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公开(公告)号:US20240170035A1
公开(公告)日:2024-05-23
申请号:US18373120
申请日:2023-09-26
Applicant: Lodestar Licensing Group LLC
Inventor: Matthew A. Prather , Thomas H. Kinsley
IPC: G11C11/406 , G11C7/10 , G11C11/407
CPC classification number: G11C11/40611 , G11C7/1072 , G11C11/407
Abstract: Methods, apparatuses, and systems for staggering refresh operations to memory arrays in different dies of a three-dimensional stacked (3DS) memory device are described. A 3DS memory device may include one die or layer of that controls or regulates commands, including refresh commands, to other dies or layers of the memory device. For example, one die of the 3DS memory may delay a refresh command when issuing the multiple concurrent memory refreshes would cause some problematic performance condition, such as high peak current, within the memory device.
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公开(公告)号:US20240126692A1
公开(公告)日:2024-04-18
申请号:US18396638
申请日:2023-12-26
Applicant: Micron Technology, Inc.
Inventor: Evan C. Pearson , John H. Gentry , Michael J. Scott , Greg S. Gatlin , Lael H. Matthews , Anthony M. Geidl , Michael Roth , Markus H. Geiger , Dale H. Hiscock
IPC: G06F12/06 , G06F11/07 , G11C11/407 , G11C29/04 , H01L25/065
CPC classification number: G06F12/0646 , G06F11/0727 , G06F11/0751 , G06F11/0793 , G11C11/407 , G11C29/04 , H01L25/0657 , H01L2225/06541
Abstract: Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies. Each memory die of the plurality includes a command/address decoder. The command/address decoders are configured to receive command and address signals from external contacts of the memory device. The command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. Each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. In some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.
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公开(公告)号:US20240029804A1
公开(公告)日:2024-01-25
申请号:US17868956
申请日:2022-07-20
Applicant: SanDisk Technologies LLC
Inventor: Yi Song , Xiaochen Zhu , Jiahui Yuan , Lito De La Rama
CPC classification number: G11C16/3445 , G11C16/16 , G11C16/349 , G11C11/407
Abstract: An apparatus is provided that includes a block of memory cells and a control circuit coupled to the block of memory cells. The control circuit is configured to perform an erase operation on the block of memory cells by determining a first count of a number of times that the block of memory cells previously has been programmed and erased, determining a threshold number based on the first count, and determining whether the erase operation passed or failed based on the threshold number.
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公开(公告)号:US11868252B2
公开(公告)日:2024-01-09
申请号:US16706635
申请日:2019-12-06
Applicant: Micron Technology, Inc.
Inventor: Evan C. Pearson , John H. Gentry , Michael J. Scott , Greg S. Gatlin , Lael H. Matthews , Anthony M. Geidl , Michael Roth , Markus H. Geiger , Dale H. Hiscock
IPC: G06F11/07 , G06F12/06 , H01L25/065 , G11C11/407 , G11C29/04
CPC classification number: G06F12/0646 , G06F11/0727 , G06F11/0751 , G06F11/0793 , G11C11/407 , G11C29/04 , H01L25/0657 , H01L2225/06541
Abstract: Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies. Each memory die of the plurality includes a command/address decoder. The command/address decoders are configured to receive command and address signals from external contacts of the memory device. The command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. Each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. In some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.
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公开(公告)号:US20230386536A1
公开(公告)日:2023-11-30
申请号:US18232542
申请日:2023-08-10
Inventor: Perng-Fei Yuh , Yih Wang
CPC classification number: G11C7/1096 , G11C8/08 , G11C7/12 , G11C7/1069 , G11C11/407
Abstract: Disclosed herein are related to a memory device including a set of memory cells and a memory controller. In one aspect, each of the set of memory cells includes a select transistor and a storage element connected in series between a corresponding bit line and a corresponding source line. In one aspect, the memory controller is configured to apply a first write voltage to a bit line coupled to a selected memory cell, apply a second write voltage to a word line coupled to a gate electrode of a select transistor of the selected memory cell during a first time period, and apply a third write voltage to a source line coupled to the selected memory cell. The second write voltage may be between the first write voltage and the third write voltage.
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公开(公告)号:US20230360702A1
公开(公告)日:2023-11-09
申请号:US18221330
申请日:2023-07-12
Applicant: Zeno Semiconductor, Inc.
