公开(公告)号：US20170131615A1

公开(公告)日：2017-05-11

申请号：US15043199

申请日：2016-02-12

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon Park ,  Jong Hun Kim ,  Sun Kyu Han

IPC: G02F1/295 ,  G02F1/025

CPC classification number: G02F1/2955 ,  G02F1/025 ,  G02F2001/0151 ,  G02F2202/36

Abstract: Disclosed is a device which constitutes a photonic phased array antenna. The device includes at least one light source, an optical power distributor configured to distribute a light wave generating from the light source, a phase controller configured to a phase of the light wave, and a light wave radiator configured to radiate the light wave into a space based on the controlled phase. Optical waveguides are connected between the light source and the optical power distributer, between the optical power distributor and the phase controller and between the phase controller and the light wave radiator, respectively.

公开(公告)号：US09477044B2

公开(公告)日：2016-10-25

申请号：US14690105

申请日：2015-04-17

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon Park ,  Jong Hun Kim ,  Sun Kyu Han

IPC: G02B6/12 ,  G02B6/28 ,  G02B6/43

CPC classification number: G02B6/2804 ,  G02B6/12002 ,  G02B6/43

Abstract: A waveguide of a 3D interconnection structure and an optical data bus system of a 3D interconnection structure using the same are provided. The waveguide includes a main waveguide which is formed in a predetermined direction and at least one branch waveguide which connects to the main waveguide to form a predetermined angle, wherein the at least one branch waveguide branches an optical signal, which is propagated in the main waveguide, at a predetermined rate.

Abstract translation: 提供了3D互连结构的波导和使用其的3D互连结构的光学数据总线系统。 波导包括沿预定方向形成的主波导和连接到主波导以形成预定角度的至少一个分支波导，其中至少一个分支波导分支在主波导中传播的光信号 ，以预定的速率。

公开(公告)号：US09570415B2

公开(公告)日：2017-02-14

申请号：US14696171

申请日：2015-04-24

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon Park ,  Suk Min Seo ,  Jong Hun Kim ,  Sun Kyu Han

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/02135 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/8102 ,  H01L2224/811 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81375 ,  H01L2224/81379 ,  H01L2224/81395 ,  H01L2224/8149 ,  H01L2224/81493 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/01014 ,  H01L2924/01006

Abstract: A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

Abstract translation: 使用疏水性表面的芯片封装方法包括在形成在第一芯片或第一板和第二芯片或第二板之一上的超疏水表面的预定位置上形成亲水表面的超疏水表面，分别产生液体 分别形成在第一芯片或第一板上的一个上的亲水表面上的金属球和第二芯片或第二板中的一个上的金属球，并且将第一芯片或第一板中的一个和第二芯片 通过将第一芯片或第一板中的一个的液态金属球和第二芯片或第二板中的一个的液态金属球彼此结合而将芯片或第二板彼此结合。

公开(公告)号：US10732483B2

公开(公告)日：2020-08-04

申请号：US15777074

申请日：2015-12-01

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Hyo Hoon Park ,  Jong Hun Kim ,  Sun Kyu Han ,  Ji Hwan Park

IPC: G02F1/295 ,  G02B6/34

Abstract: A photonic radiator device forming a photonic phased array antenna includes a light waveguide including a waveguide clad and a waveguide core using a semiconductor material, and a grating periodically formed an upper or lower part of the light waveguide. The photonic radiator device receives an input light wave in a direction of the grating and the light waveguide and radiates an output light wave to a space by using scattering from the grating.

公开(公告)号：US09740078B2

公开(公告)日：2017-08-22

申请号：US15043199

申请日：2016-02-12

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon Park ,  Jong Hun Kim ,  Sun Kyu Han

IPC: G02F1/29 ,  G02F1/295 ,  G02F1/025 ,  G02F1/015

CPC classification number: G02F1/2955 ,  G02F1/025 ,  G02F2001/0151 ,  G02F2202/36

Abstract: Disclosed is a device which constitutes a photonic phased array antenna. The device includes at least one light source, an optical power distributor configured to distribute a light wave generating from the light source, a phase controller configured a phase of the light wave, and a light wave radiator configured to radiate the light wave into a space based on the controlled phase. Optical waveguides are connected between the light source and the optical power distributor, between the optical power distributor and the phase controller and between the phase controller and the light wave radiator, respectively.