Patent search cpc:"H01L2924/17738" Page 1

1.

发明授权
Power module of square flat pin-free packaging structure 有权

公开(公告)号：US10056313B2

公开(公告)日：2018-08-21

申请号：US15576850

申请日：2016-01-29

Applicant: SOUTHEAST UNIVERSITY

Inventor： Siyang Liu , Ning Wang , Jiaxing Wei , Chao Liu , Weifeng Sun , Shengli Lu , Longxing Shi

IPC: H01L23/367 , H01L23/495 , H01L23/31 , H01L25/16 , H01L25/18 , H01L23/00

CPC classification number: H01L23/3675 , H01L23/3107 , H01L23/3121 , H01L23/367 , H01L23/4334 , H01L23/49503 , H01L23/49537 , H01L23/49541 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/16 , H01L25/18 , H01L2224/29139 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48175 , H01L2224/48247 , H01L2224/73265 , H01L2924/01079 , H01L2924/1306 , H01L2924/1426 , H01L2924/17738 , H01L2924/17747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00

Abstract: A power module of a square flat pin-free packaging structure for suppressing the power module from being excessively high in local temperature. The power module includes an insulating resin, a driving chip, a plurality of power chips, and a plurality of metal electrode contacts. The driving chip, the power chips, and the metal electrode contacts are electrically connected through a metal lead according to a predetermined circuit. A plurality of metal heat dissipating disks used for heat dissipation of the power chips and a driving chip lead frame are disposed at the bottom of the insulating resin. A plurality of metal power chip lead frames are disposed on the metal heat dissipating disks, the power chips are disposed on the power chip lead frames, and the drain electrodes of the power chips are electrically connected to the metal heat dissipating disks.

2.

发明申请
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

公开(公告)号：US20160322285A1

公开(公告)日：2016-11-03

申请号：US15208349

申请日：2016-07-12

Applicant: ROHM CO., LTD.

Inventor： Akihiro KIMURA , Tsunemori YAMAGUCHI

IPC: H01L23/495 , H01L23/31 , H01L23/00

CPC classification number: H01L23/49513 , H01L23/3107 , H01L23/3135 , H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/07802 , H01L2924/14 , H01L2924/17738 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01015 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512

Abstract: A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.

3.

发明授权
Integrated circuit (IC) package with thick die pad functioning as a heat sink 有权
Title translation: 集成电路（IC）封装，具有作为散热片的厚芯片

公开(公告)号：US09418920B2

公开(公告)日：2016-08-16

申请号：US14589094

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/29 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/00

CPC classification number: H01L23/49568 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3135 , H01L23/49513 , H01L23/4952 , H01L23/49541 , H01L23/49551 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/32245 , H01L2224/48106 , H01L2224/48247 , H01L2224/73265 , H01L2224/838 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/17738 , H01L2924/17763 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

Abstract: An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.

Abstract translation: 集成电路（IC）封装包括芯片焊盘和固定在裸片焊盘上的IC芯片。 IC芯片具有与芯片焊盘的外边缘对准的外边缘。封装材料体围绕芯片焊盘和IC芯片。引线从封装材料体向外延伸并耦合到IC管芯。每个引线具有与IC芯片的上表面共面的上表面。管芯焊盘具有通过封装材料体暴露的下表面，并且其厚度大于多个引线中的每一个的厚度。

4.

发明申请
Glass/Ceramic Replacement of Epoxy for High Temperature Hermetically Sealed Non-Axial Electronic Packages 有权
Title translation: 玻璃/陶瓷替代环氧树脂用于高温密封非轴向电子封装

公开(公告)号：US20150380333A1

公开(公告)日：2015-12-31

申请号：US14827142

申请日：2015-08-14

Applicant: Semtech Corporation

Inventor： Victor Hugo Cruz , David Francis Courtney

IPC: H01L23/29 , H01L23/31 , H01L23/00 , H01L23/495

CPC classification number: H01L23/291 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49562 , H01L23/49582 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05655 , H01L2224/06181 , H01L2224/29139 , H01L2224/29147 , H01L2224/32245 , H01L2224/37184 , H01L2224/37639 , H01L2224/37655 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/48247 , H01L2224/4847 , H01L2224/48699 , H01L2224/48739 , H01L2224/48755 , H01L2224/83439 , H01L2224/83455 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/85455 , H01L2224/92246 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/097 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/15747 , H01L2924/15787 , H01L2924/17738 , H01L2924/181 , H01L2924/186 , H01L2924/201 , H01L2924/20111 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/00014 , H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或铜，用于连接半导体管芯，引线框架和连接器。这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。

5.

