摘要:
Systems, devices, and methods related to a Deep Learning Accelerator and memory are described. An integrated circuit may be configured to execute instructions with matrix operands and configured with: random access memory configured to store instructions executable by the Deep Learning Accelerator and store matrices of an Artificial Neural Network; a connection between the random access memory and the Deep Learning Accelerator; a first interface to a memory controller of a Central Processing Unit; and a second interface to an image generator, such as a camera. While the Deep Learning Accelerator is using the random access memory to process current input to the Artificial Neural Network in generating current output from the Artificial Neural Network, the Deep Learning Accelerator may concurrently load next input from the camera into the random access memory; and at the same time, the Central Processing Unit may concurrently retrieve prior output from the random access memory.
摘要:
Systems, devices, and methods related to a Deep Learning Accelerator and memory are described. An integrated circuit may be configured to execute instructions with matrix operands and configured with: random access memory configured to store instructions executable by the Deep Learning Accelerator and store matrices of an Artificial Neural Network; a connection between the random access memory and the Deep Learning Accelerator; a first interface to a memory controller of a Central Processing Unit; and a second interface to a direct memory access controller. While the Deep Learning Accelerator is using the random access memory to process current input to the Artificial Neural Network in generating current output from the Artificial Neural Network, the direct memory access controller may concurrently load next input into the random access memory; and at the same time, the Central Processing Unit may concurrently retrieve prior output from the random access memory.
摘要:
A memory system includes: a memory device; and a memory controller suitable for controlling the memory device, and the memory device includes: a plurality of normal memory cells; a plurality of redundant memory cells; and a soft repair circuit suitable for replacing a portion of normal memory cells among the plurality of the normal memory cells with the plurality of the redundant memory cells, and the memory controller controls the soft repair circuit to repair the portion of the normal memory cells among the plurality of the normal memory cells with the plurality of the redundant memory cells, commands the memory device to write a secure data in the plurality of the redundant memory cells, and controls the soft repair circuit to recover the repairing of the portion of the normal memory cells with the plurality of the redundant memory cells.
摘要:
Cross-point memory cells, non-volatile memory arrays, methods of reading a memory cell, methods of programming a memory cell, and methods of writing to and reading from a memory cell are described. In one embodiment, a cross-point memory cell includes a word line extending in a first direction, a bit line extending in a second direction different from the first direction, the bit line and the word line crossing without physically contacting each other, and a capacitor formed between the word line and the bit line where such cross. The capacitor comprises a dielectric material configured to prevent DC current from flowing from the word line to the bit line and from the bit line to the word line.
摘要:
An embodiment of a method for automated test pattern generation (ATPG), a system for ATPG, and a memory configured for ATPG. For example, an embodiment of a memory includes a first test memory cell, a data-storage memory cell, and a test circuit configured to enable the test cell and to disable the data-storage cell during a test mode.
摘要:
An embodiment of a method for automated test pattern generation (ATPG), a system for ATPG, and a memory configured for ATPG. For example, an embodiment of a memory includes a first test memory cell, a data-storage memory cell, and a test circuit configured to enable the test cell and to disable the data-storage cell during a test mode.
摘要:
A signal transmission insulating device includes: a first coil; a second coil opposing the first coil to form a transformer together with the first coil; a first insulating film provided between the opposing first coil and second coil and made of a first dielectric material; a second insulating film surrounding the first coil and made of a second dielectric material having a lower resistivity or a higher permittivity than the first dielectric material; and a third insulating film surrounding the second coil and made of a third dielectric material having a lower resistivity or a higher permittivity than the first dielectric material.
摘要:
A semiconductor device includes a memory block including memory cells connected to a word line, and an operation circuit suitable for consecutively applying a main program pulse and a sub program pulse to the word line to perform a program operation of the memory cells, and suitable for performing a program verification operation of the memory cells, wherein the sub program pulse has a lower voltage level than the main program pulse.
摘要:
A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.
摘要:
An integrated circuit package includes a packaging substrate with an electrical connection pad formed thereon and an integrated circuit die coupled to the electrical connection pad. The electrical connection pad includes an electroplated surface finish layer, but does not include an electrical trace configured as a plating tail. Because the electrical connection pad is free of a plating tail, signal degradation caused by the presence of plating tails in the integrated circuit package is avoided.