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公开(公告)号:US12131785B2
公开(公告)日:2024-10-29
申请号:US17829837
申请日:2022-06-01
Applicant: Intel NDTM US LLC
Inventor: Chao Zhang , Krishna Parat , Richard Fastow , Ricardo Basco , Xin Sun , Heonwook Kim , Zhan Liu
Abstract: Systems, apparatuses and methods may provide for technology that biases a word line of a block in NAND memory to a first voltage level, biases a source-side select gate and a drain-side select gate of the block to a second voltage level, and issues a discharge erase pulse to bitlines and a source of the block, wherein the discharge erase pulse is issued at a third voltage level, wherein the third voltage level is greater than the first voltage level and the second voltage level, and wherein the third voltage level is less than a fourth voltage level of a standard erase pulse. In one example, the discharge erase pulse injects holes into pillars of the block and bypasses an erase of cells in the pillars of the block.
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公开(公告)号:US12119051B2
公开(公告)日:2024-10-15
申请号:US17884861
申请日:2022-08-10
Applicant: Micron Technology, Inc.
Inventor: Jeremy Binfet , Mark Helm , William Filipiak , Mark Hawes
IPC: G11C11/419 , G11C7/08 , G11C7/10 , G11C7/20 , G11C7/22 , G11C16/20 , G11C16/24 , G11C16/26 , G11C16/04
CPC classification number: G11C11/419 , G11C7/08 , G11C7/1015 , G11C7/1072 , G11C7/20 , G11C7/227 , G11C16/20 , G11C16/24 , G11C16/26 , G11C16/0483 , G11C2207/2281
Abstract: Systems, devices, and methods related to reset read are described. A reset read may be employed to initiate a transition of a portion of memory array into a first state or maintain a portion of memory array in a first state, such as a transient state. A reset read may provide a highly-parallelized, energy-efficient option to ensure memory blocks are in the first state. Various modes of reset read may be configured according to different input.
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公开(公告)号:US20240331776A1
公开(公告)日:2024-10-03
申请号:US18743852
申请日:2024-06-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongsung CHO
Abstract: A memory device includes a memory cell array, and a page buffer circuit connected to the memory cell array through a plurality of bit lines, including a plurality of page buffers arranged in correspondence with the bit lines and each of which includes a sensing node. The plurality of page buffers include a first page buffer, and the first page buffer includes: a first sensing node configured to sense data by corresponding to a first metal wire at a lower metal layer; and a second metal wire electrically connected to the first metal wire and at an upper metal layer located above the lower metal layer, and a boost node corresponding to a third metal wire adjacent to the second metal wire of the upper metal layer and configured to control a boost-up and a boost-down of a voltage of the first sensing node.
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公开(公告)号:US12108601B2
公开(公告)日:2024-10-01
申请号:US17445867
申请日:2021-08-25
Applicant: Micron Technology, Inc.
Inventor: Andrew Bicksler , Marc Aoulaiche , Albert Fayrushin
CPC classification number: H10B43/35 , G06F3/0604 , G06F3/0659 , G06F3/0679 , G11C16/0483 , G11C16/08 , G11C16/24 , G11C16/3427 , H10B43/27
Abstract: Back gates and related apparatuses, systems, and methods are disclosed. An apparatus includes a channel material including a first side and a second side opposite the first side. The apparatus also includes word lines comprising electrically conductive material spaced along the first side of the channel material. The apparatus further includes a back gate comprising electrically conductive material proximate to the second side of the channel material. A method includes biasing a bit line and a word line associated with a memory cell according to a memory operation and biasing the back gate while biasing the bit line and the word line.
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公开(公告)号:US12106809B2
公开(公告)日:2024-10-01
申请号:US18362201
申请日:2023-07-31
Inventor: Szu-Chun Tsao , Jaw-Juinn Horng
Abstract: Disclosed herein are related to a memory system including a memory cell and a circuit to operate the memory cell. In one aspect, the circuit includes a pair of transistors to electrically couple, to the bit line, a selected one of i) a voltage source to supply a reference voltage to the memory cell or ii) a sensor to sense a current through the memory cell. In one aspect, the circuit includes a first transistor. The first transistor and the bit line may be electrically coupled between the pair of transistors and the memory cell in series.
