发明申请
US20150009644A1 METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS AND RELATED DEVICES
有权
用于制造具有开口的封装层和相关器件的电子器件的方法
- 专利标题： METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS AND RELATED DEVICES
- 专利标题（中）： 用于制造具有开口的封装层和相关器件的电子器件的方法
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申请号： US13934465申请日： 2013-07-03
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公开(公告)号： US20150009644A1公开(公告)日： 2015-01-08
- 发明人: Louis Joseph RENDEK, JR. , Casey Philip Rodriguez , Travis L. Kerby , Michael Raymond Weatherspoon
- 申请人： HARRIS CORPORATION
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L23/00 ; H05K1/11
摘要：
A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.
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