公开(公告)号：US20120312098A1

公开(公告)日：2012-12-13

申请号：US13591978

申请日：2012-08-22

Applicant: Yoshihito Abe ,  Shigeru Akiyama ,  Tatsuya Funaki

Inventor： Yoshihito Abe ,  Shigeru Akiyama ,  Tatsuya Funaki

IPC: G01N29/00

CPC classification number: A61B8/54 ,  A61B8/00 ,  A61B8/4416 ,  A61B8/56

Abstract: An ultrasonic diagnostic apparatus includes an memory, an determination unit, an instruction unit, a specifying unit, and an redetermination unit. The memory stores upper limit values of parameters for restricting the powers in display modes. The determination unit determines the powers in the modes so as not to exceed upper limit values of the parameters. The instruction unit inputs an instruction to increase/decrease the power of a specific mode. The specifying unit specifies the parameter value in the specific mode. The redetermination unit determines an upper limit value of the parameter in a mode different from the specific mode based on the upper limit value of the parameter in the specific mode and the parameter value specified by the specifying unit.

Abstract translation: 超声波诊断装置包括存储器，确定单元，指令单元，指定单元和重新确定单元。 存储器存储用于限制显示模式下的功率的参数的上限值。 确定单元确定模式中的功率，以便不超过参数的上限值。 指令单元输入增加/减少特定模式的功率的指令。 指定单位指定特定模式下的参数值。 重新确定单元基于特定模式中的参数的上限值和由指定单元指定的参数值，以与特定模式不同的模式来确定参数的上限值。

公开(公告)号：US08026506B2

公开(公告)日：2011-09-27

申请号：US12525448

申请日：2008-01-30

Applicant: Osamu Shiino ,  Yoshinori Iwabuchi ,  Ryo Sakurai ,  Tatsuya Funaki

Inventor： Osamu Shiino ,  Yoshinori Iwabuchi ,  Ryo Sakurai ,  Tatsuya Funaki

IPC: H01L29/15

CPC classification number: H01L29/7869 ,  H01L29/66969

Abstract: In a thin-film transistor comprising respective elements of: three electrodes of a source electrode, a drain electrode and a gate electrode; a channel layer; and a gate insulating film, at least the channel layer is formed by a metal oxide film including indium. Therefore, it is possible to obtain the thin-film transistor, which can manufacture an element to a polymer substrate without using a high temperature process and which can achieve a high performance and a high reliability at low cost.

Abstract translation: 在包括源电极，漏电极和栅电极的三个电极的各个元件的薄膜晶体管中; 一个通道层; 和栅极绝缘膜，至少沟道层由包含铟的金属氧化物膜形成。 因此，可以获得能够在不使用高温工艺的情况下制造聚合物基板的元件并且可以以低成本实现高性能和高可靠性的薄膜晶体管。

公开(公告)号：US20090214839A1

公开(公告)日：2009-08-27

申请号：US12438969

申请日：2007-08-31

Applicant: Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

Inventor： Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

IPC: B32B3/10 ,  B05D3/12

CPC classification number: H05K9/0096 ,  H05K1/02 ,  H05K3/182 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0709 ,  Y10T428/24917

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method.A process for the preparation of a light transmissive electromagnetic wave shielding material comprising;(A1) printing a pretreatment agent for electroless plating comprising a composite metal oxide and/or a composite metal oxide hydrate and a synthetic resin in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and(A3) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer on the pretreatment layer 13.

Abstract translation: 本发明提供一种通过简单的方法制备透光性好，电磁波屏蔽性优异，外观性优异，易读性好的透光性电磁波屏蔽材料的制造方法。 一种制备透光电磁波屏蔽材料的方法，包括： （A1）在透明基板11上印刷包括复合金属氧化物和/或复合金属氧化物水合物和网状图案的合成树脂的化学镀的预处理剂以形成网状图案化预处理层12，和（A3） 对预处理层12进行化学镀以在预处理层13上形成网格图案化的金属导电层。

公开(公告)号：US09480460B2

公开(公告)日：2016-11-01

申请号：US13591978

申请日：2012-08-22

Applicant: Yoshihito Abe ,  Shigeru Akiyama ,  Tatsuya Funaki

Inventor： Yoshihito Abe ,  Shigeru Akiyama ,  Tatsuya Funaki

IPC: A61B8/00

CPC classification number: A61B8/54 ,  A61B8/00 ,  A61B8/4416 ,  A61B8/56

Abstract: An ultrasonic diagnostic apparatus includes an memory, an determination unit, an instruction unit, a specifying unit, and an redetermination unit. The memory stores upper limit values of parameters for restricting the powers in display modes. The determination unit determines the powers in the modes so as not to exceed upper limit values of the parameters. The instruction unit inputs an instruction to increase/decrease the power of a specific mode. The specifying unit specifies the parameter value in the specific mode. The redetermination unit determines an upper limit value of the parameter in a mode different from the specific mode based on the upper limit value of the parameter in the specific mode and the parameter value specified by the specifying unit.

