公开(公告)号：US09735126B2

公开(公告)日：2017-08-15

申请号：US13154523

申请日：2011-06-07

Applicant: Manfred Mengel ,  Alexander Heinrich ,  Steffen Orso ,  Thomas Behrens ,  Oliver Eichinger ,  Lim Fong ,  Evelyn Napetschnig ,  Edmund Riedl

Inventor： Manfred Mengel ,  Alexander Heinrich ,  Steffen Orso ,  Thomas Behrens ,  Oliver Eichinger ,  Lim Fong ,  Evelyn Napetschnig ,  Edmund Riedl

IPC: H01L23/495 ,  H01L23/00 ,  B23K35/30 ,  B23K35/26 ,  B23K35/28 ,  C22C13/00 ,  C22C18/00 ,  C22C18/04 ,  C22C30/04 ,  C22C30/06 ,  H01L23/488 ,  B23K1/00

CPC classification number: H01L24/48 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/282 ,  B23K35/3013 ,  C22C13/00 ,  C22C18/00 ,  C22C18/04 ,  C22C30/04 ,  C22C30/06 ,  H01L23/488 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85455 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/207

Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

公开(公告)号：US08802553B2

公开(公告)日：2014-08-12

申请号：US13024862

申请日：2011-02-10

Applicant: Alexander Heinrich ,  Konrad Roesl ,  Oliver Eichinger

Inventor： Alexander Heinrich ,  Konrad Roesl ,  Oliver Eichinger

IPC: H01L21/00

CPC classification number: H01L24/81 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/93 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/27426 ,  H01L2224/2745 ,  H01L2224/29018 ,  H01L2224/29019 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/8381 ,  H01L2224/83898 ,  H01L2224/83906 ,  H01L2224/93 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2224/27 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. The semiconductor chip is pressed on the carrier with a pressure of at least 1 Newton per mm2 of surface area of the first main surface and heat is applied to the solder material.

Abstract translation: 一种方法包括提供具有沉积在第一主表面上的第一主表面和焊料层的半导体芯片，其中焊料层的粗糙度至少为1μm。 将半导体芯片放置在载体上，半导体芯片的第一主表面面向载体。 将半导体芯片按第一主表面的表面积至少为1牛顿/千克的压力压在载体上，并将热量施加到焊料材料上。

公开(公告)号：US20140070376A1

公开(公告)日：2014-03-13

申请号：US13609306

申请日：2012-09-11

Applicant: Reinhard Hess ,  Katharina Umminger ,  Gabriel Maier ,  Markus Menath ,  Gunther Mackh ,  Hannes Eder ,  Alexander Heinrich

Inventor： Reinhard Hess ,  Katharina Umminger ,  Gabriel Maier ,  Markus Menath ,  Gunther Mackh ,  Hannes Eder ,  Alexander Heinrich

IPC: H01L21/768 ,  H01L29/02

CPC classification number: H01L23/3171 ,  H01L21/02107 ,  H01L21/30655 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/485 ,  H01L24/05 ,  H01L2224/0236 ,  H01L2224/02372 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2224/05552

Abstract: A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall.

Abstract translation: 提供了一种制造芯片布置的方法，该方法包括：在载体中形成一个孔，该载体包括至少一个芯片，其中在载体中形成孔包括：选择性地去除载体材料，从而在载体中形成空腔，形成钝化 通过选择性去除载体材料暴露的一个或多个腔壁上的材料; 选择性地去除钝化材料的一部分和通过选择性去除钝化材料暴露的另外的载体材料，其中钝化材料的另一部分保留在至少一个空腔侧壁上; 该方法还包括随后在保留在至少一个空腔侧壁上的钝化材料的另一部分上形成层。

公开(公告)号：US20130207527A1

公开(公告)日：2013-08-15

申请号：US13880064

申请日：2011-10-24

Applicant: Alexander Heinrich ,  Matthias Wiedenmann

Inventor： Alexander Heinrich ,  Matthias Wiedenmann

IPC: H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0239 ,  F25D23/064 ,  F25D23/067 ,  F25D27/00 ,  F25D29/005 ,  H05K5/0004 ,  Y10T29/49826 ,  Y10T403/52