发明授权
Matrix lid heatspreader for flip chip package 有权

公开(公告)号：US09640469B2

公开(公告)日：2017-05-02

申请号：US14850070

申请日：2015-09-10

Applicant: George R. Leal , Tim V. Pham

Inventor： George R. Leal , Tim V. Pham

IPC: H01L21/00 , H01L23/495 , H01L23/433 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/367 , H01L23/373 , H01L23/498 , H01L25/065

CPC classification number: H01L23/49568 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/3107 , H01L23/3675 , H01L23/3736 , H01L23/4334 , H01L23/49541 , H01L23/49838 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/29191 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/92225 , H01L2224/97 , H01L2924/12042 , H01L2924/141 , H01L2924/14335 , H01L2924/1434 , H01L2924/15311 , H01L2924/17738 , H01L2924/17747 , H01L2924/181 , H01L2224/81 , H01L2924/00012 , H01L2924/00

Abstract: A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

6.

发明授权
Electronic device with multi-layer contact 有权
Title translation: 电子设备多层接触

公开(公告)号：US09490193B2

公开(公告)日：2016-11-08

申请号：US13309163

申请日：2011-12-01

Applicant: Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt

Inventor： Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt

IPC: H01L29/43 , H01L29/45 , H01L23/482 , H01L23/00 , H01L23/495

CPC classification number: H01L24/32 , H01L23/4827 , H01L23/49513 , H01L23/49541 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/83 , H01L29/43 , H01L29/45 , H01L2224/03438 , H01L2224/0345 , H01L2224/04026 , H01L2224/05083 , H01L2224/05124 , H01L2224/05139 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/08503 , H01L2224/2745 , H01L2224/29082 , H01L2224/29084 , H01L2224/291 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29184 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/83191 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83469 , H01L2224/83815 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01048 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/17738 , H01L2924/17747 , H01L2924/1776 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023 , H01L2924/01015 , H01L2924/00

Abstract: The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.

Abstract translation: 电子设备包括载体，附着到载体的半导体衬底以及设置在半导体衬底和载体之间的层系统。层系统包括设置在半导体衬底上的电接触层。功能层设置在电接触层上。粘附层设置在功能层上。在粘合层和载体之间设置焊料层。

7.

发明授权
Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages 有权
Title translation: 玻璃/陶瓷替代环氧树脂用于高温气密密封的非轴向电子封装

公开(公告)号：US09111869B2

公开(公告)日：2015-08-18

申请号：US13194585

申请日：2011-07-29

Applicant: Victor Hugo Cruz , David Francis Courtney

Inventor： Victor Hugo Cruz , David Francis Courtney

IPC: H01L29/12 , H01L23/495 , H01L23/29 , H01L23/00 , H01L23/31

CPC classification number: H01L23/291 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49562 , H01L23/49582 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05655 , H01L2224/06181 , H01L2224/29139 , H01L2224/29147 , H01L2224/32245 , H01L2224/37184 , H01L2224/37639 , H01L2224/37655 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/48247 , H01L2224/4847 , H01L2224/48699 , H01L2224/48739 , H01L2224/48755 , H01L2224/83439 , H01L2224/83455 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/85455 , H01L2224/92246 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/097 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/15747 , H01L2924/15787 , H01L2924/17738 , H01L2924/181 , H01L2924/186 , H01L2924/201 , H01L2924/20111 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/00014 , H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或铜，用于连接半导体管芯，引线框架和连接器。这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。

8.

发明申请
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
Title translation: 半导体器件及其制造方法

公开(公告)号：US20140284782A1

公开(公告)日：2014-09-25

申请号：US14300667

申请日：2014-06-10

Applicant: ROHM CO., LTD.

Inventor： Akihiro KIMURA , Tsunemori YAMAGUCHI

IPC: H01L23/00 , H01L23/495

CPC classification number: H01L23/49513 , H01L23/3107 , H01L23/3135 , H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/07802 , H01L2924/14 , H01L2924/17738 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01015 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512

Abstract: A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.

Abstract translation: 半导体器件100包括附接到半导体芯片106的第二主表面106b的第一绝缘材料110和附接到半导体芯片106，第一绝缘材料110和岛102的侧表面的第二绝缘材料112。半导体芯片106经由第一绝缘材料110和第二绝缘材料112固定到岛102.第一绝缘材料110确保半导体芯片106和岛102之间的高介电强度。虽然第二绝缘材料112具有弹性模量大于第一绝缘材料110的弹性模量，半导体芯片106牢固地附接到岛102。