公开(公告)号：US20150200181A1

公开(公告)日：2015-07-16

申请号：US14664168

申请日：2015-03-20

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Shingo YOSHIDA ,  Yasumasa KASUYA ,  Toichi NAGAHARA ,  Akihiro KIMURA ,  Kenji FUJII

IPC: H01L23/00 ,  B23K20/10 ,  B23K20/00 ,  H01L21/56 ,  B23K20/24

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/24 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78307 ,  H01L2224/78309 ,  H01L2224/83 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20757 ,  H01L2924/3512 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/207 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/00015

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

Abstract translation: 根据本发明的半导体器件包括半导体芯片，由含有铝的金属材料制成并形成在半导体芯片的顶表面上的电极焊盘，设置在半导体芯片的周围的电极引线，具有 线状延伸的主体部分，并且具有形成在主体部分的各个端部处并分别结合到电极焊盘和电极引线的焊盘接合部分和引线接合部分，以及密封半导体芯片的树脂封装件 引线和接合线，接合线由铜制成，并且整个电极焊盘和整个焊盘接合部分被不透水膜整体地覆盖。

公开(公告)号：US20140284782A1

公开(公告)日：2014-09-25

申请号：US14300667

申请日：2014-06-10

Applicant: ROHM CO., LTD.

Inventor： Akihiro KIMURA ,  Tsunemori YAMAGUCHI

IPC: H01L23/00 ,  H01L23/495

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/17738 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.

Abstract translation: 半导体器件100包括附接到半导体芯片106的第二主表面106b的第一绝缘材料110和附接到半导体芯片106，第一绝缘材料110和岛102的侧表面的第二绝缘材料112。 半导体芯片106经由第一绝缘材料110和第二绝缘材料112固定到岛102.第一绝缘材料110确保半导体芯片106和岛102之间的高介电强度。虽然第二绝缘材料112具有 弹性模量大于第一绝缘材料110的弹性模量，半导体芯片106牢固地附接到岛102。

公开(公告)号：US20130320527A1

公开(公告)日：2013-12-05

申请号：US13961323

申请日：2013-08-07

Applicant: Rohm Co., Ltd.

Inventor： Takeshi SUNAGA ,  Akihiro KIMURA

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83

Abstract: A semiconductor device includes a semiconductor chip, and a terminal connected with the semiconductor chip. The terminal has a first surface and a second surface spaced from each other in a thickness direction. The semiconductor device also includes a sealing resin covering the semiconductor chip and the terminal. The sealing resin is so configured that the first surface of the terminal is exposed from the sealing resin. The terminal is formed with an opening to be filled with the sealing resin.

Abstract translation: 半导体器件包括半导体芯片和与半导体芯片连接的端子。 端子具有沿厚度方向彼此间隔开的第一表面和第二表面。 半导体器件还包括覆盖半导体芯片和端子的密封树脂。 密封树脂被构造成使端子的第一表面从密封树脂露出。 端子形成有用密封树脂填充的开口。

公开(公告)号：US20240222232A1

公开(公告)日：2024-07-04

申请号：US18604939

申请日：2024-03-14

Applicant: Rohm Co., Ltd.

Inventor： Akihiro KIMURA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/49513 ,  H01L23/49517 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/73 ,  H01L25/16 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/13091

Abstract: A semiconductor device includes a substrate, a lead, and a semiconductor element. The substrate has an obverse surface facing in a thickness direction. The lead includes a die pad bonded to the substrate and a terminal connected to the pad. The semiconductor element is bonded to the pad. The bonding layer is disposed between the obverse surface and the pad. The obverse surface includes a first edge extending in a first direction crossing the thickness direction and a second edge extending in a second direction crossing the thickness direction and the first direction. As viewed in the thickness direction, the terminal protrudes outward from the obverse surface relative to the first edge. The distance from the first edge to the bonding layer in the second direction is shorter than the distance from the second edge to the bonding layer in the first direction.

公开(公告)号：US20220223568A1

公开(公告)日：2022-07-14

申请号：US17607346

申请日：2020-05-12

Applicant: ROHM CO., LTD.

Inventor： Kaito INOUE ,  Akihiro KIMURA

IPC: H01L25/07 ,  H01L23/373 ,  H01L23/492 ,  H01L23/00

Abstract: The semiconductor device A1 includes a support member 2, a metal part 30 having obverse and reverse surfaces 301-302 spaced in z direction, with the reverse surface 302 bonded to the support member 2, a second bonding layer 42 boding the support member 2 and the metal part 30, a semiconductor element 10 facing the obverse surface 301 and bonded to the metal part 30, and a sealing member 7 covering the support member 2, metal part 30, second bonding layer 42 and semiconductor element 10. The metal part 30 includes a first body 31 of a first material and a second body 32 of a second material, with a boundary between the bodies 31-32. The second material has a linear thermal expansion coefficient smaller than that of the first material. The semiconductor device is improved in reliability by reducing thermal stress from heat generation of the semiconductor element.

公开(公告)号：US20200066675A1

公开(公告)日：2020-02-27

申请号：US16669066

申请日：2019-10-30

Applicant: ROHM CO., LTD.

Inventor： Akihiro KIMURA ,  Takeshi SUNAGA

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L23/29 ,  H01L21/52

Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

公开(公告)号：US20180005981A1

公开(公告)日：2018-01-04

申请号：US15707632

申请日：2017-09-18

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Shingo YOSHIDA ,  Yasumasa KASUYA ,  Toichi NAGAHARA ,  Akihiro KIMURA ,  Kenji FUJII

IPC: H01L23/00 ,  H01L23/495 ,  B23K20/10 ,  H01L21/56 ,  B23K20/24 ,  B23K20/00 ,  H01L23/31

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/24 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78307 ,  H01L2224/78309 ,  H01L2224/83 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20757 ,  H01L2924/3512 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/207 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/00015

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

公开(公告)号：US20240250014A1

公开(公告)日：2024-07-25

申请号：US18626980

申请日：2024-04-04

Applicant: Rohm Co., Ltd.

Inventor： Akihiro KIMURA

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/32 ,  H01L25/167 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1815

Abstract: A semiconductor device includes a lead, a semiconductor element, and a sealing resin. The lead includes a mounting surface facing in a thickness direction, and an end surface facing in a direction orthogonal to the thickness direction and connected to the mounting surface. The semiconductor element is electrically bonded to the mounting surface. The sealing resin covers the semiconductor element and is in contact with the mounting surface and the end surface. The end surface is formed with a first portion that includes at least one of a projecting portion protruding from the end surface or a recessed portion recessed from the end surface. The projecting portion is located outside an outer edge of the mounting surface as viewed in the thickness direction. The recessed portion is enclosed in the outer edge as viewed in the thickness direction.

公开(公告)号：US20190080990A1

公开(公告)日：2019-03-14

申请号：US16185478

申请日：2018-11-09

Applicant: ROHM CO., LTD.

Inventor： Akihiro KIMURA

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L27/02 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L21/4853 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/73 ,  H01L27/0211 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.

公开(公告)号：US20180130724A1

公开(公告)日：2018-05-10

申请号：US15866825

申请日：2018-01-10

Applicant: ROHM CO., LTD.

Inventor： Akihiro KIMURA

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L27/02 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L21/4853 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/73 ,  H01L27/0211 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.