公开(公告)号：US20130026490A1

公开(公告)日：2013-01-31

申请号：US13194585

申请日：2011-07-29

Applicant: Victor H. Cruz ,  David Francis Courtney

Inventor： Victor H. Cruz ,  David Francis Courtney

IPC: H01L21/56 ,  H01L29/20 ,  H01L29/12 ,  H01L23/495

CPC classification number: H01L23/291 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32245 ,  H01L2224/37184 ,  H01L2224/37639 ,  H01L2224/37655 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48755 ,  H01L2224/83439 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/097 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/17738 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/201 ,  H01L2924/20111 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或 铜，用于连接半导体管芯，引线框架和连接器。 这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。

公开(公告)号：US09111869B2

公开(公告)日：2015-08-18

申请号：US13194585

申请日：2011-07-29

Applicant: Victor Hugo Cruz ,  David Francis Courtney

Inventor： Victor Hugo Cruz ,  David Francis Courtney

IPC: H01L29/12 ,  H01L23/495 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/291 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32245 ,  H01L2224/37184 ,  H01L2224/37639 ,  H01L2224/37655 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48755 ,  H01L2224/83439 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/097 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/17738 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/201 ,  H01L2924/20111 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或 铜，用于连接半导体管芯，引线框架和连接器。 这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。

公开(公告)号：US20150380333A1

公开(公告)日：2015-12-31

申请号：US14827142

申请日：2015-08-14

Applicant: Semtech Corporation

Inventor： Victor Hugo Cruz ,  David Francis Courtney

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/291 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32245 ,  H01L2224/37184 ,  H01L2224/37639 ,  H01L2224/37655 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48755 ,  H01L2224/83439 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/097 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/17738 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/201 ,  H01L2924/20111 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

Abstract translation: 用于非轴向电子器件的高温非空腔封装是使用玻璃陶瓷化合物设计的，其能够在高于300-400℃的温度下连续组装和操作。金属钎焊，例如银，银胶体或 铜，用于连接半导体管芯，引线框架和连接器。 这些部件也是热匹配的，使得封装可以在高温下连续地组装和操作，并且可承受极端的温度变化，而不会发生键失效或者由于热失配引起的封装破裂。

公开(公告)号：US07679182B2

公开(公告)日：2010-03-16

申请号：US11936158

申请日：2007-11-07

Applicant: Hideto Yoshinari ,  Yujiro Kaneko ,  Masahide Harada ,  Nobutake Tsuyuno ,  Shinichi Fujiwara

Inventor： Hideto Yoshinari ,  Yujiro Kaneko ,  Masahide Harada ,  Nobutake Tsuyuno ,  Shinichi Fujiwara

IPC: H01L23/10 ,  H01L23/34 ,  H01L27/10 ,  H01L29/73 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119 ,  H01L23/495 ,  H01L23/52

CPC classification number: H05K7/209 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49811 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/37099 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3718 ,  H01L2224/37184 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A power module includes a heat radiation layer having the first main surface and the second main surface of reverse side opposed to the first main surface, an insulation layer disposed on the first main surface of a radiation layer, a wiring portion of current circuit disposed on the insulation layer and a plurality of switching elements disposed on the insulation layer and electrically connected to the wiring portion of current circuit. A plurality of external terminals are electrically connected to the wiring portions of current circuit. Furthermore, the module has a resin sealing all of the insulation layer, a wiring portion for current circuit, switching elements and the first main surface of the radiation layer, and a resin sealing a portion of the second main surface of the radiation layer with the resin.

Abstract translation: 功率模块包括具有与第一主表面相对的第一主表面和反向第二主表面的散热层，设置在辐射层的第一主表面上的绝缘层，设置在辐射层的第一主表面上的布线部分 绝缘层和设置在绝缘层上并电连接到电流电路的布线部分的多个开关元件。 多个外部端子电连接到电流电路的布线部分。 此外，模块具有树脂密封所有绝缘层，电流电路的布线部分，开关元件和辐射层的第一主表面，以及将辐射层的第二主表面的一部分与 树脂。

公开(公告)号：US20080106160A1

公开(公告)日：2008-05-08

申请号：US11936158

申请日：2007-11-07

Applicant: Hideto Yoshinari ,  Yujiro Kaneko ,  Masahide Harada ,  Nobutake Tsuyuno ,  Shinichi Fujiwara

Inventor： Hideto Yoshinari ,  Yujiro Kaneko ,  Masahide Harada ,  Nobutake Tsuyuno ,  Shinichi Fujiwara

IPC: H02K19/36 ,  H05K1/18

CPC classification number: H05K7/209 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49811 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/37099 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3718 ,  H01L2224/37184 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A power module comprises a heat radiation layer having the first main surface and the second main surface of reverse side opposed to the first main surface, an insulation layer disposed on the first main surface of a radiation layer, a wiring potion for current circuit disposed on the insulation layer and a plurality of switching element disposed on the insulation layer and electrically connected to the wiring portion of current circuit. A plurality of external terminals are electrically connected to the wiring portions of current circuit. Furthermore, the module has a resin sealing all of the insulation layer, a wiring portion for current circuit, switching elements and the first main surface of the radiation layer, and a resin sealing a portion of the second main surface of the radiation layer with the resin.

Abstract translation: 功率模块包括具有与第一主表面相对的第一主表面和反面的第二主表面的散热层，设置在辐射层的第一主表面上的绝缘层，设置在辐射层上的电流电路的布线部分 绝缘层和设置在绝缘层上并电连接到电流电路的布线部分的多个开关元件。 多个外部端子电连接到电流电路的布线部分。 此外，模块具有树脂密封所有绝缘层，电流电路的布线部分，开关元件和辐射层的第一主表面，以及将辐射层的第二主表面的一部分与 树脂。

公开(公告)号：US09780018B2

公开(公告)日：2017-10-03

申请号：US14921707

申请日：2015-10-23

Applicant: Infineon Technologies Americas Corp.

