公开(公告)号：US09761552B2

公开(公告)日：2017-09-12

申请号：US15271744

申请日：2016-09-21

申请人： FUJITSU LIMITED

发明人： Kozo Shimizu ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  B23K1/00 ,  B23K3/08 ,  H01L23/31 ,  H01L23/488 ,  H01L23/498 ,  B23K35/02 ,  B23K35/26 ,  H05K1/02 ,  H05K3/34 ,  H01L23/14 ,  B23K101/40 ,  B23K101/42 ,  H05K1/09 ,  H05K1/11

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20170182600A1

公开(公告)日：2017-06-29

申请号：US15116275

申请日：2014-02-04

申请人： Senju Metal Industry Co., Ltd.

发明人： Hiroyoshi Kawasaki ,  Takahiro Roppongi ,  Daisuke Soma ,  Isamu Sato

IPC分类号： B23K35/02 ,  C22F1/10 ,  B23K35/30 ,  C22C19/03 ,  B22F1/00 ,  B22F9/08 ,  C22F1/08 ,  C22C9/00

CPC分类号： B23K35/0244 ,  B22F1/0003 ,  B22F1/0048 ,  B22F1/025 ,  B22F9/08 ,  B22F9/082 ,  B22F9/14 ,  B22F2009/0848 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0623 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/42 ,  C22C9/00 ,  C22C19/03 ,  C22F1/08 ,  C22F1/10 ,  H01L23/49816 ,  H01L23/556 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13117 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13149 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13172 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13179 ,  H01L2224/1318 ,  H01L2224/13181 ,  H01L2224/13183 ,  H01L2224/13184 ,  H01L2224/132 ,  H01L2224/13211 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13323 ,  H01L2224/13324 ,  H01L2224/13338 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13363 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1337 ,  H01L2224/13371 ,  H01L2224/13372 ,  H01L2224/13373 ,  H01L2224/13376 ,  H01L2224/13378 ,  H01L2224/13379 ,  H01L2224/1338 ,  H01L2224/13381 ,  H01L2224/13383 ,  H01L2224/13384 ,  H01L2224/1339 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1369 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81011 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  B22F2202/13 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01051 ,  H01L2924/01032 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01033 ,  H01L2924/00014 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/01016 ,  H01L2924/01013 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/0106 ,  H01L2924/01071 ,  H01L2924/01069 ,  H01L2924/01021 ,  H01L2924/01068 ,  H01L2924/01059 ,  H01L2924/01067 ,  H01L2924/01066 ,  H01L2924/01065 ,  H01L2924/01064 ,  H01L2924/01061 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/0107 ,  H01L2924/01058 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01052 ,  H01L2924/01076 ,  H01L2924/01072 ,  H01L2924/01043 ,  H01L2924/01004

摘要： Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.

公开(公告)号：US09527167B2

公开(公告)日：2016-12-27

申请号：US14005948

申请日：2012-03-28

申请人： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

发明人： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

IPC分类号： B23K35/00 ,  B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  B32B15/01 ,  H05K3/34 ,  H01L23/00

CPC分类号： B23K35/0244 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B32B15/018 ,  C22C13/00 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/2076 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/207 ,  H01L2924/00014

摘要： A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.

摘要翻译： 一种用于BGA或CSP电极的无铅焊球，其包含0.5-1.1质量％的Ag，0.7-0.8质量％的Cu，0.05-0.08质量％的Ni和余量的Sn。 即使焊接有焊锡球的印刷电路板具有Cu电极或镀Au或Pd / Ni的Ni电极，焊球也具有良好的耐跌落冲击能力。 组合物还可以含有0.003〜0.1质量％的总量为0.003〜0.1质量％的Fe，Co，Pt中的至少一种元素，或选自Bi，In，Sb，P，Ge中的至少一种元素，总量为0.003 -0.1质量％。

公开(公告)号：US20160368105A1

公开(公告)日：2016-12-22

申请号：US15034194

申请日：2014-11-04

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： Takahiro Hattori ,  Daisuke Soma ,  Takahiro Roppongi ,  Isamu Sato

