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公开(公告)号:US20240363190A1
公开(公告)日:2024-10-31
申请号:US18771393
申请日:2024-07-12
Applicant: Micron Technology, Inc.
Inventor: Li-Te Chang , Yu-Chung Lien , Murong Lang , Zhenming Zhou , Michael G. Miller
CPC classification number: G11C29/52 , G11C16/08 , G11C16/102 , G11C16/3404
Abstract: An example method of performing memory access operations comprises: receiving a request to perform a memory access operation; identifying a block family associated with a set of memory cells; determining, for each logical programming level of a plurality of logical programming levels, a corresponding default block family error avoidance (BFEA) threshold voltage offset value associated with the block family; determining a value of a data state metric associated with the set of memory cells; determining, for each logical programming level of a plurality of logical programming levels, a corresponding sub-BFEA threshold voltage offset value; and performing the memory access operation by applying, for each logical programming level of the plurality of logical programming levels, a combination of the default BFEA threshold voltage value, the sub-BFEA threshold voltage value, and a corresponding base voltage level.
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公开(公告)号:US20240339160A1
公开(公告)日:2024-10-10
申请号:US18746964
申请日:2024-06-18
Applicant: Kioxia Corporation
Inventor: Tokumasa HARA , Noboru SHIBATA
CPC classification number: G11C16/26 , G11C16/08 , G11C16/102 , G11C16/30 , G11C16/3404
Abstract: According to one embodiment, a semiconductor memory includes: a memory group including a plurality of memory cells configured to store a plurality of bits of data in three or more plurality of states; a word line coupled to the plurality of memory cells; and a first circuit configured to convert one external address received from an external controller into a plurality of internal addresses, wherein a first page size of page data of the memory group is smaller than a second page size of input data corresponding to the external address.
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公开(公告)号:US20240331781A1
公开(公告)日:2024-10-03
申请号:US18744335
申请日:2024-06-14
Applicant: Micron Technology, Inc.
Inventor: Nevil N. Gajera , Karthik Sarpatwari , Zhongyuan Lu
CPC classification number: G11C16/3404 , G11C16/10 , G11C16/26 , G11C16/30 , G11C16/3459
Abstract: Systems, methods, and apparatus related to memory devices. In one approach, a memory device has a memory array including memory cells. A controller of the memory device evaluates background leakage in order to select a write voltage to apply to a memory cell when performing a programming operation. The write voltage is dynamically selected from two or more write voltages. These write voltages include a first write voltage that is a normal or default voltage, and a second write voltage that is a boosted write voltage. The controller applies a pre-sensing voltage and pre-read voltage to the memory cell, and determines first and second respective currents that result from applying these voltages. In response to determining that the first current exceeds a first threshold (indicating background leakage), and the second current is below a second threshold that is greater than the first threshold (indicating that the memory cell does not snap), the controller selects the second (boosted) write voltage.
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公开(公告)号:US20240321362A1
公开(公告)日:2024-09-26
申请号:US18596541
申请日:2024-03-05
Applicant: Kioxia Corporation
Inventor: Hideki IGARASHI , Takaya IZUMI
CPC classification number: G11C16/102 , G11C16/0433 , G11C16/3404
Abstract: A memory device includes first and second strings including transistors, a first wiring connected to the first string, a second wiring connected to the second string, a third wiring connected to both strings, and a circuit for executing a write operation on a first transistor of the first string and a second transistor of the second string. The operation includes a first operation by which a first voltage is applied to the wirings and a second operation by which a second voltage is applied to gates of the first and second transistors. When a current flows between the first and third wirings but does not flow between the second and third wirings in the first operation, the circuit causes a third voltage to be applied to the first wiring, and causes a fourth voltage higher than the third voltage to be applied to the second wiring in the second operation.
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公开(公告)号:US12100461B2
公开(公告)日:2024-09-24
申请号:US17852786
申请日:2022-06-29
Applicant: SanDisk Technologies LLC
Inventor: Yi Song , Jiacen Guo , Jiahui Yuan
CPC classification number: G11C16/3459 , G11C16/102 , G11C16/16 , G11C16/32 , G11C16/3404 , G11C16/3431
Abstract: To remedy short term data retention issues, a system creates a gate to channel voltage differential for non-volatile memory cells between programming and verifying in order to accelerate the effects of the short term data retention issue. That is, the gate to channel voltage differential will accelerate the migrating of electrons out of shallow traps. In some embodiments, the gate to channel voltage differential comprises a higher voltage at the channel in comparison to the gate. In some embodiments, the programming comprises applying doses of a programming signal and the gate to channel voltage differential is only created for a subset of the time periods between doses of the programming signal.