Abstract: A backing piece for attaching an electrical component to a housing wall of an electrical household appliance and arrangement behind a matching opening in the housing wall includes a body having an essentially rectangular base surface, and a peripheral web configured as an elastic sealing lip for support against a rear face of the housing wall. Holding elements project from the body and form with the sealing lip a gap which receives a section of the housing wall at an edge of the opening. The holding elements are arranged in spaced-apart relationship about a periphery of the body such that at least one of the holding element is arranged on each of four sides of the rectangular base surface and one of the holding elements is provided at each of the corners of the body so as to apply a pressing force sufficient upon each section of the sealing lip.

Abstract translation: 用于将电气部件附接到家用电器的壳体壁和在壳体壁中的匹配开口后面的布置的背衬件包括具有基本上矩形的基部表面的本体和被配置为弹性密封唇缘的外围腹板，用于支撑 壳体壁的后表面。 保持元件从主体突出并且与密封唇一起形成在开口的边缘处接收壳体壁的一部分的间隙。 保持元件围绕主体的周边以间隔的关系布置，使得保持元件中的至少一个布置在矩形基底表面的四个侧面中的每一侧上，并且一个保持元件设置在每个拐角处 以便对密封唇的每个部分施加足够的按压力。

公开(公告)号：US20130200502A1

公开(公告)日：2013-08-08

申请号：US13369075

申请日：2012-02-08

Applicant: Ivan Nikitin ,  Stefan Landau ,  Joachim Mahler ,  Alexander Heinrich ,  Ralf Wombacher

Inventor： Ivan Nikitin ,  Stefan Landau ,  Joachim Mahler ,  Alexander Heinrich ,  Ralf Wombacher

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/29 ,  H01L21/78

CPC classification number: H01L21/561 ,  B32B37/203 ,  B32B2305/342 ,  B32B2457/14 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2224/83001 ,  H01L2224/92244 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/24246

Abstract: A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier.

Abstract translation: 一种制造半导体器件的方法包括提供转印箔。 多个半导体芯片放置在转印箔上并粘附到转印箔上。 粘附到转印箔上的多个半导体芯片放置在多器件载体上。 施加热量以将转印箔层压在多器件载体上，从而在叠层转印箔和多器件载体之间容纳多个半导体芯片。

公开(公告)号：US1053297A

公开(公告)日：1913-02-18

申请号：US1910540239

申请日：1910-01-26

Applicant: KEHRHAHN ALEXANDER HEINRICH

Inventor： KEHRHAHN ALEXANDER HEINRICH

CPC classification number: C14B1/02

公开(公告)号：US705445A

公开(公告)日：1902-07-22

申请号：US1899723507

申请日：1899-07-11

Applicant: RIETZSCHEL ALEXANDER HEINRICH

Inventor： RIETZSCHEL ALEXANDER HEINRICH

CPC classification number: G03B13/24

公开(公告)号：US09689561B2

公开(公告)日：2017-06-27

申请号：US13880381

申请日：2011-10-25

Applicant: Alexander Heinrich ,  Matthias Wiedenmann

Inventor： Alexander Heinrich ,  Matthias Wiedenmann

IPC: F21V21/08 ,  F25D27/00

CPC classification number: F21V21/08 ,  F25D27/00 ,  Y10T29/49826

Abstract: A lighting unit for a large electrical household appliance includes a base part configured to receive a luminous element and having positive engagement elements, and a top part configured for attachment to the base part through displacement of the top part longitudinally in a connection plane relative to the base part. The top part has in displacement direction a front region which is provided with two gripping hooks for engagement with the positive engagement elements of the base part, with the gripping hooks engaging below the positive engagement elements.

