Method for making three-dimensional liquid crystal polymer multilayer circuit boards
    1.
    发明授权
    Method for making three-dimensional liquid crystal polymer multilayer circuit boards 有权
    制备三维液晶聚合物多层电路板的方法

    公开(公告)号:US08778124B2

    公开(公告)日:2014-07-15

    申请号:US12016060

    申请日:2008-01-17

    IPC分类号: B32B37/00

    摘要: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

    摘要翻译: 一种制造非平面三维(3D)多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物(LCP)层的层叠布置,其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠的布置以将堆叠布置形成非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起,从而形成非平面3D 多层电路板。

    Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
    7.
    发明授权
    Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods 有权
    具有液晶聚合物焊接掩模和外密封层的电子器件及相关方法

    公开(公告)号:US08472207B2

    公开(公告)日:2013-06-25

    申请号:US13007072

    申请日:2011-01-14

    IPC分类号: H05K1/18

    摘要: An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

    摘要翻译: 电子器件包括其上具有电路层的衬底,其具有焊盘。 在基板上有一个液晶聚合物(LCP)焊接掩模,其具有与焊盘对准的孔。 在基板和LCP焊接掩模之间存在熔接。 焊料在孔中,并且电路部件通过焊料电耦合到焊盘。 具有第一多个电介质层的第一介电层堆叠在LCP焊接掩模上,并且具有与焊盘对准的孔。 在第一介电层堆叠上存在第一LCP外密封层,以及第二介电层堆叠,其在与LCP焊接掩模相对的一侧上的衬底上具有第二多个电介质层。 此外,在第二介质层堆叠上存在第二LCP外密封层。

    BATTERY CELL FOR MEMS DEVICE AND RELATED METHODS
    8.
    发明申请
    BATTERY CELL FOR MEMS DEVICE AND RELATED METHODS 有权
    用于MEMS器件的电池单元及相关方法

    公开(公告)号:US20110095720A1

    公开(公告)日:2011-04-28

    申请号:US12607472

    申请日:2009-10-28

    摘要: A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer.

    摘要翻译: 微机电系统(MEMS)装置包括MEMS基板和MEMS基板上的至少一个MEMS结构。 此外,在MEMS衬底上存在至少一个耦合到至少一个MEMS结构的电池单元。 所述至少一个电池单元包括从所述MEMS基板垂直向上延伸的支撑翅片和所述支撑翅片上的第一电极层。 此外,阴极层上存在电解质层,电解质层上具有第二电极层。 支撑翅片可以具有高于宽度的高度。 第一电极层可以具有与其相关联的处理温度,其超过与第二电极层相关联的稳定性温度。