Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体器件
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Application No.: US14664168Application Date: 2015-03-20
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Publication No.: US20150200181A1Publication Date: 2015-07-16
- Inventor: Motoharu HAGA , Shingo YOSHIDA , Yasumasa KASUYA , Toichi NAGAHARA , Akihiro KIMURA , Kenji FUJII
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2009-145637 20090618; JP2009-149856 20090624; JP2009-153919 20090629; JP2009-206139 20090907; JP2009-241547 20091020; JP2009-241548 20091020; JP2009-241549 20091020; JP2009-241591 20091020; JP2009-256873 20091110; JP2009-256874 20091110; JP2009-256875 20091110; JP2009-256877 20091110; JP2009-256878 20091110; JP2009-256879 20091110; JP2009-256880 20091110; JP2009-266678 20091124; JP2010-000556 20100105; JP2010-040398 20100225
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B23K20/10 ; B23K20/00 ; H01L21/56 ; B23K20/24
Abstract:
A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.
Public/Granted literature
- US09780069B2 Semiconductor device Public/Granted day:2017-10-03
Information query
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