公开(公告)号：US12057429B1

公开(公告)日：2024-08-06

申请号：US17356387

申请日：2021-06-23

申请人： HRL Laboratories, LLC

发明人： Aurelio Lopez ,  Peter Brewer ,  Partia Naghibi Mahmoudabadi ,  Erik Daniel ,  Tahir Hussain

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13013 ,  H01L2224/13016 ,  H01L2224/13144 ,  H01L2224/13466 ,  H01L2224/14051 ,  H01L2224/16057 ,  H01L2224/80201 ,  H01L2224/80986 ,  H01L2224/81053 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81379

摘要： A method for bonding two confronting electronic devices together wherein the two electronic devices are initially temporarily coupled together using a room temperature process with a plurality of knife-edge microstructures on at least a first one of the electronic devices engaging portions of the a second one of the electronic devices. The room temperature process involves applying a relatively low compressive force or pressure between the two electronic devices compared to the forces or pressures used in convention flip-chip bonding. The first one of the electronic devices and the second one of the electronic devices also have traditional contact pads that are spaced from each other by a standoff distance when the devices are initially coupled together using the room temperature process. This allows for inspection of the two electronic devices while they are initially temporarily coupled together. In need be, the two can be separated at this stage for re-work After passing inspection, a relatively higher compressive force or pressure is applied between the two electronic devices to cause the standoff distance to decrease to zero and for the contact pads confronting each other on the confronting two electronic devices to weld thereby permanently bonding the two electronic devices together.

公开(公告)号：US20240128230A1

公开(公告)日：2024-04-18

申请号：US18322774

申请日：2023-05-24

申请人： Samsung Electronics Co., Ltd.

发明人： Sinyeop LEE ,  Taegyu KANG ,  Jaeseon HWANG

IPC分类号： H01L23/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/12 ,  H01L25/065 ,  H01L25/18 ,  H10B80/00

CPC分类号： H01L24/81 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/0626 ,  B23K26/127 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L25/0657 ,  H01L25/18 ,  H10B80/00 ,  H01L2224/13211 ,  H01L2224/13239 ,  H01L2224/16227 ,  H01L2224/75263 ,  H01L2224/759 ,  H01L2224/81224 ,  H01L2224/81379 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1431 ,  H01L2924/1436

摘要： A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result. A soldering method includes calculating power of the light pulse based on a time width of the light pulse, measuring a temperature of the electronic device, and predicting a final rise temperature of the electronic device, based on the calculated power, a weight of the electronic device, the measured temperature, the quantity of exposures of the light pulse, and the irradiation period.

公开(公告)号：US20170194278A1

公开(公告)日：2017-07-06

申请号：US15433421

申请日：2017-02-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tung-Liang Shao ,  Chih-Hang Tung ,  Wen-Lin Shih ,  Hsiao-Yun Chen ,  Chen-Hua Yu

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L24/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K20/023 ,  B23K20/2333 ,  B23K2101/42 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/166 ,  B23K2103/18 ,  H01L21/563 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/08059 ,  H01L2224/08503 ,  H01L2224/13147 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/16503 ,  H01L2224/81012 ,  H01L2224/81022 ,  H01L2224/81365 ,  H01L2224/81379 ,  H01L2224/8181 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2924/01013 ,  H01L2924/01029

摘要： A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

公开(公告)号：US09576929B1

公开(公告)日：2017-02-21

申请号：US14997727

申请日：2016-01-18

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tung-Liang Shao ,  Chih-Hang Tung ,  Wen-Lin Shih ,  Hsiao-Yun Chen ,  Chen-Hua Yu

IPC分类号： H01L23/52 ,  H01L21/44 ,  H01L23/00 ,  B23K1/00 ,  B23K1/06

CPC分类号： H01L24/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K20/023 ,  B23K20/2333 ,  B23K2101/42 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/166 ,  B23K2103/18 ,  H01L21/563 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/08059 ,  H01L2224/08503 ,  H01L2224/13147 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/16503 ,  H01L2224/81012 ,  H01L2224/81022 ,  H01L2224/81365 ,  H01L2224/81379 ,  H01L2224/8181 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2924/01013 ,  H01L2924/01029

摘要： A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

摘要翻译： 一种方法包括执行第一打击过程以将第一包装部件的金属凸块抵靠第二包装部件的金属垫。 金属凸块和金属垫中的第一个包括铜。 金属凸块和金属垫中的第二个包括铝。 该方法还包括执行第二击打过程以将金属凸块撞击金属垫。 执行退火以将金属凸块接合在金属垫上。

公开(公告)号：US20230260957A1

公开(公告)日：2023-08-17

申请号：US17670320

申请日：2022-02-11

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-Jen CHENG ,  Wei-Jen WANG ,  Fu-Yuan CHEN

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/81 ,  H01L23/49822 ,  H01L24/29 ,  H01L2224/29006 ,  H01L2224/81379

摘要： An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.

公开(公告)号：US20170323863A1

公开(公告)日：2017-11-09

申请号：US15150342

申请日：2016-05-09

申请人： Amkor Technology, Inc.

