公开(公告)号：US10818448B2

公开(公告)日：2020-10-27

申请号：US15890532

申请日：2018-02-07

申请人： HARRIS CORPORATION

发明人： Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Paul Brian Jaynes ,  Philip Anthony Marvin

IPC分类号： H01H13/704 ,  H05K3/30 ,  H05K3/46 ,  H01H11/00 ,  H05K1/02

摘要： A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

公开(公告)号：US09655236B2

公开(公告)日：2017-05-16

申请号：US14532224

申请日：2014-11-04

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Casey Philip Rodriguez

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K3/42

CPC分类号： H05K1/0298 ,  H05K1/09 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0141 ,  H05K2201/09545 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions.

公开(公告)号：US10056670B2

公开(公告)日：2018-08-21

申请号：US14857943

申请日：2015-09-18

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H01P3/12 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC分类号： H01P3/121 ,  H01L21/4846 ,  H01L23/498 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2203/016 ,  H05K2203/308 ,  H01L2924/00

摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

公开(公告)号：US09922783B2

公开(公告)日：2018-03-20

申请号：US14810507

申请日：2015-07-28

申请人： HARRIS CORPORATION

发明人： Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Paul Brian Jaynes ,  Philip Anthony Marvin

IPC分类号： H05K1/02 ,  H01H13/704 ,  H05K3/30 ,  H05K3/46 ,  H01H11/00

CPC分类号： H01H13/704 ,  H01H11/00 ,  H05K1/0284 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/49107 ,  Y10T29/4913

摘要： A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with a compressible dielectric material, and positioning at least one biasing member in the membrane switch recess.

公开(公告)号：US11657989B2

公开(公告)日：2023-05-23

申请号：US17029282

申请日：2020-09-23

申请人： HARRIS CORPORATION

发明人： Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Paul Brian Jaynes ,  Philip Anthony Marvin

IPC分类号： H01H13/704 ,  H05K3/30 ,  H05K3/46 ,  H01H11/00 ,  H05K1/02

CPC分类号： H01H13/704 ,  H01H11/00 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K1/0284 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/4913 ,  Y10T29/49107

摘要： A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

公开(公告)号：US09159485B2

公开(公告)日：2015-10-13

申请号：US13972286

申请日：2013-08-21

申请人： HARRIS CORPORATION

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F41/04 ,  H05K1/16 ,  H05K3/20 ,  H05K3/14 ,  H05K3/16

CPC分类号： H01F27/2804 ,  H01F5/00 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H05K1/165 ,  H05K3/146 ,  H05K3/16 ,  H05K3/20 ,  H05K2201/0141 ,  H05K2201/0305 ,  H05K2201/1003 ,  H05K2203/016 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

摘要翻译： 一种制造电感器的方法。 该方法包括形成具有牺牲衬底的第一子单元和限定电感器并且在牺牲衬底上包括第一金属的导电层。 该方法包括形成具有电介质层和导电层的第二子单元，其上限定电感器端子并具有第一金属，并且将第二金属涂覆到第一和第二子单元之一的第一金属上。 该方法包括将第一和第二子单元对齐在一起，加热和压缩对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基板。