发明授权
- 专利标题： Electronic-component mounted body, electronic component, and circuit board
- 专利标题（中）： 电子元件安装体，电子部件和电路板
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申请号： US13821521申请日： 2011-09-22
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公开(公告)号： US08921708B2公开(公告)日： 2014-12-30
- 发明人: Daisuke Sakurai , Kazuya Usirokawa
- 申请人： Daisuke Sakurai , Kazuya Usirokawa
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2010-267943 20101201
- 国际申请： PCT/JP2011/005329 WO 20110922
- 国际公布： WO2012/073417 WO 20120706
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K7/06 ; H01L21/56 ; H01L23/498 ; H01L23/00 ; H01L23/36 ; H01L21/48 ; H01L23/544 ; H05K1/02 ; H01L23/367
摘要：
An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.
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