Abstract translation: 超声波诊断装置包括存储器，确定单元，指令单元，指定单元和重新确定单元。 存储器存储用于限制显示模式下的功率的参数的上限值。 确定单元确定模式中的功率，以便不超过参数的上限值。 指令单元输入增加/减少特定模式的功率的指令。 指定单位指定特定模式下的参数值。 重新确定单元基于特定模式中的参数的上限值和由指定单元指定的参数值，以与特定模式不同的模式来确定参数的上限值。

公开(公告)号：US07611746B2

公开(公告)日：2009-11-03

申请号：US11431608

申请日：2006-05-11

Applicant: Tatsuya Funaki ,  Hidefumi Kotsubo ,  Kiyomi Sasaki

Inventor： Tatsuya Funaki ,  Hidefumi Kotsubo ,  Kiyomi Sasaki

IPC: B05D5/12 ,  C08F2/48

CPC classification number: H05K9/0005 ,  C03C17/34 ,  C03C2217/476 ,  C03C2217/479 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/31 ,  H01J2211/446 ,  H05K9/0096

Abstract: A method for producing an electromagnetic-wave-shielding light-transmitting window member comprising a transparent substrate and a conductive pattern formed by electroless plating on a surface of the transparent substrate. In the method, an ultraviolet-curable resin paste containing an electroless plating catalyst is applied to a surface of a transparent substrate, and the resulting printed pattern is cured by irradiation of ultraviolet light to form a resin pattern. Subsequently, a plating layer is deposited on the resin pattern by electroless plating treatment to form a conductive pattern. The ultraviolet-curable resin paste is selected from a group of sublimable resists and phthalocyanine-based sublimable materials and contains a volatile substance that is volatized by heating or irradiation. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.

Abstract translation: 一种制造电磁波屏蔽透光窗构件的方法，包括透明基板和通过在所述透明基板的表面上通过无电镀形成的导电图案。 在该方法中，将含有化学镀催化剂的紫外线固化型树脂糊剂涂布于透明基板的表面，通过紫外线照射使得印刷图案固化，形成树脂图案。 随后，通过化学镀处理在树脂图案上沉积镀层以形成导电图案。 紫外线固化树脂糊剂选自一组可升华的抗蚀剂和基于酞菁的可升华材料，并且含有通过加热或照射而挥发的挥发性物质。 通过使用紫外线固化树脂浆料，可以以高精度，高效率，低成本地形成对透明基板具有优异粘合性的良好导电图案。

公开(公告)号：US20070036888A1

公开(公告)日：2007-02-15

申请号：US11431608

申请日：2006-05-11

Applicant: Tatsuya Funaki ,  Hidefumi Kotsubo ,  Kiyomi Sasaki

Inventor： Tatsuya Funaki ,  Hidefumi Kotsubo ,  Kiyomi Sasaki

IPC: B05D5/12

CPC classification number: H05K9/0005 ,  C03C17/34 ,  C03C2217/476 ,  C03C2217/479 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/31 ,  H01J2211/446 ,  H05K9/0096

Abstract: An ultraviolet-curable resin paste containing an electroless plating catalyst is applied by printing to a surface of a transparent substrate 1, and the resulting printed pattern 2 is cured by irradiation of ultraviolet light to form a resin pattern 3. Subsequently, a plating layer 4 is deposited on the resin pattern 3 by electroless plating treatment to form a conductive pattern 5. The resin pattern 3 to be subjected to the electroless plating treatment has an uncured layer 3A provided on a surface thereof. During the electroless plating treatment, the uncured layer 3A is eroded in the plating bath and particles of the catalyst are exposed. It is possible to form a satisfactory plating layer 4 using the exposed catalyst particles as nuclei. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.

