Invention Grant
US09418920B2 Integrated circuit (IC) package with thick die pad functioning as a heat sink
有权
集成电路（IC）封装，具有作为散热片的厚芯片
- Patent Title: Integrated circuit (IC) package with thick die pad functioning as a heat sink
- Patent Title (中): 集成电路（IC）封装，具有作为散热片的厚芯片
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Application No.: US14589094Application Date: 2015-01-05
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Publication No.: US09418920B2Publication Date: 2016-08-16
- Inventor: Wing Shenq Wong
- Applicant: STMICROELECTRONICS PTE LTD
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/29 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00
Abstract:
An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.
Public/Granted literature
- US20160197030A1 INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD, AND ASSOCIATED METHODS Public/Granted day:2016-07-07
Information query
IPC分类:
