Abstract:
Provided is a nonvolatile switching element which has high retention ability even if programmed at a low current, while being suppressed in dielectric breakdown of a variable resistance layer during a reset operation. This switching element is provided with: a first electrode; a second electrode; and a variable resistance layer that is arranged between the first electrode and the second electrode and has ion conductivity. The first electrode contains a metal which generates metal ions that can be conducted in the variable resistance layer. The second electrode is provided with: a first electrode layer that is formed in contact with the variable resistance layer; and a second electrode layer that is formed in contact with the first electrode layer. The first electrode layer is formed of a ruthenium alloy that contains ruthenium and a first metal having a larger standard Gibbs energy of formation of oxide than ruthenium in the negative direction. The second electrode layer is formed of a nitride that contains the first metal. The content of the first metal in the first electrode layer is lower than the content of the first metal in the second electrode layer.
Abstract:
Cross-point memory cells, non-volatile memory arrays, methods of reading a memory cell, methods of programming a memory cell, and methods of writing to and reading from a memory cell are described. In one embodiment, a cross-point memory cell includes a word line extending in a first direction, a bit line extending in a second direction different from the first direction, the bit line and the word line crossing without physically contacting each other, and a capacitor formed between the word line and the bit line where such cross. The capacitor comprises a dielectric material configured to prevent DC current from flowing from the word line to the bit line and from the bit line to the word line.
Abstract:
Providing for a memory cell capable of forming a one time programmable, multi-level cell two-terminal memory cell or a rewritable, two terminal memory cell is described herein. In some embodiments, one time programmable, multi-level cell two-terminal memory cell can exhibit diode-like characteristics. In other embodiments, the memory cell can comprise a first electrode layer configured to generate ions in response to an electric field applied to the memory cell; a resistive ion migration layer at least in part permeable to migration of the ions within the resistive ion migration layer; a second electrode layer; and a substrate layer comprising a silicon wafer.
Abstract:
A memory array includes wordlines, local bitlines, two-terminal memory elements, global bitlines, and local-to-global bitline pass gates and gain stages. The memory elements are formed between the wordlines and local bitlines. Each local bitline is selectively coupled to an associated global bitline, by way of an associated local-to-global bitline pass gate. During a read operation when a memory element of a local bitline is selected to be read, a local-to-global gain stage is configured to amplify a signal on or passing through the local bitline to an amplified signal on or along an associated global bitline. The amplified signal, which in one embodiment is dependent on the resistive state of the selected memory element, is used to rapidly determine the memory state stored by the selected memory element. The global bit line and/or the selected local bit line can be biased to compensate for the Process Voltage Temperature (PVT) variation.
Abstract:
Various embodiments include at least one resistance change memory (RCM) cell, In one embodiment, three or more pairs of electrical contacts are coupled to the at least one RCM cell. A first portion of the pairs are arranged laterally to one another in a first grouping and a second opposing portion of the pairs are arranged laterally to one another in a second grouping. A memory cell material is disposed between opposing sides of the pairs of the three or more electrical contacts. The memory cell material is configured to form a conductive pathway between one or more of the pairs, with each of the three or more pairs being configured to be accessed individually for at least one operation including program, erase, and read operations. Additional apparatuses and methods are described.
Abstract:
In one embodiment, a semiconductor memory device includes a plurality of resistive switching memory cells, where each resistive switching memory cell can include: (i) a programmable impedance element having an anode and a cathode; (ii) a word line pair configured to control access to the programmable impedance element, where the word line pair comprises first and second word lines; (iii) a PMOS transistor having a source coupled to the cathode, a drain coupled to a bit line, and a gate coupled to the first word line; and (iv) an NMOS transistor having a source coupled to the bit line, a drain coupled to the cathode, and a gate coupled to the second word line.
Abstract:
Discloses is a unified non-volatile memory comprising: a first memory section, served as a read only memory; and a second memory section, served as a random access memory. An electronic apparatus applying the unified non-volatile memory is also disclosed.
Abstract:
The present invention discloses a three-dimensional vertical memory (3D-MV). It comprises at least a 3D-array die and at least a peripheral-circuit die. The 3D-array die comprises a plurality of vertical memory strings. The number of interconnect levels in the peripheral-circuit die is more than the number of interconnect levels in the 3D-array die, but substantially less than the number of memory cells on each of the vertical memory strings in the 3D-array die.
Abstract:
Structures and methods for improving logging in network structures are disclosed herein. In one embodiment, an apparatus can include: (i) a network interface card (NIC) configured to receive data, to transmit data, and to send data for logging; (ii) a memory log coupled to the NIC, where the memory log comprises non-volatile memory (NVM) configured to write the data sent for logging from the NIC; and (iii) where the data being sent for logging by the memory log occurs substantially simultaneously with the data being received by the NIC, and the data being transmitted from the NIC.
Abstract:
A resistive random access memory device includes a first electrode made of inert material; a second electrode made of soluble material, and a solid electrolyte, the first and second electrodes being respectively in contact with one of the faces of the electrolyte, the second electrode to supply mobile ions circulating in the solid electrolyte to the first electrode to form a conductive filament between the first and second electrodes when a voltage is applied between the first and second electrodes, the solid electrolyte including a region made of a first metal oxide that is doped by a second metal, distinct from the first metal and able to form a second metal oxide, the second metal selected such that the first metal oxide doped by the second metal has a band gap energy less than or equal to that of the first metal oxide not doped by the second metal.