公开(公告)号：US08883101B2

公开(公告)日：2014-11-11

申请号：US13929048

申请日：2013-06-27

Applicant: Tobias Pfister ,  Arthur Bastoreala ,  Alexander Heinrich

Inventor： Tobias Pfister ,  Arthur Bastoreala ,  Alexander Heinrich

IPC: B01D53/94 ,  F01N3/10 ,  F01N3/18 ,  F01N3/20

CPC classification number: B01D53/9495 ,  B01D53/90 ,  B01D53/9477 ,  B01D2251/208 ,  F01N3/035 ,  F01N3/106 ,  F01N3/2033 ,  F01N3/2066 ,  F01N9/00 ,  F01N9/005 ,  F01N11/002 ,  F01N11/005 ,  F01N11/007 ,  F01N2550/02 ,  F01N2550/04 ,  F01N2560/023 ,  F01N2560/025 ,  F01N2560/06 ,  F01N2900/1411 ,  F01N2900/1602 ,  F01N2900/1621 ,  F02D41/025 ,  F02D41/402 ,  F02D41/403 ,  F02D41/405 ,  Y02T10/24 ,  Y02T10/26 ,  Y02T10/44 ,  Y02T10/47

Abstract: A method for operating an exhaust gas system for an internal combustion engine, in which the exhaust gas system includes at least one first catalytic coating and at least one second catalytic coating, the second catalytic coating being situated in the exhaust gas flow downstream from the first catalytic coating. An additional quantity of hydrocarbons is occasionally introduced into the exhaust gas upstream from the first catalytic coating so that a heat-generating reaction may take place in the second catalytic coating. With the aid of at least one temperature sensor and/or at least one hydrocarbon sensor and/or at least one lambda sensor upstream and/or downstream from the second catalytic coating, at least one property of the exhaust gas is ascertained which characterizes a reaction of the second catalytic coating due to the additional quantity of hydrocarbons.

Abstract translation: 一种用于操作用于内燃机的排气系统的方法，其中所述排气系统包括至少一个第一催化涂层和至少一个第二催化涂层，所述第二催化涂层位于所述排气流中， 催化涂层。 偶尔会在第一催化涂层上游的废气中引入附加量的碳氢化合物，从而在第二催化涂层中可能发生发热反应。 借助于第二催化涂层上游和/或下游的至少一个温度传感器和/或至少一个烃传感器和/或至少一个λ传感器，确定排气的至少一个性质，其特征在于反应 的第二催化涂层，由于附加量的烃。

公开(公告)号：US08630748B2

公开(公告)日：2014-01-14

申请号：US13473041

申请日：2012-05-16

Applicant: Stefan Hermann ,  Alexander Heinrich ,  Franz Plattner

Inventor： Stefan Hermann ,  Alexander Heinrich ,  Franz Plattner

IPC: G06F7/00

CPC classification number: B60R25/24

Abstract: A method for access or starting verification for a vehicle using a mobile identification encoder and at least two antennas located in or on the vehicle at different locations includes: the antennas emitting electromagnetic signals at alterable times, wherein the electromagnetic signals are emitted in transmission blocks having alterable specific properties and wherein a plurality of transmission blocks are strung together to form a communication message in which each transmission block adopts an alterable position in time, the identification encoder receiving the electromagnetic signals emitted by the antennas and processing them to generate a response signal, and altering at least one of the times at which the individual antennas are actuated, the specific properties of the individual transmission blocks, and the position of the individual transmission blocks in time in the communication message in accordance with a cryptographical method.

Abstract translation: 使用移动识别编码器和位于不同位置的车辆中或车辆上的至少两个天线的接入或开始验证的方法包括：在可变时间发射电磁信号的天线，其中电磁信号在具有 可变形的特定属性，并且其中多个传输块串在一起以形成通信消息，其中每个传输块在时间上采用可变位置，识别编码器接收天线发射的电磁信号并对其进行处理以产生响应信号， 以及根据密码方式改变各个天线被激活的时间中的至少一个，各个传输块的具体属性以及各个传输块在通信消息中的时间位置。