Abstract translation: 通过印刷将含有化学镀催化剂的紫外线固化树脂糊剂施加到透明基板1的表面，并且通过紫外线的照射使得到的印刷图案2固化以形成树脂图案3。 随后，通过化学镀处理在树脂图案3上沉积镀层4以形成导电图案5。 要进行化学镀处理的树脂图案3具有设置在其表面上的未固化层3A。 在化学镀处理期间，未镀层3A在电镀槽中被侵蚀，并且催化剂的颗粒被暴露。 可以使用暴露的催化剂颗粒作为核形成令人满意的镀层4。 通过使用紫外线固化树脂浆料，可以以高精度，高效率，低成本地形成对透明基板具有优异粘合性的良好导电图案。

公开(公告)号：US20100003474A1

公开(公告)日：2010-01-07

申请号：US12376033

申请日：2007-08-03

Applicant: Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

Inventor： Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

IPC: B32B3/10 ,  B05D5/12 ,  C25D5/02 ,  H05K9/00

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/30 ,  C23C18/31 ,  H05K3/182 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2203/0709 ,  H05K2203/124 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2826

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method.A process for the preparation of a light transmissive electromagnetic wave shielding material comprising;(A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and(A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract translation: 本发明提供一种通过简单的方法制备透光性好，电磁波屏蔽性优异，外观性优异，易读性好的透光性电磁波屏蔽材料的制造方法。 一种制备透光电磁波屏蔽材料的方法，包括： （A1）在透明基板11上印刷包含贵金属化合物和硅烷偶联剂和唑化合物的混合物或其反应产物的化学镀的预处理剂，以形成网状图案化预处理层12，以及 （A2）对预处理层12进行化学镀以在预处理层12上形成网格图案化的金属导电层13。

公开(公告)号：US06768062B2

公开(公告)日：2004-07-27

申请号：US09973822

申请日：2001-10-11

Applicant: Ryoichi Morimoto ,  Jitsuho Hirota ,  Tatsuya Funaki

Inventor： Ryoichi Morimoto ,  Jitsuho Hirota ,  Tatsuya Funaki

IPC: H05K116

CPC classification number: H01L24/81 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/171 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/10674 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.

Abstract translation: 对于组件侧焊盘电极和基板侧焊盘电极使用焊料凸块的连接方法和连接结构以及适用于高密度安装的连接状态的检查方法，并且允许形成的产品的小型化 通过将表面安装部件安装到基板上。 基板侧焊盘电极布置在部件对应区域A的内部; 基板侧焊盘电极的长度被设定为大于相应的部件侧焊盘电极的长度; 将IC芯片（表面安装部件）放置在基板上，使得每个焊料凸块与预定的基板侧焊盘电极相对; 并且焊料凸块通过加热而熔化，从而通过焊料将每个组件侧焊盘电极和一个基板侧焊盘电极连接起来。

公开(公告)号：US07960834B2

公开(公告)日：2011-06-14

申请号：US12256834

申请日：2008-10-23

Applicant: Tatsuya Funaki

Inventor： Tatsuya Funaki

IPC: H01L23/492

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0331 ,  H01L2224/03505 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/1155 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/16501 ,  H01L2224/245 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/76155 ,  H01L2224/81055 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81379 ,  H01L2224/81594 ,  H01L2224/81639 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8284 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/19041 ,  Y10S977/779 ,  H01L2924/00014 ,  H01L2924/0543 ,  H01L2924/20107 ,  H01L2924/01014

Abstract: An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.

Abstract translation: 一种电子元件，包括电子元件基底和电极，每个电极具有至少包含Al或Al合金的表面的第一电极和由金属纳米颗粒烧结体组成并结合到第一电极的第二电极。 第一电极和第二电极之间的接合界面具有多层结构，其包括从第一电极侧到第二电极侧，（a）主要由Al组成的第一层，（b）主要 由Al氧化物组成，（c）主要由Al和金属纳米颗粒的构成元素组成的第三层，和（d）主要由金属纳米颗粒的构成元素组成的第四层。

公开(公告)号：US07931518B2

公开(公告)日：2011-04-26

申请号：US12376033

申请日：2007-08-03

Applicant: Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

Inventor： Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

IPC: H01J9/12

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/30 ,  C23C18/31 ,  H05K3/182 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2203/0709 ,  H05K2203/124 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2826

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method.A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract translation: 本发明提供一种通过简单的方法制备透光性好，电磁波屏蔽性优异，外观性优异，易读性好的透光性电磁波屏蔽材料的制造方法。 一种制备透光电磁波屏蔽材料的方法，包括： （A1）在透明基板11上印刷包含贵金属化合物和硅烷偶联剂和唑化合物的混合物或其反应产物的化学镀的预处理剂，以形成网状图案化预处理层12，以及 （A2）对预处理层12进行化学镀以在预处理层12上形成网格图案化的金属导电层13。