发明人： Kyoung Yeon Lee ,  Tae Yong Lee ,  Min Chul Shin ,  Se Man Oh

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1111 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16012 ,  H01L2224/16013 ,  H01L2224/16057 ,  H01L2224/16104 ,  H01L2224/16238 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81359 ,  H01L2224/81379 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/014

摘要： A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and a method of manufacturing thereof, that comprises a substrate including a dielectric layer, at least one conductive trace and conductive bump pad formed on one surface of the dielectric layer, and a protection layer covering the at least one conductive trace and conductive bump pad, the at least one conductive bump pad having one end exposed through the protection layer, and a semiconductor die electrically connected to the conductive bump pad of the substrate.

公开(公告)号：US09570415B2

公开(公告)日：2017-02-14

申请号：US14696171

申请日：2015-04-24

申请人： Korea Advanced Institute of Science and Technology

发明人： Hyo Hoon Park ,  Suk Min Seo ,  Jong Hun Kim ,  Sun Kyu Han

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/02135 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/8102 ,  H01L2224/811 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81375 ,  H01L2224/81379 ,  H01L2224/81395 ,  H01L2224/8149 ,  H01L2224/81493 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/01014 ,  H01L2924/01006

摘要： A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

摘要翻译： 使用疏水性表面的芯片封装方法包括在形成在第一芯片或第一板和第二芯片或第二板之一上的超疏水表面的预定位置上形成亲水表面的超疏水表面，分别产生液体 分别形成在第一芯片或第一板上的一个上的亲水表面上的金属球和第二芯片或第二板中的一个上的金属球，并且将第一芯片或第一板中的一个和第二芯片 通过将第一芯片或第一板中的一个的液态金属球和第二芯片或第二板中的一个的液态金属球彼此结合而将芯片或第二板彼此结合。

公开(公告)号：US20150311177A1

公开(公告)日：2015-10-29

申请号：US14696171

申请日：2015-04-24

申请人： Korea Advanced Institute of Science and Technology

发明人： Hyo Hoon PARK ,  Suk Min SEO ,  Jong Hun KIM ,  Sun Kyu HAN

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/02135 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/8102 ,  H01L2224/811 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81375 ,  H01L2224/81379 ,  H01L2224/81395 ,  H01L2224/8149 ,  H01L2224/81493 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/01014 ,  H01L2924/01006

摘要： A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

摘要翻译： 使用疏水性表面的芯片封装方法包括在形成在第一芯片或第一板和第二芯片或第二板之一上的超疏水表面的预定位置上形成亲水表面的超疏水表面，分别产生液体 分别形成在第一芯片或第一板上的一个上的亲水表面上的金属球和第二芯片或第二板中的一个上的金属球，并且将第一芯片或第一板中的一个和第二芯片 通过将第一芯片或第一板中的一个的液态金属球和第二芯片或第二板中的一个的液态金属球彼此结合而将芯片或第二板彼此结合。

公开(公告)号：US20130181344A1

公开(公告)日：2013-07-18

申请号：US13691139

申请日：2012-11-30

申请人： Sanyo Electric Co., Ltd.

发明人： Yasuyuki Yanase ,  Ryosuke Usui

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/11 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/02319 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05564 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81379 ,  H01L2224/81444 ,  H01L2224/81895 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83379 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/01079 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05552 ,  H01L2924/00

摘要： Bump electrodes and wiring layers are formed by selectively removing a copper sheet while the copper sheet is being held on a supporting base by an adhesion layer. Subsequently, a device mounting board is formed by laminating an insulating resin layer in such a manner that Au/Ni layers are exposed on the bump electrodes and the adhesion layer. The device mounting board and a semiconductor device held on the supporting base are temporarily press-bonded to each other and then the supporting base and the adhesion layer are removed. Then the device mounting board and the semiconductor device are finally and permanently press-bonded together.

摘要翻译： 通过选择性地去除铜片而通过粘合层将铜片保持在支撑基底上形成凸起电极和布线层。 随后，通过以使Au / Ni层暴露在凸块电极和粘合层上的方式层压绝缘树脂层而形成器件安装板。 将装置安装板和保持在支撑基座上的半导体装置相互暂时压接，然后移除支撑基底和粘附层。 然后将器件安装板和半导体器件最终和永久地压合在一起。

公开(公告)号：US07960834B2

公开(公告)日：2011-06-14

申请号：US12256834

申请日：2008-10-23

申请人： Tatsuya Funaki

发明人： Tatsuya Funaki

IPC分类号： H01L23/492

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0331 ,  H01L2224/03505 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/1155 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/16501 ,  H01L2224/245 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/76155 ,  H01L2224/81055 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81379 ,  H01L2224/81594 ,  H01L2224/81639 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8284 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/19041 ,  Y10S977/779 ,  H01L2924/00014 ,  H01L2924/0543 ,  H01L2924/20107 ,  H01L2924/01014

摘要： An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.

摘要翻译： 一种电子元件，包括电子元件基底和电极，每个电极具有至少包含Al或Al合金的表面的第一电极和由金属纳米颗粒烧结体组成并结合到第一电极的第二电极。 第一电极和第二电极之间的接合界面具有多层结构，其包括从第一电极侧到第二电极侧，（a）主要由Al组成的第一层，（b）主要 由Al氧化物组成，（c）主要由Al和金属纳米颗粒的构成元素组成的第三层，和（d）主要由金属纳米颗粒的构成元素组成的第四层。