发明申请
US20140070376A1 Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
有权
用于制造芯片布置的方法，用于制造芯片封装的方法，芯片封装和芯片布置
- 专利标题： Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
- 专利标题（中）： 用于制造芯片布置的方法，用于制造芯片封装的方法，芯片封装和芯片布置
-
申请号： US13609306申请日： 2012-09-11
-
公开(公告)号： US20140070376A1公开(公告)日： 2014-03-13
- 发明人: Reinhard Hess , Katharina Umminger , Gabriel Maier , Markus Menath , Gunther Mackh , Hannes Eder , Alexander Heinrich
- 申请人： Reinhard Hess , Katharina Umminger , Gabriel Maier , Markus Menath , Gunther Mackh , Hannes Eder , Alexander Heinrich
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L29/02
摘要：
A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall.
公开/授权文献
信息查询
IPC分类:
