知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

384 条记录 (耗时 0.023 秒)

    Inductor design with metal dummy features
    3.
    发明授权
    Inductor design with metal dummy features 有权
    具有金属虚拟特征的电感器设计

    公开(公告)号：US09418783B2

    公开(公告)日：2016-08-16

    申请号：US13976080

    申请日：2011-12-29

    申请人： Mohammed A. El-Tanani ,  Jad B. Rizk

    发明人： Mohammed A. El-Tanani ,  Jad B. Rizk

    IPC分类号： H01F27/36 ,  H01F5/00 ,  H01F7/06 ,  H01F27/28 ,  H01L23/522 ,  H01L49/02 ,  H01F17/00 ,  H01F41/04

    CPC分类号： H01F27/2804 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H01L23/522 ,  H01L23/5227 ,  H01L28/10 ,  H01L2924/0002 ,  Y10T29/4902 ,  H01L2924/00

    摘要： Techniques are disclosed for enhancing performance of integrated or on-chip inductors by implementing a schema of conductive metal dummies in the design thereof. In some cases, a metal dummy schema may be disposed in a layer proximate an upper surface of the inductor. The techniques may be implemented to improve overall inductor performance while enabling area scaling effects such as shrinking of inductor-to-inductor spacing on a die and/or increasing the quantity of inductors that may be manufactured on a die. In some cases, conductive metal dummies may be disposed in a region of minimal or non-peak magnetic field relative to the inductor, orthogonal to current flow in the inductor, and/or so as to minimize their occupation of the overall area of the inductor. The techniques may be implemented in analog circuits such as inductor-capacitor phase-locked loops (LC-PLLs), high-volume architectures, processor microarchitectures, applications involving stringent jitter requirements, microprocessor clocking, and wireless communication systems.

    摘要翻译： 公开了通过在其设计中实现导电金属假人的图案来提高集成或片上电感器的性能的技术。 在一些情况下，金属虚拟模式可以设置在靠近电感器的上表面的层中。 可以实施这些技术以改善总体电感器性能，同时实现区域缩放效应，例如在管芯上的电感器 - 电感器间隔的缩小和/或增加可在模具上制造的电感器的数量。 在一些情况下，导电金属假模可以设置在相对于电感器的最小或非峰值磁场的区域中，与电感器中的电流正交，和/或以使其对电感器的整个面积的占用最小化 。 这些技术可以在诸如电感器 - 电容器锁相环（LC-PLL），大容量架构，处理器微体系结构，涉及严格抖动要求的应用，微处理器时钟和无线通信系统的模拟电路中实现。

    Bridge magnetic devices and associated systems and methods
    4.
    发明授权
    Bridge magnetic devices and associated systems and methods 有权
    桥磁装置及相关系统及方法

    公开(公告)号：US09281739B2

    公开(公告)日：2016-03-08

    申请号：US13598281

    申请日：2012-08-29

    申请人： Alexandr Ikriannikov

    发明人： Alexandr Ikriannikov

    IPC分类号： H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H02M1/14 ,  H01F17/00 ,  H02M3/158

    CPC分类号： H02M1/14 ,  H01F17/0033 ,  H01F2017/0046 ,  H02M3/1584

    摘要： An electrical assembly includes a substrate, a bridge magnetic device disposed on an outer surface of the substrate, and at least one electrical component. The bridge magnetic device includes (1) a magnetic core disposed over and offset from a first portion of the outer surface of the substrate, (2) N windings wound around at least a portion of the magnetic core and electrically coupled to conductors of the substrate, where N is an integer greater than zero, and (3) a ground return conductor disposed on an outer surface of the magnetic core facing the first portion of the outer surface of the substrate. The at least one electrical component is disposed on the first portion of the outer surface of the substrate.

    摘要翻译： 电组件包括衬底，布置在衬底的外表面上的桥磁装置和至少一个电组件。 桥式磁性装置包括（1）设置在基板的外表面的第一部分上方并偏离的磁芯，（2）缠绕在磁芯的至少一部分上的N个绕组，并且电耦合到基板的导体 ，其中N是大于零的整数，以及（3）设置在面向基板的外表面的第一部分的磁芯的外表面上的接地回路导体。 至少一个电气部件设置在基板的外表面的第一部分上。

    CONTROL DEVICE OF LC CIRCUIT USING SPIRAL INDUCTOR
    7.
    发明申请
    CONTROL DEVICE OF LC CIRCUIT USING SPIRAL INDUCTOR 审中-公开
    使用螺旋电感的LC电路的控制装置

    公开(公告)号：US20150109067A1

    公开(公告)日：2015-04-23

    申请号：US14356888

    申请日：2012-04-12

    申请人： Jong Hoon Park ,  Chang Kun Park

    发明人： Jong Hoon Park ,  Chang Kun Park

    IPC分类号： H03H11/04

    CPC分类号： H03H11/04 ,  H01F19/04 ,  H01F2017/0046 ,  H01F2017/0073 ,  H01G4/40 ,  H03H5/006 ,  H03H7/0115

    摘要： Provided is a control device of a LC circuit using a spiral inductor, comprising: a spiral inductor in which a first metal line connected to a first terminal and a second metal line connected to a second terminal cross at least one time to be connected in a spiral shape, and that includes at least one crossing part; at least one transistor in which a drain terminal and a source terminal are respectively connected to a first metal line portion and a second metal line portion that correspond to the crossing part; a variable capacitor that is connected to a first terminal and a second terminal of the spiral inductor in parallel; and a controller that respectively sends control signals to the transistor and the variable capacitor to control a resonant frequency or an output.

    摘要翻译： 提供了一种使用螺旋电感器的LC电路的控制装置，包括：螺旋电感器，其中连接到第一端子的第一金属线和连接到第二端子的第二金属线至少跨越至少一次以连接到 螺旋形，并且包括至少一个交叉部分; 至少一个晶体管，其中漏极端子和源极端子分别连接到对应于所述交叉部分的第一金属线部分和第二金属线部分; 连接到螺旋电感器的第一端子和第二端子的可变电容器并联; 以及分别向晶体管和可变电容器发送控制信号以控制谐振频率或输出的控制器。

    Bridge Magnetic Devices And Associated Systems And Methods
    8.
    发明申请
    Bridge Magnetic Devices And Associated Systems And Methods 有权
    桥磁设备及相关系统及方法

    公开(公告)号：US20140062446A1

    公开(公告)日：2014-03-06

    申请号：US13598281

    申请日：2012-08-29

    申请人： Alexandr Ikriannikov

    发明人： Alexandr Ikriannikov

    IPC分类号： H01F5/00 ,  G05F3/02

    CPC分类号： H02M1/14 ,  H01F17/0033 ,  H01F2017/0046 ,  H02M3/1584

    摘要： An electrical assembly includes a substrate, a bridge magnetic device disposed on an outer surface of the substrate, and at least one electrical component. The bridge magnetic device includes (1) a magnetic core disposed over and offset from a first portion of the outer surface of the substrate, (2) N windings wound around at least a portion of the magnetic core and electrically coupled to conductors of the substrate, where N is an integer greater than zero, and (3) a ground return conductor disposed on an outer surface of the magnetic core facing the first portion of the outer surface of the substrate. The at least one electrical component is disposed on the first portion of the outer surface of the substrate.

    摘要翻译： 电组件包括衬底，布置在衬底的外表面上的桥磁装置和至少一个电组件。 桥式磁性装置包括（1）设置在基板的外表面的第一部分上方并偏离的磁芯，（2）缠绕在磁芯的至少一部分上的N个绕组，并且电耦合到基板的导体 ，其中N是大于零的整数，以及（3）设置在面向基板的外表面的第一部分的磁芯的外表面上的接地回路导体。 至少一个电气部件设置在基板的外表面的第一部分上。

    INTEGRATED CIRCUIT INDUCTOR WITH INTEGRATED VIAS
    10.
    发明申请
    INTEGRATED CIRCUIT INDUCTOR WITH INTEGRATED VIAS 有权
    具有集成VIAS的集成电路电感器

    公开(公告)号：US20110133880A1

    公开(公告)日：2011-06-09

    申请号：US13027903

    申请日：2011-02-15

    申请人： Robert L. Pitts ,  Greg C. Baldwin

    发明人： Robert L. Pitts ,  Greg C. Baldwin

    IPC分类号： H01F5/00

    CPC分类号： H01L28/10 ,  H01F17/0013 ,  H01F2017/0046 ,  H01L23/5227 ,  H01L27/08 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Integrated circuit inductors (5) are formed by interconnecting various metal layers (10) in an integrated circuit with continuous vias (200). Using continuous vias (200) improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three percent of the length of the inductor (5).

    摘要翻译： 集成电路电感器（5）通过将具有连续通孔（200）的集成电路中的各种金属层（10）互连而形成。 使用连续通孔（200）改善了与现有高频应用方法相比的Q因子。 连续通孔的连续长度应大于电感器（5）长度的三分之一。