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公开(公告)号:US20240304252A1
公开(公告)日:2024-09-12
申请号:US18423161
申请日:2024-01-25
Applicant: Micron Technology, Inc.
Inventor: Hernan Castro
CPC classification number: G11C16/102 , G11C16/24 , G11C16/26
Abstract: Systems, methods, and apparatus related to memory devices that perform signed multiplication using logical states of memory cells. In one approach, a memory device has a memory array including sets of memory cells programmed to store a signed weight in each set (e.g., four cells in a set store a signed weight of +1, 0, or −1). Voltages that represent signed inputs (e.g., +1, 0, or −1) are applied to the memory cells to perform the multiplication. A result from the multiplication is determined based on summing of output currents from the memory cells.
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公开(公告)号:US12080358B2
公开(公告)日:2024-09-03
申请号:US17866904
申请日:2022-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bong-Kil Jung , Sang-Wan Nam , Jong Min Baek , Min Ki Jeon , Woo Chul Jung , Yoon-Hee Choi
CPC classification number: G11C16/3404 , G11C16/0483 , G11C16/08 , G11C16/24
Abstract: A nonvolatile memory device including a memory cell array, a first voltage generator configured to generate a word line operating voltage for each word line of the memory cell array, a second voltage generator configured to generate a bit line operating voltage of the memory cell array, and a temperature unit configured to determine, from a temperature range table, a temperature range for a temperature code according to a real-time temperature of the memory cell array, and to adjust a power supply voltage of the first or second voltage generator based on a selection signal mapped to the determined temperature range.
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公开(公告)号:US20240290393A1
公开(公告)日:2024-08-29
申请号:US18450135
申请日:2023-08-15
Applicant: SK hynix Inc.
Inventor: Yeong Jo MUN , Kang Woo PARK
IPC: G11C16/24
CPC classification number: G11C16/24
Abstract: Provided herein may be a semiconductor memory device. The semiconductor memory device may include a memory cell array including a plurality of memory cells, a plurality of page buffers respectively coupled to the plurality of memory cells through bit lines, and a control logic configured to control a program operation of each of the plurality of page buffers. Each of the plurality of page buffers may include a first latch circuit configured to store first data indicating a main verification result obtained using a main verify voltage, a second latch circuit configured to store second data indicating a first sub-verification result obtained using a first sub-verify voltage lower than the main verify voltage, and a third latch circuit configured to store third data indicating a second sub-verification result obtained using a second sub-verify voltage lower than the first sub-verify voltage.
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公开(公告)号:US12073894B2
公开(公告)日:2024-08-27
申请号:US17665300
申请日:2022-02-04
Applicant: SK hynix Inc.
Inventor: Hee Youl Lee
CPC classification number: G11C16/3459 , G11C16/08 , G11C16/102 , G11C16/24 , G11C16/26 , G11C16/30 , G11C16/3404
Abstract: A method of operating a semiconductor memory device programming selected memory cells to store bits of data in each of the selected memory cells includes foggy programming and fine programming.
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公开(公告)号:US20240282389A1
公开(公告)日:2024-08-22
申请号:US18654302
申请日:2024-05-03
Applicant: Kioxia Corporation
Inventor: Hiroyuki NAGASHIMA
CPC classification number: G11C16/26 , G06F11/1048 , G11C11/5628 , G11C11/5642 , G11C16/14 , G11C16/24 , G11C16/34 , G11C16/3418 , G06F11/3466 , G06F2201/88 , G11C16/0483
Abstract: According to one embodiment, a memory system includes a nonvolatile semiconductor memory device, a voltage generation unit and a control unit. The nonvolatile semiconductor memory device includes a memory cell array having a plurality of blocks each including a plurality of memory cells, and a voltage generation unit configured to change a read level of the memory cell. The control unit controls write, read, and erase of the nonvolatile semiconductor memory device. The control unit changes the read level between a start of use of the nonvolatile semiconductor memory device and a timing after an elapse of a time.
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