公开(公告)号：US09373595B2

公开(公告)日：2016-06-21

申请号：US14342935

申请日：2012-08-08

申请人： Daisuke Sakurai ,  Kazuya Usirokawa ,  Kiyomi Hagihara

发明人： Daisuke Sakurai ,  Kazuya Usirokawa ,  Kiyomi Hagihara

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B23K35/24 ,  B23K35/26 ,  B23K35/00 ,  B23K35/02

CPC分类号： H01L24/10 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/24 ,  B23K35/262 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/11 ,  H01L2224/1144 ,  H01L2224/11464 ,  H01L2224/1182 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/381 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00

摘要： In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal (4) of an electronic component (1) and an electrode terminal (5) of a substrate (2) contains an alloy (8) and a metal (9) having a lower modulus of elasticity than the alloy (8). The junction has a cross section structure in which the alloy (8) is surrounded by the metal (9) having the lower modulus of elasticity.

摘要翻译： 在所提供的安装结构中，诸如具有脆弱膜的半导体芯片的电子部件安装在具有较高连接可靠性的诸如电路板的基板上。 连接电子部件（1）的电极端子（4）和基板（2）的电极端子（5）的接合部包含合金（8）和具有低于 合金（8）。 接头具有横截面结构，其中合金（8）被具有较低弹性模量的金属（9）包围。

公开(公告)号：US08921708B2

公开(公告)日：2014-12-30

申请号：US13821521

申请日：2011-09-22

申请人： Daisuke Sakurai ,  Kazuya Usirokawa

发明人： Daisuke Sakurai ,  Kazuya Usirokawa

IPC分类号： H05K1/11 ,  H05K7/06 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L23/36 ,  H01L21/48 ,  H01L23/544 ,  H05K1/02 ,  H01L23/367

CPC分类号： H05K7/06 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/023 ,  H01L2224/02372 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/11442 ,  H01L2224/11464 ,  H01L2224/1182 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/14179 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/02 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2224/05552

摘要： An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.

摘要翻译： 本发明的电子部件安装体包括安装在电路板上的电子部件。 电子部件包括多个部件侧电极端子，电路基板包括用于元件侧电极端子的多个电路板侧电极端子。 电子部件安装体还包括：分别形成在电子部件的部件侧电极端子上的多个突出电极，电连接电子部件和电路基板; 以及形成在所述电子部件上并且在所述元件侧电极端子中的规定位置与所述元件侧电极端子电连接的虚拟电极。 在预定位置上的元件侧电极端子上的突出电极与组件侧电极端子上的与预定位置不同的位置的突出电极高。

公开(公告)号：US08450848B2

公开(公告)日：2013-05-28

申请号：US12711691

申请日：2010-02-24

申请人： Daisuke Sakurai

发明人： Daisuke Sakurai

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1403 ,  H01L2224/14132 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8321 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/13111 ,  H01L2224/13109 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes an electronic part including an electrode, a substrate including a substrate electrode electrically connected to the first electrode on an upper surface thereof, the first substrate electrode and the first electrode being arranged, facing each other, a connecting member configured to connect the electrode with the substrate electrode, and a sealing material including a first resin portion which contains flux and contacts at least a connection portion between the connecting member and the substrate electrode, and a second resin portion which contains a lower concentration of flux than that of the first resin portion. A gap between the electronic part and the substrate is filled with the sealing film.

摘要翻译： 一种半导体器件包括电子部件，其包括电极，包括在其上表面与第一电极电连接的基板电极的基板，第一基板电极和第一电极相互相对配置，连接部件被配置为连接 具有基板电极的电极以及包含第一树脂部分的密封材料，所述第一树脂部分含有焊剂并且至少与连接部件和基板电极之间的连接部分接触;以及第二树脂部分，其具有低于 第一树脂部分。 电子部件和基板之间的间隙填充有密封膜。

公开(公告)号：US08367539B2

公开(公告)日：2013-02-05

申请号：US13040318

申请日：2011-03-04

申请人： Daisuke Sakurai

发明人： Daisuke Sakurai

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/562 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/11003 ,  H01L2224/11009 ,  H01L2224/11332 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/115 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/14 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/17 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/81011 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81201 ,  H01L2224/814 ,  H01L2224/81444 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/3841 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： The semiconductor device manufacturing method includes the steps of attaching two or more solder particles on at least one electrode among a plurality of electrodes of an electronic component, arranging the electrode of the electronic component and an electrode of a circuit board so as to oppose each other, abutting the solder particles attached on a surface of the electrode of the electronic component to the electrode of the circuit board and heating the solder particles, and connecting electrically the electrode of the electronic component and the electrode of the circuit board via two or more solder joint bodies made by melting the solder particles.

