公开(公告)号：US20150311177A1

公开(公告)日：2015-10-29

申请号：US14696171

申请日：2015-04-24

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon PARK ,  Suk Min SEO ,  Jong Hun KIM ,  Sun Kyu HAN

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/02135 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/8102 ,  H01L2224/811 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81375 ,  H01L2224/81379 ,  H01L2224/81395 ,  H01L2224/8149 ,  H01L2224/81493 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/01014 ,  H01L2924/01006

Abstract: A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

Abstract translation: 使用疏水性表面的芯片封装方法包括在形成在第一芯片或第一板和第二芯片或第二板之一上的超疏水表面的预定位置上形成亲水表面的超疏水表面，分别产生液体 分别形成在第一芯片或第一板上的一个上的亲水表面上的金属球和第二芯片或第二板中的一个上的金属球，并且将第一芯片或第一板中的一个和第二芯片 通过将第一芯片或第一板中的一个的液态金属球和第二芯片或第二板中的一个的液态金属球彼此结合而将芯片或第二板彼此结合。