Inventor： Eung San Cho

IPC: H01L29/12 ,  H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37184 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A power semiconductor package is disclosed. The power semiconductor package includes a leadframe having partially etched segments and at least one non-etched segment, a first semiconductor die having a first power transistor and a driver integrated circuit (IC) monolithically formed thereon, a second semiconductor die having a second power transistor, wherein the first semiconductor die and the second semiconductor die are configured for attachment to the partially etched segments, and wherein the partially etched segments and the at least one non-etched segment enable the first semiconductor die to be coupled to the second semiconductor die by a legless conductive clip.

公开(公告)号：US09601400B2

公开(公告)日：2017-03-21

申请号：US14827142

申请日：2015-08-14

Applicant: Semtech Corporation

Inventor： Victor Hugo Cruz ,  David Francis Courtney

IPC: H01L29/12 ,  H01L23/495 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/291 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32245 ,  H01L2224/37184 ,  H01L2224/37639 ,  H01L2224/37655 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48755 ,  H01L2224/83439 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/097 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/17738 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/201 ,  H01L2924/20111 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/01005

Abstract: A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

公开(公告)号：US20160172284A1

公开(公告)日：2016-06-16

申请号：US14938749

申请日：2015-11-11

Applicant: Infineon Technologies Americas Corp.

Inventor： Eung San Cho

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/34 ,  H01L24/37 ,  H01L25/07 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37184 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014

Abstract: An integrated power assembly is disclosed. The integrated power assembly includes a first leadframe having partially etched segments, a first semiconductor die configured for attachment to a partially etched segment of the first leadframe, a second leadframe having a legless conductive clip coupled to a top surface of the first semiconductor die. The integrated power assembly also includes a third leadframe over the second leadframe and having a partially etched segment, a second semiconductor die configured for attachment to the partially etched segment of the third leadframe, wherein the second semiconductor die is coupled to the first semiconductor die through the partially etched segment of the third leadframe, and wherein the partially etched segment of the third leadframe is situated on the legless conductive clip of the second leadframe.

Abstract translation: 公开了一种集成的动力组件。 集成功率组件包括具有部分蚀刻的段的第一引线框架，被配置为附接到第一引线框架的部分蚀刻的段的第一半导体管芯，具有耦合到第一半导体管芯的顶表面的无腿导电夹的第二引线框架。 集成功率组件还包括在第二引线框架上的第三引线框架，并具有部分蚀刻的段，第二半导体管芯，被配置为附接到第三引线框架的部分蚀刻段，其中第二半导体管芯通过 第三引线框架的部分蚀刻的段，并且其中第三引线框架的部分蚀刻段位于第二引线框架的无腿导电夹上。

公开(公告)号：US20160172283A1

公开(公告)日：2016-06-16

申请号：US14921707

申请日：2015-10-23

Applicant: Infineon Technologies Americas Corp.

Inventor： Eung San Cho

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49562 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37184 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A power semiconductor package is disclosed. The power semiconductor package includes a leadframe having partially etched segments and at least one non-etched segment, a first semiconductor die having a first power transistor and a driver integrated circuit (IC) monolithically formed thereon, a second semiconductor die having a second power transistor, wherein the first semiconductor die and the second semiconductor die are configured for attachment to the partially etched segments, and wherein the partially etched segments and the at least one non-etched segment enable the first semiconductor die to be coupled to the second semiconductor die by a legless conductive clip.

Abstract translation: 公开了功率半导体封装。 功率半导体封装包括具有部分蚀刻的段和至少一个未蚀刻段的引线框架，具有第一功率晶体管和在其上单独形成的驱动器集成电路（IC）的第一半导体管芯，具有第二功率晶体管 ，其中所述第一半导体管芯和所述第二半导体管芯被配置为附接到所述部分蚀刻段，并且其中所述部分蚀刻段和所述至少一个未蚀刻段使得所述第一半导体管芯能够通过 无腿导电夹。

公开(公告)号：US20160172279A1

公开(公告)日：2016-06-16

申请号：US14938671

申请日：2015-11-11

Applicant: Infineon Technologies Americas Corp.

Inventor： Eung San Cho

IPC: H01L23/495 ,  H01L23/31 ,  H01L29/778 ,  H01L29/20 ,  H01L29/739 ,  H01L29/78 ,  H02M3/158 ,  H01L29/16

CPC classification number: H01L29/7813 ,  H01L21/4828 ,  H01L23/3121 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37184 ,  H01L2224/40245 ,  H01L2224/84801 ,  H01L2924/00014 ,  H02M3/158 ,  H01L2224/83801

Abstract: An integrated power assembly is disclosed. The integrated power assembly includes a printed circuit board, a first leadframe having partially etched segments and non-etched segments on the printed circuit board, a first semiconductor die configured for attachment to the partially etched segments of the first leadframe, a second leadframe having a legless conductive clip, and a second semiconductor die situated over the first semiconductor die and being coupled to the first semiconductor die by the legless conductive clip.

Abstract translation: 公开了一种集成的动力组件。 集成功率组件包括印刷电路板，在印刷电路板上具有部分蚀刻的片段和非蚀刻片段的第一引线框架，被配置为附接到第一引线框架的部分蚀刻的段的第一半导体管芯， 无腿导电夹子和位于第一半导体管芯上方的第二半导体管芯，并通过无腿导电夹子耦合到第一半导体管芯。