请日：2017-08-10

    申请人： POINT ENGINEERING CO., LTD.

    发明人： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC分类号： G01N27/12

    摘要： Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.

    Chip substrate provided with joining grooves in lens insert
    7.
    发明授权
    Chip substrate provided with joining grooves in lens insert 有权

    公开(公告)号：US10128414B2

    公开(公告)日：2018-11-13

    申请号：US14985275

    申请日：2015-12-30

    申请人： Point Engineering Co., Ltd.

    发明人： Seung Ho Park ,  Tae Hwan Song

    IPC分类号： H01L33/58 ,  H01L33/48 ,  H01L33/64

    摘要： A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.

    Capacitor
    10.
    发明授权
    Capacitor 有权

    公开(公告)号：US09773618B2

    公开(公告)日：2017-09-26

    申请号：US14831964

    申请日：2015-08-21

    申请人： POINT ENGINEERING CO., LTD.

    发明人： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC分类号： H01G4/30 ,  H01G4/12 ,  H01G4/38 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228

    CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/38

    摘要： The present invention relates to a capacitor. The capacitor includes a substrate; a dielectric layer formed on the substrate; and an electrode layer comprising a first electrode layer and a second electrode layer formed on the dielectric layer, wherein the first electrode layer and the second electrode layer are separated from each other, and at least a portion of the first electrode layer and at least a portion of the second electrode layer are disposed on a same surface. With this configuration, applying the electricity becomes easy, and since the first and the second electrode layers function as the electrodes being charged with different polarity electrical charges respectively, manufacturing thereof becomes easy, and the structure thereof is simple.