Patent search cpc:"H01L2924/097" Page 1

1.

发明申请
GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICALLY SEALED NON-AXIAL ELECTRONIC PACKAGES 有权
Title translation: 玻璃/陶瓷用于高温密封非轴向电子包装的环氧树脂

公开(公告)号：US20130026490A1

公开(公告)日：2013-01-31

申请号：US13194585

申请日：2011-07-29

Applicant: Victor H. Cruz , David Francis Courtney

Inventor： Victor H. Cruz , David Francis Courtney

IPC: H01L21/56 , H01L29/20 , H01L29/12 , H01L23/495

CPC classification number: H01L23/291 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49562 , H01L23/49582 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05655 , H01L2224/06181 , H01L2224/29139 , H01L2224/29147 , H01L2224/32245 , H01L2224/37184 , H01L2224/37639 , H01L2224/37655 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/48247 , H01L2224/4847 , H01L2224/48699 , H01L2224/48739 , H01L2224/48755 , H01L2224/83439 , H01L2224/83455 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/85455 , H01L2224/92246 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/097 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/15747 , H01L2924/15787 , H01L2924/17738 , H01L2924/181 , H01L2924/186 , H01L2924/201 , H01L2924/20111 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/00014 , H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或铜，用于连接半导体管芯，引线框架和连接器。这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。

2.

发明申请
Glass/Ceramic Replacement of Epoxy for High Temperature Hermetically Sealed Non-Axial Electronic Packages 有权
Title translation: 玻璃/陶瓷替代环氧树脂用于高温密封非轴向电子封装

公开(公告)号：US20150380333A1

公开(公告)日：2015-12-31

申请号：US14827142

申请日：2015-08-14

Applicant: Semtech Corporation

Inventor： Victor Hugo Cruz , David Francis Courtney

IPC: H01L23/29 , H01L23/31 , H01L23/00 , H01L23/495

CPC classification number: H01L23/291 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49541 , H01L23/49562 , H01L23/49582 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05655 , H01L2224/06181 , H01L2224/29139 , H01L2224/29147 , H01L2224/32245 , H01L2224/37184 , H01L2224/37639 , H01L2224/37655 , H01L2224/40247 , H01L2224/45124 , H01L2224/45139 , H01L2224/48247 , H01L2224/4847 , H01L2224/48699 , H01L2224/48739 , H01L2224/48755 , H01L2224/83439 , H01L2224/83455 , H01L2224/83801 , H01L2224/84801 , H01L2224/85439 , H01L2224/85455 , H01L2224/92246 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/097 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/15747 , H01L2924/15787 , H01L2924/17738 , H01L2924/181 , H01L2924/186 , H01L2924/201 , H01L2924/20111 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/00014 , H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或铜，用于连接半导体管芯，引线框架和连接器。这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。