Abstract:
A nonvolatile semiconductor memory device transmits/receives data to/from a data input/output terminal every j bits (e.g., eight bits). Each of memory cells in a memory cell array can hold data of n bits in correspondence to 2n threshold levels. A write data conversion circuit generates write data from bit data input from the same data input/output terminal in a set of a plurality of data of j bits input at different timings.
Abstract:
In semiconductor integrated circuit devices for vehicle use or the like, in general, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding or the like using a gold wire and the like for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). The invention of the present application provides a semiconductor integrated circuit device (semiconductor device or electron circuit device) which includes a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board or the like (wiring substrate).
Abstract:
A floor plan evaluation method by which a floor plan can be quantitatively evaluated. The floor plan evaluation method includes first extracting a plurality of specified elements, which are specified in advance from data on a floor plan which is made automatically by, e.g., a floor planner, second obtaining an individual evaluation value on each of a plurality of individual evaluation items on the basis of the plurality of specified elements extracted in the first step, and third calculating an integrated evaluation value on the floor plan on the basis of a plurality of individual evaluation values obtained in the second step. Then, a plurality of integrated evaluation values obtained by executing the first to third operations for a plurality of floor plans are compared with one another to relatively evaluate the plurality of floor plans.
Abstract:
A microcontroller capable of improving processing performance as a whole by executing different programs by a plurality of CPUs and capable of detecting abnormality for safety-required processing by evaluating results of the same processing executed by the plurality of CPUs. A plurality of processing systems including CPUs and memories are provided, data output from the CPUs in each of the processing systems is separately compressed and stored by compressors for each of the CPUs, respectively. The compressed storage data is mutually compared by a comparator, and abnormality of processing can be detected when the comparison result indicates a mismatch. Even when the timings by which the same processing results are obtained are different when the plurality of CPUs asynchronously execute the same processing, the processing results of both of them can be easily compared with each other since compression is carried out by the compressors. Moreover, since the comparison of the comparator is enabled when comparison enable is given from all the CPUs, the comparison operation result can be obtained based on the timing at which the results of compression by the plurality of compressors are determined.
Abstract:
Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.
Abstract:
After a polycrystalline silicon film (5) is formed on a semiconductor substrate via an insulating film for a gate insulating film (step S1), an organic antireflection film (21) is formed on the polycrystalline silicon film (5) (step S2), and a resist pattern (22) is formed on the antireflection film (21) (step S3). Then, a passivation film (23) is deposited on the antireflection film (21) so as to cover the resist pattern (22) by plasma using fluorocarbon gas while a bias voltage is being applied to the semiconductor substrate (step S4). Then, the passivation film (23) and the antireflection film (21) are etched by plasma using gas containing oxygen gas (step S5). Thereafter, the polycrystalline silicon film (5) is etched using the resist pattern (22) with reduced line edge roughness as an etching mask to form a gate electrode (step S6).
Abstract:
A semiconductor device includes a memory cell to and from which data is written and read in accordance with voltage supplied, a power supply circuit generating the voltage supplied to the memory cell, a microcomputer, an external terminal, a surge protection circuit clamping at a predetermined voltage value a voltage supplied to the external terminal, and a first switch circuit switching to output to one of the power supply circuit and the microcomputer a voltage having passed through the surge protection circuit. The power supply circuit includes a voltage conversion circuit changing the magnitude of a voltage received from the first switch circuit, and a second switch circuit switching to supply the memory cell with one of the voltage received from the first switch circuit and the voltage changed in magnitude.
Abstract:
In a semiconductor device having element isolation made of a trench-type isolating oxide film 13, large and small dummy patterns 11 of two types, being an active region of a dummy, are located in an isolating region 10, the large dummy patterns 11b are arranged at a position apart from actual patterns 9, and the small dummy patterns 11a are regularly arranged in a gap at around a periphery of the actual patterns 9, whereby uniformity of an abrading rate is improved at a time of abrading an isolating oxide film 13a is improved, and surface flatness of the semiconductor device becomes preferable.
Abstract:
The present invention provides a magnetic memory device capable of providing high-speed access without increasing an array area. Gate word lines are respectively linearly disposed between source impurity regions and drain impurity regions within a memory cell array area. Gate word line protrusions are respectively provided at boundary regions of memory cell forming regions. Contacts relative to the gate word line protrusions are respectively provided at boundary regions of memory cells at adjacent columns. The drain impurity regions are respectively disposed with being shifted from the centers of the memory cell forming regions in such a manner that spaces between the drain impurity regions become large in the regions in which the protrusions are disposed.
Abstract:
A semiconductor integrated circuit device for driving an LCD, COG chip packaging is performed. To achieve this, an elongate and relatively thick gold bump electrode is formed over an aluminum-based pad having a relatively small area. In a wafer probe test performed after formation of the gold bump electrode, a cantilever type probe needle having gold as a main component and having an almost perpendicularly bent tip portion is used. The diameter of this probe needle in the vicinity of its tip is usually almost the same as the width of the gold bump electrode. This makes it difficult to perform the wafer probe test stably. To counteract this, a plurality of bump electrode rows for outputting a display device drive signal are formed such that the width of inner bump electrodes is made greater than the width of outer bump electrodes.