Inventor: Yuniarto Widjaja
IPC: G11C14/00 , G11C11/404 , H01L29/78 , G11C11/4072 , G11C13/00 , H10B12/00 , H10B63/00 , H10N70/00 , H10N70/20 , G11C11/21 , G11C11/407
CPC classification number: G11C14/0045 , G11C11/404 , H01L29/7841 , G11C11/4072 , G11C14/00 , G11C13/0004 , G11C13/0069 , G11C14/009 , H10B12/20 , H10B12/056 , H10B63/30 , H10N70/00 , H10N70/231 , H10N70/826 , H10N70/8828 , H10N70/8833 , H10N70/8836 , G11C11/21 , G11C13/00 , G11C13/0007 , G11C14/0027 , G11C14/0036 , G11C11/407 , G11C2013/0073 , H10B12/03 , H10N70/20
Abstract: A semiconductor memory cell including a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell, and a non-volatile memory comprising a bipolar resistive change element, and methods of operating.
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公开(公告)号:US20180107597A1
公开(公告)日:2018-04-19
申请号:US15653990
申请日:2017-07-19
Applicant: SK hynix Inc.
Inventor: Sang-Gu JO , Yong-Ju KIM
IPC: G06F12/0804 , G06F13/16 , G11C29/44 , G06F12/06 , G11C11/34 , G11C11/407
CPC classification number: G06F12/0804 , G06F12/06 , G06F13/1647 , G06F13/1668 , G11C11/34 , G11C11/407 , G11C29/4401 , G11C29/72 , G11C29/83
Abstract: A memory system includes: a memory device; and a memory controller suitable for controlling the memory device, and the memory device includes: a plurality of normal memory cells; a plurality of redundant memory cells; and a soft repair circuit suitable for replacing a portion of normal memory cells among the plurality of the normal memory cells with the plurality of the redundant memory cells, and the memory controller controls the soft repair circuit to repair the portion of the normal memory cells among the plurality of the normal memory cells with the plurality of the redundant memory cells, commands the memory device to write a secure data in the plurality of the redundant memory cells, and controls the soft repair circuit to recover the repairing of the portion of the normal memory cells with the plurality of the redundant memory cells.
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公开(公告)号:US09922711B2
公开(公告)日:2018-03-20
申请号:US15499519
申请日:2017-04-27
Applicant: Zeno Semiconductor, Inc.
Inventor: Yuniarto Widjaja
CPC classification number: G11C14/0045 , G11C11/21 , G11C11/404 , G11C11/407 , G11C11/4072 , G11C13/00 , G11C13/0004 , G11C13/0007 , G11C13/0069 , G11C14/00 , G11C14/0027 , G11C14/0036 , G11C14/009 , G11C2013/0073 , H01L27/10802 , H01L27/1085 , H01L27/10879 , H01L27/2436 , H01L29/7841 , H01L45/00 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/146 , H01L45/147
Abstract: A semiconductor memory cell including a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell, and a non-volatile memory comprising a bipolar resistive change element, and methods of operating.
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公开(公告)号:US20180010968A1
公开(公告)日:2018-01-11
申请号:US15713643
申请日:2017-09-23
Applicant: Darryl G. Walker
Inventor: Darryl G. Walker
IPC: G01K7/16 , H03K17/687 , H03K17/22 , H03K17/14 , H03K3/012 , G11C11/4096 , G11C11/4093 , G11C11/4074 , G11C11/407 , G11C11/406 , G11C7/04 , G11C7/00 , G01K13/00 , G01K7/01 , G01K7/00 , G01K3/00 , H03K21/10
CPC classification number: G01K7/16 , G01K3/005 , G01K7/00 , G01K7/01 , G01K13/00 , G11C7/00 , G11C7/04 , G11C11/40626 , G11C11/407 , G11C11/4074 , G11C11/4093 , G11C11/4096 , H03K3/012 , H03K17/145 , H03K17/223 , H03K17/687 , H03K21/10 , Y10T307/773
Abstract: A method can include, in response to a power supply voltage transition, setting a temperature window to a first temperature range by operation of a temperature circuit formed on a semiconductor device. In response to a temperature of the semiconductor device being determined to be outside of the first temperature range, changing the temperature range of the temperature window until the temperature of the semiconductor device is determined to be within the temperature window.
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公开(公告)号:US09831247B2
公开(公告)日:2017-11-28
申请号:US15218287
申请日:2016-07-25
Applicant: Zeno Semiconductor, Inc.
Inventor: Jin-Woo Han , Yuniarto Widjaja
IPC: H01L29/00 , H01L27/108 , H01L29/78 , G11C16/00 , G11C16/04 , H01L29/06 , G11C11/404 , G11C11/407
CPC classification number: H01L27/10802 , G11C11/404 , G11C11/407 , G11C16/00 , G11C16/0416 , H01L29/0649 , H01L29/7841
Abstract: A semiconductor memory cell comprising an electrically floating body. A method of operating the memory cell is provided.