IPC分类号： B23K35/30 ,  C22C9/00 ,  C22C13/00 ,  B23K35/02 ,  B23K35/26

CPC分类号： B23K35/302 ,  B22F1/00 ,  B22F1/0048 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  C22C1/0483 ,  C22C9/00 ,  C22C13/00 ,  C23C28/021 ,  C25D3/60 ,  C25D7/00 ,  H01L23/556 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11825 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13455 ,  H01L2224/13457 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2224/81048 ,  H01L2224/81075 ,  H01L2224/81211 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3463 ,  H05K2201/0218 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01026 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01048 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01044 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/00012 ,  H01L2924/013

摘要： Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

摘要翻译： 提供了一种Cu芯球和cu型核心柱，其实现了对热循环的降低强度和强度。 Cu芯球（1）包含由Cu或Cu合金制成的Cu球（2）和由Sn和Cu组成的焊料合金制成并覆盖Cu球（2）的焊料层（3）。 焊料层（3）含有不少于0.1％至不超过3.0％的Cu，其余由Sn和杂质构成。

公开(公告)号：US20160351523A1

公开(公告)日：2016-12-01

申请号：US15112078

申请日：2014-12-26

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Koji YAMAZAKI

IPC分类号： H01L23/00 ,  B23K35/30 ,  B23K35/02 ,  H01L29/16 ,  C22F1/14 ,  C22C5/06 ,  B23K20/02 ,  H01L29/20

CPC分类号： H01L24/29 ,  B23K20/00 ,  B23K20/026 ,  B23K35/0233 ,  B23K35/30 ,  B23K35/3006 ,  B23K2101/40 ,  C22C5/06 ,  C22C12/00 ,  C22C13/00 ,  C22F1/14 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/36 ,  H01L24/40 ,  H01L24/83 ,  H01L29/1602 ,  H01L29/2003 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83101 ,  H01L2224/8383 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/3463 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099 ,  H01L2224/84

摘要： The present invention has an object to achieve bonding which satisfies both in heat resistivity and in stress-relaxation ability, and the bonding material according to this invention is a sheet-like bonding material 1 made of a silver-bismuth alloy which, when heated in a state being in contact with a metal material as a bonding target (for example, surface layers 2f, 3f), forms in the metal material (as its material, for example, gold, silver or copper) a diffusion layer Ld2, Ld3 of silver due to solid-phase diffusion reaction, so as to be bonded to the metal material, said bonding material being characterized by containing not less than 1 mass % but not more than 5 mass % of bismuth.

摘要翻译： 本发明的目的是实现在热电阻率和应力松弛能力方面均达到的结合，根据本发明的接合材料是由银 - 铋合金制成的片状接合材料1，当被加热 在作为接合靶（例如表面层2f，3f）的金属材料接触的状态下，在金属材料（作为其材料，例如金，银或铜）中形成扩散层Ld2，Ld3 银，由于固相扩散反应，为了与金属材料接合，所述接合材料的特征在于含有不少于1质量％但不多于5质量％的铋。

公开(公告)号：US20160339543A1

公开(公告)日：2016-11-24

申请号：US15196227

申请日：2016-06-29

申请人： Senju Metal Industry Co., Ltd.

发明人： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

IPC分类号： B23K35/02 ,  H05K3/34 ,  C22C13/00 ,  H01L23/00 ,  B23K1/00 ,  B23K35/26

CPC分类号： B23K35/0244 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B32B15/018 ,  C22C13/00 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/2076 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/207 ,  H01L2924/00014

摘要： Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board.

摘要翻译： 提供了将BGA（球栅阵列）或CSP（芯片尺寸封装）安装在印刷电路板上的工艺。 该工艺包括将焊膏和焊球融合在一起并熔接在一起。 焊球具有焊料组成，其包含Ag的0.5-1.1质量％，Cu的0.7-0.8质量％，Ni的0.05-0.08质量％，剩余的Sn。 在该过程中，将焊球放置在BGA或CSP衬底的电极上，并将焊膏施加到印刷电路板的相对电极上。

公开(公告)号：US20160316554A1

公开(公告)日：2016-10-27

申请号：US15075064

申请日：2016-03-18

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： ARATA KISHI ,  TADASHI MAEDA ,  TADAHIKO SAKAI