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公开(公告)号:US20240312538A1
公开(公告)日:2024-09-19
申请号:US18358651
申请日:2023-07-25
Applicant: Western Digital Technologies, Inc.
CPC classification number: G11C16/3445 , G11C16/16 , G11C16/3404
Abstract: A non-volatile memory system is configured to perform a multiplane erase process that concurrently erases groups of memory cells in multiple planes. Based on that multiplane erase process, the memory system determines that a first group of memory cells in a first plane of the multiple planes is slow to erase. As a result, the system will perform one or more multiplane erase processes for the groups of memory cells in multiple planes without erasing the first group of memory cells in the first plane as part of the multiplane erase process(es).
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公开(公告)号:US20240304251A1
公开(公告)日:2024-09-12
申请号:US18223358
申请日:2023-07-18
Applicant: Western Digital Technologies, Inc.
Inventor: Abhijith Prakash , Xiang Yang
CPC classification number: G11C16/102 , G11C16/08 , G11C16/30 , G11C16/3404
Abstract: The memory device includes a quick pass write (QPW) voltage source and a transistor that can control the supply of a first QPW bias voltage to a plurality of bit lines. Control circuitry programs the memory cells of a selected word line in a plurality of program loops. For each memory cell in the selected word line, the control circuitry determines if the memory cell is within either a first or a second QPW zone. If the memory cell is in the second QPW zone, the control circuitry connects the QPW voltage source to the bit line that is in communication with that memory cell to supply the first QPW bias voltage to the bit line. In response to a determination that the memory cell is in the first QPW zone, the control circuitry controls the transistor to supply an average second QPW bias voltage to the bit line.
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公开(公告)号:US20240304244A1
公开(公告)日:2024-09-12
申请号:US18604192
申请日:2024-03-13
Applicant: Micron Technology, Inc.
Inventor: Paolo Fantini , Andrea Martinelli , Maurizio Rizzi
CPC classification number: G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/30 , G11C16/3404
Abstract: Methods, systems, and devices for techniques for parallel memory cell access are described. A memory device may include multiple tiers of memory cells. During a first duration, a first voltage may be applied to a set of word lines coupled with a tier of memory cells to threshold one or more memory cells included in a first subset of memory cells of the tier. During a second duration, a second voltage may be applied to the set of word lines to write a first logic state to the one or more memory cells of the first subset and to threshold one or more memory cells included in a second subset of memory cells of the tier. During a third duration, a third voltage may be applied to the set of word lines to write a second logic state to the one or more memory cells of the second subset.
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公开(公告)号:US12080357B2
公开(公告)日:2024-09-03
申请号:US17833114
申请日:2022-06-06
Applicant: SK hynix Inc.
Inventor: Han Soo Joo
CPC classification number: G11C16/3404 , G11C16/10
Abstract: According to an embodiment of the present disclosure, a memory device, a peripheral circuit configured to perform a program operation, including a plurality of program loops, and a control logic configured to, in some of the plurality of loops of the program operation, control the peripheral circuit to apply a program voltage to a selected word line, apply a first pass voltage to adjacent word lines that are adjacent to the selected word line, and then apply a second pass voltage to adjacent word lines at a predetermined time point, wherein the second pass voltage has a different magnitude compared to the first pass voltage, and in the rest of the plurality of loops of the program operation, control the peripheral circuit to apply the second pass voltage to the adjacent word lines at a time point that is different from the predetermined time point from a selected loop.
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公开(公告)号:US20240282390A1
公开(公告)日:2024-08-22
申请号:US18583197
申请日:2024-02-21
Applicant: Micron Technology, Inc.
Inventor: Lei Zhang , Sampath Ratnam , Steven Michael Kientz
CPC classification number: G11C16/3404 , G11C16/26 , G11C16/349
Abstract: Various embodiments use a feedback-control loop to track slow charge loss (SCL) for a memory cell of a memory device, which can be used to adjust one or more read level voltages used to read data from the memory cell.
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