公开(公告)号：US11791104B2

公开(公告)日：2023-10-17

申请号：US16888650

申请日：2020-05-29

申请人： Pacesetter, Inc.

发明人： David Bowen ,  Ralph Jason Hemphill

IPC分类号： H01G9/00 ,  H01G9/04 ,  C25F3/02 ,  C25D11/20 ,  C25D11/24 ,  G01R27/26 ,  C25D11/12 ,  H01G9/045

CPC分类号： H01G9/0032 ,  C25D11/12 ,  C25D11/20 ,  C25D11/24 ,  C25F3/02 ,  G01R27/26 ,  H01G9/04 ,  H01G9/045

摘要： Fabricating an electrode for capacitor includes performing a first set of one or more preliminary oxide formation operations on a sheet of material. The method also includes performing a capacitance test on the sheet of material so as to determine the capacitance of the sheet of material after the one or more preliminary oxide formation operations. The method proceeds on a first path in response to a first result of the capacitance test and on a second path in response to a second result of the capacitance test. The first path includes performing a second set of the one or more preliminary oxide formation operations on the sheet of material so as to reduce the capacitance of the sheet of material below the determined capacitance. The second path excludes performing any preliminary oxide formation operations on the sheet of material.

公开(公告)号：US20180334755A1

公开(公告)日：2018-11-22

申请号：US15982356

申请日：2018-05-17

申请人： Campagnolo S.r.l.

发明人： Mirco CIVIERO ,  Paolo FABRIS

IPC分类号： C25D11/20 ,  B60B1/00 ,  C09D5/08 ,  C09D5/44 ,  C25D11/00 ,  B62M9/10

CPC分类号： C25D11/20 ,  B29K2027/18 ,  B60B1/003 ,  B60B2310/621 ,  B60B2900/141 ,  B62M9/00 ,  B62M9/04 ,  B62M9/105 ,  B62M2009/005 ,  C08J2327/18 ,  C09D5/086 ,  C09D5/4465 ,  C25D11/005 ,  C25D11/026 ,  C25D13/22

摘要： A bicycle gear having a first coating layer obtained by a plasma electrolytic oxidation treatment and a second coating layer, overlapped on the first coating layer, that is a lubricating substance, preferably a fluoropolymer.

公开(公告)号：US09828460B2

公开(公告)日：2017-11-28

申请号：US14416967

申请日：2013-07-25

申请人： SHOWA DENKO K.K.

发明人： Kazumi Naito ,  Shoji Yabe

IPC分类号： C25D9/02 ,  C25D11/20 ,  C08G61/12 ,  H01G9/028 ,  H01G9/00 ,  C25B3/00 ,  H01G9/15

CPC分类号： C08G61/126 ,  C08G61/124 ,  C08G2261/11 ,  C08G2261/18 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/3247 ,  C08G2261/44 ,  C08G2261/51 ,  C08G2261/90 ,  C25B3/00 ,  C25D9/02 ,  C25D11/20 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/15

摘要： A solid electrolytic capacitor is obtained by a method comprising dissolving a polymerizable material for being converted into a conductive polymer in a water-soluble organic solvent to obtain a solution, adding the solution to water while homogenizing the solution to obtain a sol, immersing an anode body having a dielectric layer in the surface of the anode body in the sol, and applying voltage using the anode body as a positive electrode and a counter electrode as a negative electrode placed in the sol to electropolymerize the polymerizable material. An electropolymerizable liquid for producing a conductive polymer, the liquid composed of a sol comprising water, a water-soluble organic solvent, and a polymerizable material for being converted into the conductive polymer.

公开(公告)号：US09799594B2

公开(公告)日：2017-10-24

申请号：US15219803

申请日：2016-07-26

申请人： FUJIFILM Corporation

发明人： Kosuke Yamashita

IPC分类号： H01L23/498 ,  H05K1/11 ,  H01L21/48 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03 ,  H05K3/36 ,  C25D3/00 ,  C23C18/00 ,  H05K1/14

CPC分类号： H01L23/49838 ,  C23C18/00 ,  C23C18/1653 ,  C23C18/54 ,  C25D3/00 ,  C25D3/38 ,  C25D5/48 ,  C25D11/045 ,  C25D11/08 ,  C25D11/12 ,  C25D11/16 ,  C25D11/20 ,  C25F3/20 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2203/0315

