公开(公告)号：US20140010991A1

公开(公告)日：2014-01-09

申请号：US14005874

申请日：2012-01-25

申请人： Daisuke Sakurai

发明人： Daisuke Sakurai

IPC分类号： B23K35/02 ,  B23K1/00

CPC分类号： B23K35/0244 ,  B22F7/004 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/26 ,  B23K35/262 ,  B23K35/362 ,  B23K35/40 ,  B23K2101/42 ,  C22C1/02 ,  C22C13/00 ,  C22C13/02 ,  C22C28/00 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/15788 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0425 ,  Y10T428/24322 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.

摘要翻译： 一种焊料转移基板，包括：基底层; 布置在基层上的粘合剂层; 以及布置在所述粘合剂层上的多个焊料粉末，其中在作为多孔构件的所述基底层中，至少允许剥离液体通过的多个孔由其侧面形成， 层不布置在其上布置有粘合剂层的一侧。 特别地，粘合剂层具有渗透的剥离液体膨胀的特性。

公开(公告)号：US08575751B2

公开(公告)日：2013-11-05

申请号：US12522239

申请日：2008-03-04

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/12 ,  B33Y80/00 ,  G03F7/0037 ,  G03F7/0047 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11552 ,  H01L2224/11554 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49213 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2224/13099 ,  H01L2924/00

摘要： A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.

摘要翻译： 形成在电子部件的电极表面上的导电凸块。 该导电凸块由具有不同导电填料含量的多个感光性树脂层构成。 因此，该导电凸块能够实现冲突的功能，即提高与电极的粘合强度和降低接触电阻。

公开(公告)号：US20130181041A1

公开(公告)日：2013-07-18

申请号：US13822708

申请日：2011-08-25

申请人： Daisuke Sakurai

发明人： Daisuke Sakurai

IPC分类号： B23K35/02 ,  B23K1/20

CPC分类号： B23K35/0244 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K1/206 ,  B23K3/0607 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/0209 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/043 ,  Y10T428/24372 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103

摘要： An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.

摘要翻译： 一种在基板的表面上形成粘合剂层的粘合剂层形成步骤; 焊料层形成步骤，通过在其间填充多个焊料粉末而在所述粘合剂层上形成焊料层; 并且包括向已经形成在粘合剂层上的焊料粉末的中间空间之间供给填料的填料供给步骤。

公开(公告)号：US20120125676A1

公开(公告)日：2012-05-24

申请号：US13362970

申请日：2012-01-31

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H05K1/03 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0082 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0347 ,  H05K2203/0514 ,  H05K2203/056 ,  H05K2203/107 ,  Y10T29/49124

摘要： A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

摘要翻译： 三维电路板通过包括板，设置在板上方的多个台阶上的第一布线电极组和至少在高度方向连接到第一布线电极组的第二布线电极形成， 其中第一布线电极组和第二布线电极之间的至少一个连接部分被整合为连续相同的形状。

公开(公告)号：US08018731B2

公开(公告)日：2011-09-13

申请号：US12302429

申请日：2007-06-19

申请人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Masato Mori ,  Yoshihiko Yagi

IPC分类号： H05K7/10 ,  H05K7/12

CPC分类号： H05K1/141 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/09145 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

摘要翻译： 至少连接第一电路板和第二电路板的互连基板（1）。 互连基板（1）包括用于连接壳体（10）的顶面和底面的壳体（1）和连接端子电极。 壳体10在其外周上具有突起（11），在其内周具有开口（13）。

公开(公告)号：US20100121083A1

公开(公告)日：2010-05-13

申请号：US12532062

申请日：2008-03-19

申请人： Yuuzou Tsuchida ,  Kunitomo Watanabe ,  Mamoru Koketsu ,  Tsugiya Murayama ,  Katarou Tsuchida ,  Daisuke Sakurai ,  Mitsuo Kawabe

发明人： Yuuzou Tsuchida ,  Kunitomo Watanabe ,  Mamoru Koketsu ,  Tsugiya Murayama ,  Katarou Tsuchida ,  Daisuke Sakurai ,  Mitsuo Kawabe

IPC分类号： C07D311/30 ,  C07D213/63 ,  C07C47/565

CPC分类号： A61K31/352 ,  A61K31/11 ,  A61K31/4406 ,  A61K36/899

摘要： Provided is an antiviral agent with high antiviral activities and low side effects (cytotoxicity). Specifically provided is an antiviral agent comprising as an effective component at least one member selected from the group consisting of 5,7,4′-trihydroxy-3′,5′-dimethoxyflavone, 3-hydroxypyridine, p-hydroxybenzaldehyde and vanillin.

摘要翻译： 提供具有高抗病毒活性和低副作用（细胞毒性）的抗病毒剂。 具体提供的是抗病毒剂，其包含选自5,7,4'-三羟基-3'，5'-二甲氧基黄酮，3-羟基吡啶，对羟基苯甲醛和香草醛中的至少一种作为有效成分。

公开(公告)号：US07229293B2

公开(公告)日：2007-06-12

申请号：US11175448

申请日：2005-07-07

申请人： Daisuke Sakurai ,  Kazuhiro Nishikawa ,  Norihito Tsukahara

发明人： Daisuke Sakurai ,  Kazuhiro Nishikawa ,  Norihito Tsukahara

IPC分类号： H01R12/00

CPC分类号： H05K3/361 ,  H01R12/52 ,  H01R43/0207 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0376 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/065

摘要： First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

摘要翻译： 第一电路板10包括通过加热软化并具有熔融特性的第一树脂基材12和形成在第一树脂基材12的表面上的多个第一导体图案14和第二电路板20， 形成与第一导体图案14相同的间距的第二导体图案24。 在该结构中，第一导体图案14和第二导体图案24彼此机械接触以提供导电; 第一树脂基材12覆盖第一导体图案14和第二导体图案24，并且被接合到第二电路板20的第二树脂基材22，从而将第一电路板10和第二电路板20彼此连接。