IPC分类号： H05K1/02 ,  B23K35/26 ,  H05K1/11 ,  B23K35/362 ,  H05K1/14 ,  B23K1/00 ,  B23K35/36

CPC分类号： H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613

摘要： A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

摘要翻译： 电路构件的连接结构包括第一电路构件，第二电路构件和接头部分。 第一电路部件具有设置有透光性电极的第一主面。 第二电路部件具有设置有金属电极的第二主面。 接头部分介于第一主表面和第二主表面之间。 接头部分包括树脂部分和焊料部分。 焊料部分电连接透光电极和金属电极。 透光电极含有包含铟和锡的氧化物，焊料部分含有铋和铟。

公开(公告)号：US09445508B2

公开(公告)日：2016-09-13

申请号：US14414453

申请日：2013-06-25

申请人： HARIMA CHEMICALS, INCORPORATED

发明人： Kensuke Nakanishi ,  Kosuke Inoue ,  Kazuya Ichikawa ,  Tetsuyuki Shigesada ,  Tadashi Takemoto

IPC分类号： C22C13/00 ,  C22C13/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/02 ,  H05K1/09

CPC分类号： H05K3/3457 ,  B23K35/025 ,  B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H05K1/092 ,  H05K3/3463 ,  H05K3/3484

摘要： A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.

摘要翻译： 焊锡合金是锡 - 银 - 铜焊料合金，并含有锡，银，铜，铋，镍和钴。 相对于焊料合金的总量，银含量为2质量％以上且4质量％以下，镍含量为0.01质量％以上且0.15质量％以下，钴含量为0.001质量％ 以上且0.008质量％以下。

公开(公告)号：US20160219721A1

公开(公告)日：2016-07-28

申请号：US14782658

申请日：2014-04-09

申请人： SHOWA DENKO K.K.

发明人： Takekazu SAKAI

IPC分类号： H05K3/34

CPC分类号： H05K3/3494 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/03442 ,  H01L2224/0347 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/8138 ,  H01L2224/814 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0789 ,  H05K2203/124 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01032 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for manufacturing a solder circuit board, the method including performing, in sequence, a resist formation step of partially coating a conductive circuit electrode surface on a printed wiring board with a resist, a tacky portion formation step of forming a tacky portion by imparting tackiness to a portion of the conductive circuit electrode surface not coated with the resist, a solder adhesion step of adhering a solder powder to the tacky portion, a resist removal step of removing the resist, and a first heating step of heating the printed wiring board and melting the solder powder.

摘要翻译： 一种用于制造焊接电路板的方法，该方法包括依次执行抗蚀剂形成步骤，用抗蚀剂在印刷电路板上部分地涂覆导电电路电极表面，通过赋予粘合部分形成粘性部分的粘性部分形成步骤 未涂覆抗蚀剂的导电电路电极表面的一部分的粘合性，将焊料粉末粘附到粘性部分的焊料粘合步骤，去除抗蚀剂的抗蚀剂去除步骤和加热印刷线路板的第一加热步骤 并熔化焊料粉末。

公开(公告)号：US09381595B2

公开(公告)日：2016-07-05

申请号：US14923853

申请日：2015-10-27

申请人： TDK CORPORATION

发明人： Tsutomu Yasui ,  Kenichi Kawabata

IPC分类号： H05K1/09 ,  B23K35/26 ,  H05K1/11 ,  H05K1/18 ,  C22C13/02 ,  C22C19/03 ,  B23K35/02

CPC分类号： B23K35/262 ,  B22F2998/10 ,  B23K35/0244 ,  C22C1/0433 ,  C22C1/0483 ,  C22C13/02 ,  C22C19/03 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0415 ,  B22F1/0003 ,  B22F9/082 ,  B22F2201/01

摘要： A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %.

摘要翻译： 无铅焊料包括至少包含Sn和Bi的第一金属和至少包含Ni-Fe合金的第二金属。 在第一金属中，Sn和Bi的总和为90质量％以上，Bi的比例为5〜15质量％。 第二金属与第一金属的质量和第二金属的质量之和为5〜30质量％。