摘要： The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

公开(公告)号：US09797036B2

公开(公告)日：2017-10-24

申请号：US14670819

申请日：2015-03-27

申请人： GM Global Technology Operations LLC

发明人： Ming Liu ,  Lei Gao

IPC分类号： B32B3/00 ,  C23C8/80 ,  B60B3/10 ,  C23C8/04 ,  C23C8/36 ,  C23C14/08 ,  C23C14/34 ,  C23C28/00 ,  C25D11/30 ,  C25D13/14 ,  C23C8/40 ,  C25D7/00 ,  C25D11/02 ,  C25D11/20 ,  C25D11/24 ,  C25D11/26 ,  C25D17/00 ,  C25D17/06 ,  C25D11/00 ,  C25D13/22

CPC分类号： C23C8/80 ,  B60B3/10 ,  B60B2310/616 ,  B60B2310/618 ,  B60B2310/621 ,  B60B2310/654 ,  B60B2310/656 ,  B60B2310/661 ,  B60B2360/106 ,  B60B2900/141 ,  C23C8/04 ,  C23C8/36 ,  C23C8/40 ,  C23C14/081 ,  C23C14/34 ,  C23C28/32 ,  C23C28/345 ,  C25D7/00 ,  C25D11/005 ,  C25D11/026 ,  C25D11/20 ,  C25D11/246 ,  C25D11/26 ,  C25D11/30 ,  C25D13/14 ,  C25D13/22 ,  C25D17/005 ,  C25D17/06 ,  Y10T428/21 ,  Y10T428/24967

摘要： A metal workpiece, such as a wheel, and a method of providing an enhanced corrosion resistant surface coating on an exposed surface of a metal or alloy substrate (such as magnesium). A corrosion resistance basecoat is formed, including generating an oxide layer, and applying a first primer coating onto at least a portion of the oxide layer. The method may further include identifying highest corrosion prone areas on the substrate and designing a support rack that avoids contact with these corrosion prone areas. The method also includes forming a topcoat over at least a portion of the basecoat, by applying a second primer coating onto at least a portion of the first primer coating and depositing a sputtered metallic film onto the second primer coating using a physical vapor deposition technique. A clear coat layer may be applied over the metallic film.

公开(公告)号：US20170200568A1

公开(公告)日：2017-07-13

申请号：US15473075

申请日：2017-03-29

申请人： FUJIFILM Corporation

发明人： Junji KAWAGUCHI

IPC分类号： H01G11/70 ,  C25F3/14 ,  C25D11/20 ,  C25F3/04 ,  H01M4/66 ,  H01M4/74

CPC分类号： H01G11/70 ,  C23C18/1653 ,  C23C18/31 ,  C23C18/32 ,  C23C18/34 ,  C23C18/54 ,  C25D3/38 ,  C25D11/08 ,  C25D11/20 ,  C25D11/24 ,  C25F3/04 ,  C25F3/14 ,  H01M4/661 ,  H01M4/742

摘要： An object is to provide an aluminum plate having favorable coating properties and pre-doping characteristics. An aluminum plate having a plurality of through holes that penetrate in a thickness direction, in which an average opening diameter of the through holes is 1 μm to 100 μm, a density of the through holes is 50 through holes/mm2 to 2,000 through holes/mm2, and an inter-hole distance between adjacent through holes is 300 μm or less.

公开(公告)号：US09683305B2

公开(公告)日：2017-06-20

申请号：US13332288

申请日：2011-12-20

申请人： Jody R. Akana ,  Peter N. Russell-Clarke ,  Masashige Tatebe

发明人： Jody R. Akana ,  Peter N. Russell-Clarke ,  Masashige Tatebe

IPC分类号： C25D11/20 ,  B44C1/00 ,  C25D11/30 ,  C25D11/16 ,  C25D11/12 ,  C25D11/26 ,  C25D11/22 ,  C25D11/24 ,  C25D11/34 ,  C25D11/02

CPC分类号： C25D11/022 ,  B44C1/005 ,  C25D11/12 ,  C25D11/16 ,  C25D11/20 ,  C25D11/22 ,  C25D11/243 ,  C25D11/246 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34

摘要： A surface treatment for metal surfaces can be used to create one or more desired effects, such as functional, tactile, or cosmetic effects. In one embodiment, the treatment involves selectively masking a portion of the surface using a photolithographic process. The mask can protect the masked portion of the surface during subsequent treatment processes such as texturizing and anodization. The mask can result in the creation of a surface having contrasting effects. A pattern can be formed by the contrasting effects in the shape of a distinct graphic, such as a logo or text.

