公开(公告)号：US20130020698A1

公开(公告)日：2013-01-24

申请号：US13189127

申请日：2011-07-22

申请人： Cheng-Chieh Hsieh ,  Cheng-Lin Huang ,  Po-Hao Tsai ,  Shang-Yun Hou ,  Jing-Cheng Lin ,  Shin-Puu Jeng

发明人： Cheng-Chieh Hsieh ,  Cheng-Lin Huang ,  Po-Hao Tsai ,  Shang-Yun Hou ,  Jing-Cheng Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/485 ,  H01L21/768

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11616 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13013 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1362 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/16056 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/384 ,  H01L2924/3841 ,  H01L2924/00014

摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.

摘要翻译： 提供了一种用于导电柱的系统和方法。 一个实施例包括具有位于其外边缘周围的沟槽的导电柱。 当在导电柱上形成导电凸块时，沟槽用于引导诸如焊料的导电材料。 导电柱然后可以通过导电材料电连接到另一接触件。

公开(公告)号：US20120306080A1

公开(公告)日：2012-12-06

申请号：US13298046

申请日：2011-11-16

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC分类号： H01L23/52

CPC分类号： H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.

摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层和在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。

公开(公告)号：US08816498B2

公开(公告)日：2014-08-26

申请号：US13189127

申请日：2011-07-22

申请人： Cheng-Chieh Hsieh ,  Cheng-Lin Huang ,  Po-Hao Tsai ,  Shang-Yun Hou ,  Jing-Cheng Lin ,  Shin-Puu Jeng

发明人： Cheng-Chieh Hsieh ,  Cheng-Lin Huang ,  Po-Hao Tsai ,  Shang-Yun Hou ,  Jing-Cheng Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/485 ,  H01L21/768

摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.

公开(公告)号：US20110304042A1

公开(公告)日：2011-12-15

申请号：US12846260

申请日：2010-07-29

申请人： Jing-Cheng Lin ,  Ya-Hsi Hwung ,  Hsin-Yu Chen ,  Po-Hao Tsai ,  Yan-Fu Lin ,  Cheng-Lin Huang ,  Fang Wen Tsai ,  Wen-Chih Chiou

发明人： Jing-Cheng Lin ,  Ya-Hsi Hwung ,  Hsin-Yu Chen ,  Po-Hao Tsai ,  Yan-Fu Lin ,  Cheng-Lin Huang ,  Fang Wen Tsai ,  Wen-Chih Chiou

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L23/488 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05099 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1182 ,  H01L2224/11823 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1369 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2224/81805

摘要： A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.

摘要翻译： 工件包括具有顶表面和侧壁的铜凸块。 在铜凸块的侧壁而不是顶表面上形成保护层。 保护层包括铜和聚合物的化合物，并且是介电层。

公开(公告)号：US20110254160A1

公开(公告)日：2011-10-20

申请号：US12762085

申请日：2010-04-16

申请人： Po-Hao Tsai ,  Jing-Cheng Lin ,  Chen-Hua Yu

发明人： Po-Hao Tsai ,  Jing-Cheng Lin ,  Chen-Hua Yu

IPC分类号： H01L23/538

CPC分类号： H01L23/3121 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/00 ,  H01L2224/81805

摘要： A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.

摘要翻译： 一种器件包括具有顶表面和底表面的衬底的插入器。 多个穿通基板通孔（TSV）穿过基板。 多个TSV包括具有第一长度和第一水平尺寸的第一TSV和具有不同于第一长度的第二长度的第二TSV和与第一水平尺寸不同的第二水平尺寸。 互连结构形成在衬底的顶表面上并电耦合到多个TSV。

公开(公告)号：US09646942B2

公开(公告)日：2017-05-09

申请号：US13403511

申请日：2012-02-23

申请人： Jing-Cheng Lin ,  Po-Hao Tsai

发明人： Jing-Cheng Lin ,  Po-Hao Tsai

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K101/42 ,  H01L23/498

CPC分类号： H01L24/11 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2924/01047 ,  H01L2224/05552 ,  H01L2924/00

摘要： The mechanisms for forming bumps on packaged dies and package substrates reduce variation of bump heights across the packaged dies and packaged substrates. Bumps are designed to have different widths to counter the higher plating current near edge(s) of dies or substrates. Bump sizes can be divided into different zones depending on the bump patterns and densities across the packaged die and/or substrates. Smaller bumps near edges reduce the thickness of plated film(s), which would have been thicker due to being near the edges. As a result, the bump heights across the packaged dies and/or substrates can be kept significantly constant and chip package can be properly formed.

公开(公告)号：US20140061897A1

公开(公告)日：2014-03-06

申请号：US13624356

申请日：2012-09-21

申请人： Jing-Cheng Lin ,  Po-Hao Tsai

发明人： Jing-Cheng Lin ,  Po-Hao Tsai

IPC分类号： H01L23/498 ,  H01L21/28

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/06102 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11612 ,  H01L2224/11614 ,  H01L2224/1182 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/14177 ,  H01L2224/14515 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16168 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/01108 ,  H01L2224/11 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01082 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/00

摘要： A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a second metal pillar is formed overlying a passivation layer in a second region of the first substrate. A first solder joint region is formed between metal pillar and the first connector, and a second solder joint region is formed between the second metal pillar and the second connector. The thickness of the first metal pillar is greater than the thickness of the second metal pillar.

摘要翻译： 封装结构包括通过将第一基板上的金属柱连接到第二基板上的连接器而将第一基板接合到第二基板。 第一金属柱形成在第一衬底的第一区域上并覆盖并电连接到金属焊盘，第二金属柱形成在第一衬底的第二区域中的钝化层上。 在金属柱和第一连接器之间形成第一焊接区域，在第二金属柱和第二连接器之间形成第二焊点区域。 第一金属柱的厚度大于第二金属柱的厚度。

公开(公告)号：US08664760B2

公开(公告)日：2014-03-04

申请号：US13343582

申请日：2012-01-04

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Cheng-Chieh Hsieh ,  Kuo-Ching Hsu ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Chin-Fu Kao ,  Cheng-Lin Huang ,  Jing-Cheng Lin

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Cheng-Chieh Hsieh ,  Kuo-Ching Hsu ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Chin-Fu Kao ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

摘要： A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.

公开(公告)号：US08610285B2

公开(公告)日：2013-12-17

申请号：US13298046

申请日：2011-11-16

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.

摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层，以及在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。

公开(公告)号：US09024438B2

公开(公告)日：2015-05-05

申请号：US13192756

申请日：2011-07-28

申请人： Cheng-Lin Huang ,  I-Ting Chen ,  Ying Ching Shih ,  Po-Hao Tsai ,  Szu Wei Lu ,  Jing-Cheng Lin ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Cheng-Lin Huang ,  I-Ting Chen ,  Ying Ching Shih ,  Po-Hao Tsai ,  Szu Wei Lu ,  Jing-Cheng Lin ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L23/498 ,  H01L21/60 ,  H01L23/00

CPC分类号： H01L24/14 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13078 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/1405 ,  H01L2224/14051 ,  H01L2224/145 ,  H01L2224/16238 ,  H01L2224/17107 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81897 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01053 ,  H01L2924/01079 ,  H01L2924/01051 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A conductive bump structure of a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprises a regular body, and each of a second subset of the conductive bumps comprises a ring-shaped body.

摘要翻译： 半导体器件的导电凸块结构包括包括主表面的衬底和分布在衬底的主表面上的导电凸块。 导电凸块的第一子集中的每一个包括规则体，并且导电凸块的第二子集中的每一个包括环形体。