公开(公告)号：US20060177846A1

公开(公告)日：2006-08-10

申请号：US11289378

申请日：2005-11-30

申请人： Takamune Yamamoto ,  Noriyuki Yamamoto ,  Daisuke Sakurai

发明人： Takamune Yamamoto ,  Noriyuki Yamamoto ,  Daisuke Sakurai

IPC分类号： C12Q1/68 ,  G06F19/00

CPC分类号： G16B45/00 ,  G16B25/00 ,  G16B30/00

摘要： A technology that allows a consensus sequence targeted for primer design to be easily displayed is provided. In sequence data of analysis targets, a consensus nucleotide sequence is generated by performing multiple sequence alignment based on nucleotide sequence, and a consensus amino acid sequence is generated by performing multiple sequence alignment based on amino acid sequence, followed by generating additional consensus nucleotide sequence by reverse translation of the consensus amino acid sequence. In other words, two consensus sequences consisting of the consensus sequence based on nucleotide sequence and the consensus sequence based on amino acid sequence are generated. One of these two consensus sequences can be chosen as a target for primers on a screen to input parameters for primer design.

摘要翻译： 提供了一种能够容易地显示针对引物设计的共识序列的技术。 在分析目标的序列数据中，通过基于核苷酸序列进行多个序列比对来产生共有核苷酸序列，并且通过基于氨基酸序列进行多个序列比对来产生共有氨基酸序列，随后通过 共同氨基酸序列的反向翻译。 换句话说，产生由基于核苷酸序列的共有序列和基于氨基酸序列的共有序列组成的两个共有序列。 可以选择这两个共有序列之一作为屏幕上的引物的目标，以输入引物设计的参数。

公开(公告)号：US20050276485A1

公开(公告)日：2005-12-15

申请号：US11130149

申请日：2005-05-17

申请人： Atsushi Mori ,  Daisuke Sakurai ,  Ayako Fujisaki

发明人： Atsushi Mori ,  Daisuke Sakurai ,  Ayako Fujisaki

IPC分类号： G01N33/53 ,  G01N37/00 ,  G06F19/00 ,  G06F19/18 ,  G06F19/24 ,  G06F19/26 ,  G06K9/62

CPC分类号： G06K9/6253 ,  G16B25/00 ,  G16B45/00

摘要： When making a clinical diagnosis using gene expression profiles or the like obtained from a DNA microarray, multidimensional data is visualized on a scatter chart so that outliers can be identified and the state of classifications can be recognized. A method comprises calculating said separating hyperplane by applying said pattern recognition algorithm to said training set that is entered; displaying the labels of two axes of said scatter chart in two or three dimensions; applying data of which the group it belongs to is unknown to said pattern recognition algorithm as a test set in order to determine the group the data belongs to; displaying a plot representing the data in said training set and a plot representing the data in said test set on a two- or three-dimensional scatter chart, in different manners for individual groups; and displaying said separating hyperplane by mapping it to said scatter chart.

摘要翻译： 当使用从DNA微阵列获得的基因表达谱等进行临床诊断时，在散点图上可视化多维数据，从而可以识别异常值并且可以识别分类状态。 一种方法包括通过将所述模式识别算法应用于输入的所述训练集来计算所述分离超平面; 以二维或三维显示所述散点图的两个轴的标签; 为了确定数据所属的组，应用其所属组的数据对于所述模式识别算法是未知的，作为测试集合; 以不同的方式显示表示所述训练集中的数据的曲线和表示所述测试集中的数据在二维或三维散点图上的曲线图; 以及通过将其映射到所述散点图来显示所述分离超平面。

公开(公告)号：US20050068341A1

公开(公告)日：2005-03-31

申请号：US10890106

申请日：2004-07-14

申请人： Daisuke Sakurai ,  Noriyuki Yamamoto ,  Kotoe Nishio

发明人： Daisuke Sakurai ,  Noriyuki Yamamoto ,  Kotoe Nishio

IPC分类号： G01N33/53 ,  G01N37/00 ,  G06F3/033 ,  G06F3/048 ,  G06T11/80 ,  G06K9/00

CPC分类号： G06F3/04845

摘要： A method of moving figures whereby a number of aligned figures can be efficiently moved while maintaining the alignment. The method includes a figure group generating step of generating a plurality of figure groups arranged in a matrix by grouping a plurality of figures arranged in a matrix; an overall reference figure setting step of setting an overall reference figure selected from said plurality of figures; an entire figure moving step of moving all of the figures in the same manner as said overall reference figure when said overall reference figure is selected and moved; a reference figure setting step of setting a single reference figure selected from said plurality of figures in each of said figure groups; and a figure group moving step of moving all of the figure groups except for the figure group containing said overall reference figure while maintaining the relative relationships between the rows and columns and between the figure groups, when one of said reference figures is selected and moved.

摘要翻译： 一种移动图形的方法，由此可以在保持对准的同时有效地移动多个对准的图形。 该方法包括：图形组生成步骤，通过分组以矩阵排列的多个图形来生成以矩阵形式排列的多个图形组; 整体参考图设定步骤，设定从所述多个图中选择的总体参考图形; 整个图形移动步骤，当选择和移动所述总体参考图形时，以与所述总体参考图相同的方式移动所有图形; 参考图形设置步骤，设置从每个所述图形组中的所述多个图形中选择的单个参考图形; 以及图形组移动步骤，当选择和移动所述参考图中的一个时，移动除了包含所述总体参考图的图组之外的所有图组，同时维持行和列之间以及图组之间的相对关系。