公开(公告)号：US09683304B2

公开(公告)日：2017-06-20

申请号：US14133420

申请日：2013-12-18

申请人： TOADENKA CORPORATION

发明人： Masumi Kuroyama ,  Tomonori Ishikawa ,  Kazuo Kato ,  Yaeko Sasaki ,  Shuhei Miura ,  Masayuki Nakamura ,  Setsuko Sato

IPC分类号： C25D5/48 ,  C25D11/04 ,  C25D11/18 ,  C25D11/20 ,  B29C45/14 ,  B29K705/00 ,  B29K705/02

CPC分类号： C25D5/48 ,  B29C45/14311 ,  B29C45/14778 ,  B29K2705/00 ,  B29K2705/02 ,  C25D11/04 ,  C25D11/18 ,  C25D11/20 ,  Y10T428/269

摘要： Disclosed is a resin-metal bonded body of an aluminum metal member and a thermoplastic resin member, which has improved bonding strength and good durability. Also disclosed is a method for producing such a resin-metal bonded body. Specifically disclosed is a resin-metal bonded body which is obtained by bonding an aluminum metal member with a thermoplastic resin member. In this resin-metal bonded body, the aluminum metal member and the thermoplastic resin member are bonded together by an anodic oxide coating having a film thickness of 70-1500 nm or an anodic oxide coating having a triazine thiol in the inner and upper portions. The anodic oxide coating has an infrared absorption spectrum peak intensity ascribed to OH group at 0.0001-0.16.

公开(公告)号：US20160336262A1

公开(公告)日：2016-11-17

申请号：US15219803

申请日：2016-07-26

申请人： FUJIFILM Corporation

发明人： Kosuke YAMASHITA

IPC分类号： H01L23/498 ,  H05K1/11 ,  H01L21/48 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

CPC分类号： H01L23/49838 ,  C23C18/00 ,  C23C18/1653 ,  C23C18/54 ,  C25D3/00 ,  C25D3/38 ,  C25D5/48 ,  C25D11/045 ,  C25D11/08 ,  C25D11/12 ,  C25D11/16 ,  C25D11/20 ,  C25F3/20 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2203/0315

摘要： The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

摘要翻译： 本发明提供一种能够在确保精细导电路径的同时提高绝缘基板的耐电压的微结构，多层布线基板，半导体封装以及微结构制造方法。 本发明的微细结构具有绝缘基板，具有多个贯通孔，导电路径由含有填充多个贯通孔的金属的导电材料构成，其中多个通孔的平均开口直径为5nm〜 连接相邻的通孔的最短距离的平均值为10nm〜300nm，水分含量相对于微结构的总质量为0.005％以下。

公开(公告)号：US20160294002A1

公开(公告)日：2016-10-06

申请号：US15187057

申请日：2016-06-20

申请人： FUJIFILM Corporation

发明人： Atsushi MATSUURA ,  Yuichi KASUYA ,  Junji KAWAGUCHI ,  Hisashi HOTTA ,  Yoshinori HOTTA ,  Hiroshi KOMATSU ,  Hirokazu SAWADA

IPC分类号： H01M10/0525 ,  C25D11/20 ,  C25D11/24 ,  H01G11/70 ,  H01M4/66 ,  H01M4/80 ,  H01G11/68 ,  H01G11/84 ,  C25F3/04 ,  H01M4/04

CPC分类号： H01M10/0525 ,  C23C18/1653 ,  C23C18/54 ,  C25D3/38 ,  C25D11/18 ,  C25D11/20 ,  C25D11/24 ,  C25F3/04 ,  H01G11/68 ,  H01G11/70 ,  H01G11/84 ,  H01M4/044 ,  H01M4/0442 ,  H01M4/661 ,  H01M4/664 ,  H01M4/667 ,  H01M4/80 ,  H01M2004/021 ,  Y02E60/13 ,  Y02T10/7011 ,  Y02T10/7022

摘要： An object of the present invention is to provide a method for manufacturing an aluminum plate which is simple, is high in productiveness, allows the use of arbitrary aluminum materials, and can be suitably used for collectors having excellent adhesiveness to active material layers, a collector for a storage device, and a storage device. The method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having an aluminum substrate having a plurality of through holes in a thickness direction, including an oxidized film-forming step of forming an oxidized film by carrying out an oxidized film-forming treatment on a surface of the aluminum substrate having a thickness in a range of 5 μm to 1,000 μm and a through hole-forming step of forming through holes by carrying out an electrochemical dissolution treatment after the oxidized film-forming step.

摘要翻译： 本发明的目的是提供一种制造铝板的方法，其制造简单，生产性高，允许使用任意的铝材料，并且可适用于对活性物质层具有优异的粘合性的集电体，集电体 用于存储设备和存储设备。 本发明的铝板的制造方法是一种铝板的制造方法，该铝板具有在厚度方向上具有多个贯通孔的铝基板，该铝基板包括氧化膜形成工序，该工序通过进行氧化膜的形成来形成氧化膜 在厚度为5μm〜1000μm的铝基板的表面上进行氧化成膜处理，以及通过在氧化膜形成工序后进行电化学溶解处理而形成通孔的通孔形成工序。