Abstract:
Parasitic high-voltage diodes implemented by integration technology in a high-voltage level shift circuit are used for charging a bootstrap capacitor CB, wherein a power supply end of the high voltage level shift circuit is a high-side floating power supply VB, and a reference ground is a floating voltage PGD that is controlled by a bootstrap control circuit. A first parasitic diode DB1 and a second parasitic diode DB2 are provided between the VB and the PGD. The bootstrap control circuit is controlled by a high-side signal and a low-side signal.
Abstract:
A heterojunction semiconductor device comprises a substrate; a second barrier layer is disposed on the second channel layer and a second channel is formed; a trench gate structure is disposed in the second barrier layer; the trench gate structure is embedded into the second barrier layer and is composed of a gate medium and a gate metal located in the gate medium; an isolation layer is disposed in the second channel layer and separates the second channel layer into an upper layer and a lower layer; a first barrier layer is disposed between the lower layer of the second channel layer and the first channel layer and a first channel is formed; a bottom of the metal drain is flush with a bottom of the first barrier layer; and a first metal source is disposed between the second metal source and the first channel layer.
Abstract:
A two-way adaptive clock circuit supporting a wide frequency range is composed of a phase clock generating module, a phase clock selecting module, an adaptive clock stretching or compressing amount regulating circuit module and a control module. The adaptive clock stretching or compressing amount regulating circuit module can monitor delay information of a critical path in a chip in real time and feed the information back into the control module. After receiving a clock stretching or compressing enable signal and a stretching or compressing scale signal, the control module selects a target phase clock from clocks generated by the phase clock generating module to rapidly regulate an adaptive clock in a current cycle. The present invention is applied to an adaptive voltage frequency regulating circuit based on on-line time sequence monitoring.
Abstract:
A PVTM-based wide voltage range clock stretching circuit is disclosed. The circuit consists of a PVTM circuit module, a phase clock generation module, a clock synchronization selection module and a control module. The PVTM circuit module monitors in real time the delay information of an on-chip delay unit to monitor the operating environment of the circuit, and feeds the delay information back to the control module. Under the control of a clock stretching enable signal and a clock stretching extent signal, the control module selects a target phase clock from the clocks generated by the phase clock generation module in accordance with the feedback from the PVTM, enabling the stretching of system clock within a single cycle in different PVT conditions. Sophisticated gate devices are not required, and the cost of area and power consumption are kept to minimal.
Abstract:
A cache structure for use in implementing reconfigurable system configuration information storage, comprises: layered configuration information cache units: for use in caching configuration information that may be used by a certain or several reconfigurable arrays within a period of time; an off-chip memory interface module: for use in establishing communication; a configuration management unit: for use in managing a reconfiguration process of the reconfigurable arrays, in mapping each subtask in an algorithm application to a certain reconfigurable array, thus the reconfigurable array will, on the basis of the mapped subtask, load the corresponding configuration information to complete a function reconfiguration for the reconfigurable array. This increases the utilization efficiency of configuration information caches. Also provided is a method for managing the reconfigurable system configuration information caches, employing a mixed priority cache update method, and changing a mode for managing the configuration information caches in a conventional reconfigurable system, thus increasing the dynamic reconfiguration efficiency in a complex reconfigurable system.
Abstract:
A process corner detection circuit based on a self-timing oscillation ring comprises a reset circuit (1), the self-timing oscillation ring (2), and a counting module (3). The self-timing oscillation ring (2) consists of m two-input Miller units and inverters, and a two-input AND gate, m being a positive integer greater than or equal to 3. The circuit can be used for detecting a process corner of a fabricated integrated circuit chip, and reflecting the process corner of the chip according to the number of oscillations of the self-timing oscillation ring (2). The number of oscillations of the self-timing oscillation ring (2) in different process corners is acquired by Hspice simulation before the chip tape-out, and the process corner of the chip after the chip tape-out can be determined according to the actually measured number of oscillations.
Abstract:
Disclosed are a pre-decoding analysis-based configuration information cache management system, comprising a streaming media processing module, a configuration information prefetch FIFO module, a configuration information storage unit, and a cache controller module. Also disclosed is a management method for the pre-decoding analysis-based configuration information cache management system. The present invention allows for increased dynamic reconfiguration efficiency of a large-scale coarse-grained reconfigurable system.
Abstract:
A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.
Abstract:
An isolation structure of a high-voltage driving circuit includes a P-type substrate and a P-type epitaxial layer; a high voltage area, a low voltage area and a high and low voltage junction terminal area are arranged on the P-type epitaxial layer; a first P-type junction isolation area is arranged between the high and low voltage junction terminal area and the low voltage area, and a high-voltage insulated gate field effect tube is arranged between the high voltage area and the low voltage area; two sides of the high-voltage insulated gate field effect tube and an isolation structure between the high-voltage insulated gate field effect tube and a high side area are formed as a second P-type junction isolation area.
Abstract:
A power semiconductor device includes: a substrate; drain metal; a drift region; a base region; a gate structure; a first conductive type doped region contacting the base region on the side of the base region distant from the gate structure; a source region provided in the base region and between the first conductive type doped region and the gate structure; contact metal that is provided on the first conductive type doped region and forms a contact barrier having rectifying characteristics together with the first conductive type doped region below; and source metal wrapping the contact metal and contacting the source region.