摘要翻译： 半导体器件制造方法包括以下步骤：在电子部件的多个电极中的至少一个电极上附接两个或更多个焊料颗粒，将电子部件的电极和电路板的电极彼此对置 将附着在电子部件的电极表面上的焊料颗粒与电路板的电极相接合并加热焊料颗粒，并通过两个或多个焊料将电子部件的电极和电路板的电极电连接 通过熔化焊料颗粒制成的接合体。

公开(公告)号：US20120168961A1

公开(公告)日：2012-07-05

申请号：US13415338

申请日：2012-03-08

申请人： DAISUKE SAKURAI

发明人： DAISUKE SAKURAI

IPC分类号： H01L23/528

CPC分类号： H01L24/05 ,  H01L23/522 ,  H01L2224/02166 ,  H01L2224/05018 ,  H01L2224/05093 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05096 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/00

摘要： An externally connecting electrode is formed above a semiconductor substrate with interlayer insulation films and disposed in the externally connecting electrode. The externally connecting electrode has a pad metal layer whose upper surface is exposed, a first metal layer formed between the pad metal layer and the semiconductor substrate, and at least two first vias which penetrate the interlayer insulation film and electrically connect the pad metal layer to the first metal layer and are formed in the interlayer insulation film. The maximum interval b between the first vias is larger than the width a of the pad metal layer.

摘要翻译： 外部连接电极形成在具有层间绝缘膜的半导体衬底之上并且设置在外部连接电极中。 外部连接电极具有上表面暴露的焊盘金属层，形成在焊盘金属层和半导体衬底之间的第一金属层和穿过层间绝缘膜的至少两个第一通孔，并将焊盘金属层电连接到 第一金属层并形成在层间绝缘膜中。 第一通孔之间的最大间隔b大于焊盘金属层的宽度a。

公开(公告)号：US08083150B2

公开(公告)日：2011-12-27

申请号：US11918054

申请日：2006-09-19

申请人： Daisuke Sakurai ,  Michiro Yoshino

发明人： Daisuke Sakurai ,  Michiro Yoshino

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/26165 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83136 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1902 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01Q1/22 ,  H01Q9/16 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A non-contact information storage medium has IC chip having at least a function of storing information, and resin substrate having antenna pattern for communicating a signal to an external device. Antenna terminal disposed at one end of antenna pattern on resin substrate and electrode terminal of IC chip are mounted so that the antenna terminal faces the electrode terminal. Insulating layer for gap regulation of at least 5 μm is disposed between antenna pattern and circuit forming surface of IC chip.

摘要翻译： 非接触式信息存储介质具有至少具有存储信息功能的IC芯片和具有用于将信号传送到外部设备的天线方向图的树脂基板。 安装在树脂基板和IC芯片的电极端子上的天线图案的一端的天线端子安装成使得天线端子面对电极端子。 在天线图案和IC芯片的电路形成表面之间设置至少5μm的间隙调节绝缘层。

公开(公告)号：US07928566B2

公开(公告)日：2011-04-19

申请号：US12514649

申请日：2007-11-20

申请人： Yoshihiko Yagi ,  Daisuke Sakurai

发明人： Yoshihiko Yagi ,  Daisuke Sakurai

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  H01L21/563 ,  H01L24/11 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/11552 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Conductive bump (17) formed on a surface of electrode terminal (11) of an electronic component. Conductive bump (17) is composed of at least a plurality of cured resin materials having different conductive filler densities. Thus, a short circuit and a connection failure due to crush of conductive bump (17) at the time of mounting can be prevented.

摘要翻译： 形成在电子部件的电极端子（11）的表面上的导电凸块（17）。 导电凸块（17）由至少多种具有不同导电填料密度的固化树脂材料组成。 因此，可以防止由于安装时的导电凸块（17）的挤压引起的短路和连接故障。

公开(公告)号：US07908897B2

公开(公告)日：2011-03-22

申请号：US11666466

申请日：2006-02-28

申请人： Masahiko Igarashi ,  Hideo Watanabe ,  Nobuyoshi Asaga ,  Satoshi Komuro ,  Takeshi Mochizuki ,  Daisuke Sakurai ,  Manabu Igusa ,  Yoshihiro Umebayashi ,  Masahiro Oiwake

发明人： Masahiko Igarashi ,  Hideo Watanabe ,  Nobuyoshi Asaga ,  Satoshi Komuro ,  Takeshi Mochizuki ,  Daisuke Sakurai ,  Manabu Igusa ,  Yoshihiro Umebayashi ,  Masahiro Oiwake

IPC分类号： B21D17/04 ,  B21D15/00 ,  B21D17/00

CPC分类号： B24D13/145 ,  B21H5/027 ,  B24B9/04 ,  Y10T29/49826

摘要： A spline rolling tool including a plurality of forming teeth that are to bite into a cylindrical workpiece so as to roll splines in the workpiece. Each of the forming teeth has an incomplete toothed region in which a crest of each forming tooth is removed such that an upper end of each forming tooth in the incomplete toothed region is defined by an incomplete-toothed region surface that includes a curved surface portion, a flat surface portion and a slant surface portion. The incomplete-toothed region surface is defined at its periphery by a chamfered edge that has a surface roughness of not larger than about 3.2 μm. Also disclosed is a process of manufacturing the spline rolling tool, which includes a chamfering step of forming the chamfered edge by using a wire brush having abrasive grains that are fixed to bristles of the wire brush.

摘要翻译： 一种花键滚动工具，其包括要咬入圆柱形工件中的多个成形齿，以便在工件中滚动花键。 每个成形齿具有不完整的齿形区域，其中每个成形齿的顶部被去除，使得不完全齿形区域中的每个成形齿的上端由包括弯曲表面部分的不完全齿区域表面限定， 平坦表面部分和倾斜表面部分。 不完全齿形区域表面在其周边由一个具有不大于3.2μm的表面粗糙度的倒角边缘限定。 还公开了一种制造花键滚动工具的方法，其包括通过使用具有固定到线刷的刷毛的磨粒的线刷形成倒角边缘的倒角步骤。

公开(公告)号：US20100052189A1

公开(公告)日：2010-03-04

申请号：US12515425

申请日：2007-11-20

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L23/485 ,  H01L21/60 ,  H05K1/16

CPC分类号： H05K3/321 ,  B33Y80/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/1152 ,  H01L2224/11554 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Electronic component mounting structure (1) comprising electronic component (10) provided with a plurality of electrode terminals (10a), mounting substrate (12) provided with connector terminals (12a) in positions corresponding to electrode terminals (10a), wherein electrode terminal (10a) is connected to connector terminal (12a) via protrusion electrode (13) disposed on electrode terminal (10a) or connector terminal (12a), and protrusion electrode (13) includes at least conductive filler (13a) and photosensitive resin (13b), and varies in resin component crosslink density of photosensitive resin (13b) in the height direction of protrusion electrode (13).

摘要翻译： 电子部件安装结构（1）包括设置有多个电极端子（10a）的电子部件（10），在与电极端子（10a）对应的位置设置有连接器端子（12a）的安装基板（12），其中电极端子 10a）经由设置在电极端子（10a）或连接器端子（12a）上的突出电极（13）连接到连接器端子（12a），突起电极（13）至少包括导电填料（13a）和感光性树脂（13b） ，并且在突起电极（13）的高度方向上的感光性树脂（13b）的树脂成分交联密度发生变化。

公开(公告)号：US20090315178A1

公开(公告)日：2009-12-24

申请号：US12522239

申请日：2008-03-04

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L23/488 ,  H01B5/00 ,  H01R43/02

CPC分类号： H01L24/12 ,  B33Y80/00 ,  G03F7/0037 ,  G03F7/0047 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11552 ,  H01L2224/11554 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49213 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2224/13099 ,  H01L2924/00

摘要： A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.

摘要翻译： 形成在电子部件的电极表面上的导电凸块。 该导电凸块由具有不同导电填料含量的多个感光性树脂层构成。 因此，该导电凸块能够实现冲突的功能，即提高与电极的粘合强度和降低接触电阻。