公开(公告)号：US10056670B2

公开(公告)日：2018-08-21

申请号：US14857943

申请日：2015-09-18

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H01P3/12 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC分类号： H01P3/121 ,  H01L21/4846 ,  H01L23/498 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2203/016 ,  H05K2203/308 ,  H01L2924/00

摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

公开(公告)号：US09059317B2

公开(公告)日：2015-06-16

申请号：US14162959

申请日：2014-01-24

申请人： HARRIS CORPORATION

发明人： Louis Joseph Rendek, Jr. ,  Michael Raymond Weatherspoon ,  Casey Philip Rodriguez ,  David Nicol

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H05K1/03 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L23/3157 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/33 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11422 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/281 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0141 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00

摘要： A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.

摘要翻译： 制造电子器件的方法包括在刚性晶片衬底上形成互连层堆叠，所述刚性晶片衬底具有多个图案化电导体层，相邻图案化电导体层之间的介电层，以及位于最上图案化电导体层上的至少一个焊盘 。 形成具有与至少一个焊盘对准的至少一个孔的LCP焊接掩模。 将LCP焊接掩模和互连层堆叠对齐并层压在一起。 焊料定位在至少一个孔中。 使用焊料将至少一个电路部件连接到至少一个焊盘。

公开(公告)号：US20150069621A1

公开(公告)日：2015-03-12

申请号：US14023799

申请日：2013-09-11

申请人： Harris Corporation

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR.

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/08 ,  A61N1/375 ,  A61N1/3758 ,  H01L21/2885 ,  H01L21/4817 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/52 ,  H01L21/56 ,  H01L23/293 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/1421 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10151 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.

摘要翻译： 电子封装包括半导体管芯，从半导体管芯向外延伸的导电柱，以及围绕半导体管芯的液晶聚合物（LCP）体，并且在其中具有开口，接收相应的导电柱。 第一互连层位于LCP主体上并接触开口。 导电体在开口中，以将导电柱连接到第一互连层。

公开(公告)号：US20150009644A1

公开(公告)日：2015-01-08

申请号：US13934465

申请日：2013-07-03

申请人： HARRIS CORPORATION

发明人： Louis Joseph RENDEK, JR. ,  Casey Philip Rodriguez ,  Travis L. Kerby ,  Michael Raymond Weatherspoon

IPC分类号： H05K1/18 ,  H01L23/00 ,  H05K1/11

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81855 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83359 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01L2924/381 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/181 ,  H05K3/287 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10212 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.

摘要翻译： 一种制造电子器件的方法包括在衬底上形成导电图案，在衬底上形成覆盖层和导电图案，以及在覆盖层中形成与导电图案对准的开口。 该方法还包括将IC定位在覆盖层上，使得IC的接合焊盘与开口对准，并且在压力下加热覆盖层以对IC进行机械固定和电互连。

公开(公告)号：US09892984B2

公开(公告)日：2018-02-13

申请号：US15234094

申请日：2016-08-11

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr.

IPC分类号： H01L29/40 ,  H01L23/08 ,  H01L23/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H01L21/288 ,  H01L21/48 ,  H01L21/52 ,  H01L23/498 ,  H01L23/522 ,  A61N1/375 ,  H05K1/11

CPC分类号： H01L23/08 ,  A61N1/375 ,  A61N1/3758 ,  H01L21/2885 ,  H01L21/4817 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/52 ,  H01L21/56 ,  H01L23/293 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/1421 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10151 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.

公开(公告)号：US09691698B2

公开(公告)日：2017-06-27

申请号：US15205416

申请日：2016-07-08

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  David B. Nicol ,  Louis Joseph Rendek, Jr.

IPC分类号： H05K1/00 ,  H01L23/498 ,  H01L21/683 ,  H01L25/065 ,  H05K1/18 ,  H01L25/00 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H01L21/48 ,  H05K3/34 ,  H05K3/46 ,  H01L23/00

CPC分类号： H01L23/4985 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48229 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1511 ,  H01L2924/1579 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/32 ,  H05K3/3436 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4632 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49224 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

公开(公告)号：US09681543B2

公开(公告)日：2017-06-13

申请号：US15049363

申请日：2016-02-22

申请人： HARRIS CORPORATION

发明人： Louis Joseph Rendek, Jr. ,  Travis L. Kerby ,  Casey Philip Rodriguez ,  Michael Raymond Weatherspoon

IPC分类号： H01L21/00 ,  H05K1/11 ,  H01L23/00 ,  H05K3/28 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H01L23/498 ,  H01L21/48 ,  H05K3/34

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81855 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83359 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2924/12042 ,  H01L2924/381 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/181 ,  H05K3/287 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10212 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.

公开(公告)号：US09655236B2

公开(公告)日：2017-05-16

申请号：US14532224

申请日：2014-11-04

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Casey Philip Rodriguez

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K3/42

CPC分类号： H05K1/0298 ,  H05K1/09 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0141 ,  H05K2201/09545 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions.

公开(公告)号：US20140217618A1

公开(公告)日：2014-08-07

申请号：US13761833

申请日：2013-02-07

申请人： HARRIS CORPORATION

发明人： Andrew Craig KING ,  Michael Raymond Weatherspoon ,  Louis J. Rendek, JR.

IPC分类号： H01L21/762 ,  H01L23/498

CPC分类号： H01L23/498 ,  H01L24/29 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29011 ,  H01L2224/29017 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81444 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof.

摘要翻译： 制造电子器件的方法包括在衬底上形成导电图案，在衬底上形成覆盖层和导电图案，在覆盖层上形成部分固化的粘性层，并在覆盖层中形成开口 以及与导电图案对准的部分固化的粘性层。 该方法包括将IC定位在部分固化的粘性粘合剂层上，然后固化部分固化的粘性粘合剂层，从而同时机械地固定并将IC电连接到基底上，该IC在其表面上具有接合焊盘。

公开(公告)号：US09443789B2

公开(公告)日：2016-09-13

申请号：US14023799

申请日：2013-09-11

申请人： Harris Corporation

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr.

IPC分类号： H01L29/40 ,  H01L23/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  A61N1/375 ,  H05K1/11

CPC分类号： H01L23/08 ,  A61N1/375 ,  A61N1/3758 ,  H01L21/2885 ,  H01L21/4817 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/52 ,  H01L21/56 ,  H01L23/293 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/1421 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10151 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.

摘要翻译： 电子封装包括半导体管芯，从半导体管芯向外延伸的导电柱，以及围绕半导体管芯的液晶聚合物（LCP）体，并且在其中具有开口，接收相应的导电柱。 第一互连层位于LCP主体上并接触开口。 导电体在开口中，以将导电柱连接到第一互连层。