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    Probe head and probe card having same
    1.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11852656B2

    公开(公告)日：2023-12-26

    申请号：US17214785

    申请日：2021-03-26

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: G01R1/073

    CPC classification number: G01R1/07342

    Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

    Micro sensor package
    4.
    发明授权
    Micro sensor package 有权

    公开(公告)号：US10705064B2

    公开(公告)日：2020-07-07

    申请号：US15702666

    申请日：2017-09-12

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01G5/012 ,  G01N33/00 ,  G01N27/04

    Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.

    Light Engine for Light Emitting Element
    5.
    发明申请
    Light Engine for Light Emitting Element 审中-公开
    发光元件轻型发动机

    公开(公告)号：US20160334080A1

    公开(公告)日：2016-11-17

    申请号：US15142189

    申请日：2016-04-29

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: F21V15/00 ,  F21V29/70 ,  H05B33/08 ,  F21V23/06

    CPC classification number: H05B33/0815 ,  F21K9/00 ,  F21V23/005 ,  F21V29/70 ,  F21Y2115/10 ,  H05B33/0803 ,  H05K1/0209 ,  H05K2201/10106 ,  Y02B20/341

    Abstract: A light engine for a light emitting element includes an element substrate on which a plurality of light emitting elements is mounted, a plurality of circuit substrates connected to one another in an insulated state in order to apply a drive voltage to the light emitting elements and connected to the element substrate in an insulated state, and a plurality of protection substrates configured to surround the element substrate and the circuit substrates and to make contact with the element substrate and the circuit substrates in an insulated state.

    Abstract translation: 用于发光元件的光引擎包括其上安装有多个发光元件的元件基板，在绝缘状态下彼此连接的多个电路基板，以便向发光元件施加驱动电压并连接 绝缘状态的元件基板和多个保护基板，其被配置为围绕元件基板和电路基板，并且与绝缘状态的元件基板和电路基板接触。

    Chip substrate provided with joining grooves in lens insert
    6.
    发明授权
    Chip substrate provided with joining grooves in lens insert 有权

    公开(公告)号：US10128414B2

    公开(公告)日：2018-11-13

    申请号：US14985275

    申请日：2015-12-30

    Applicant: Point Engineering Co., Ltd.

    Inventor： Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/58 ,  H01L33/48 ,  H01L33/64

    Abstract: A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.

    Capacitor
    7.
    发明授权
    Capacitor 有权

    公开(公告)号：US09773618B2

    公开(公告)日：2017-09-26

    申请号：US14831964

    申请日：2015-08-21

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/38 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/38

    Abstract: The present invention relates to a capacitor. The capacitor includes a substrate; a dielectric layer formed on the substrate; and an electrode layer comprising a first electrode layer and a second electrode layer formed on the dielectric layer, wherein the first electrode layer and the second electrode layer are separated from each other, and at least a portion of the first electrode layer and at least a portion of the second electrode layer are disposed on a same surface. With this configuration, applying the electricity becomes easy, and since the first and the second electrode layers function as the electrodes being charged with different polarity electrical charges respectively, manufacturing thereof becomes easy, and the structure thereof is simple.

    Chip Substrate Comprising Cavity with Curved Surfaces
    9.
    发明申请
    Chip Substrate Comprising Cavity with Curved Surfaces 有权
    包括具有弯曲表面的腔的芯片衬底

    公开(公告)号：US20160095222A1

    公开(公告)日：2016-03-31

    申请号：US14866073

    申请日：2015-09-25

    Applicant: Point Engineering Co., Ltd.

    Inventor： Seung Ho Park ,  Tae Hwan Song ,  Sung Hyun Byun

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H05K1/05 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10106

    Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.

    Abstract translation: 芯片基板包括导电部分，绝缘部分和空腔。 导电部分沿一个方向层叠以构成芯片基板。 绝缘部分介于导电部分之间，以使导电部分电隔离。 在包括绝缘部分的区域中，在芯片基板的上表面上以预定的深度形成空腔。 空腔由具有预定曲率半径的多个连续延伸的弯曲表面限定。

    Heat Sink for Chip Mounting Substrate and Method for Manufacturing the Same
    10.
    发明申请
    Heat Sink for Chip Mounting Substrate and Method for Manufacturing the Same 审中-公开
    散热片用于芯片安装基板及其制造方法

    公开(公告)号：US20150117035A1

    公开(公告)日：2015-04-30

    申请号：US14511357

    申请日：2014-10-10

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: F21V29/70 ,  F21V19/00

    CPC classification number: F21V19/005 ,  F21V29/767 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate whereon a chip is mounted or to be mounted, and support or fix the accommodated substrate; and a heat dissipation portion configured to insulate the accommodated substrate, and dissipate heat generated from the substrate or the chip mounted on the substrate to an outside through a heat dissipation material contained in the heat dissipation portion. Accordingly, since the heat sink for a chip mounting substrate in which a heat dissipation material is embedded is manufactured by injection molding, a manufacturing process can be simplified. Further, since the heat sink of a single structure is used, a TIM bonding layer for bonding the substrate and the heat sink is not required, and an electrical insulating layer formed by anodizing an upper surface of the heat sink for electrical insulation between the substrate and the heat sink is not required, and thus the structure can be simplified.

    Abstract translation: 本发明提供一种嵌入散热材料的芯片安装基板用散热片。 散热器包括：容纳部分，其构造成容纳其中安装或要安装的芯片的基板，并且支撑或固定所容纳的基板; 以及散热部，其被配置为使所容纳的基板绝缘，并且通过包含在所述散热部中的散热材料将从所述基板或安装在所述基板上的所述芯片产生的热散发到外部。 因此，由于通过注射成型制造其中嵌入有散热材料的芯片安装基板的散热器，因此可以简化制造工艺。 此外，由于使用单一结构的散热器，不需要用于粘合基板和散热器的TIM接合层，并且通过阳极氧化散热器的上表面而形成的电绝缘层用于基板之间的电绝缘 并且不需要散热器，因此可以简化结构。

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