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公开(公告)号：US20130140685A1
公开(公告)日：2013-06-06
申请号：US13309163
申请日：2011-12-01
Applicant: Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt
Inventor： Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt
IPC: H01L23/495 , H01L21/768 , H01L23/485
CPC classification number: H01L24/32 , H01L23/4827 , H01L23/49513 , H01L23/49541 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/83 , H01L29/43 , H01L29/45 , H01L2224/03438 , H01L2224/0345 , H01L2224/04026 , H01L2224/05083 , H01L2224/05124 , H01L2224/05139 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/08503 , H01L2224/2745 , H01L2224/29082 , H01L2224/29084 , H01L2224/291 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29184 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/83191 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83469 , H01L2224/83815 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01048 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/17738 , H01L2924/17747 , H01L2924/1776 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023 , H01L2924/01015 , H01L2924/00
Abstract: The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.
Abstract translation: 电子设备包括载体，附着到载体的半导体衬底以及设置在半导体衬底和载体之间的层系统。 层系统包括设置在半导体衬底上的电接触层。 功能层设置在电接触层上。 粘附层设置在功能层上。 在粘合层和载体之间设置焊料层。
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公开(公告)号：US09490193B2
公开(公告)日：2016-11-08
申请号：US13309163
申请日：2011-12-01
Applicant: Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt
Inventor： Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt
IPC: H01L29/43 , H01L29/45 , H01L23/482 , H01L23/00 , H01L23/495
CPC classification number: H01L24/32 , H01L23/4827 , H01L23/49513 , H01L23/49541 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/83 , H01L29/43 , H01L29/45 , H01L2224/03438 , H01L2224/0345 , H01L2224/04026 , H01L2224/05083 , H01L2224/05124 , H01L2224/05139 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/08503 , H01L2224/2745 , H01L2224/29082 , H01L2224/29084 , H01L2224/291 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29184 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/83191 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83469 , H01L2224/83815 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01048 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/17738 , H01L2924/17747 , H01L2924/1776 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023 , H01L2924/01015 , H01L2924/00
Abstract: The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.
Abstract translation: 电子设备包括载体，附着到载体的半导体衬底以及设置在半导体衬底和载体之间的层系统。 层系统包括设置在半导体衬底上的电接触层。 功能层设置在电接触层上。 粘附层设置在功能层上。 在粘合层和载体之间设置焊料层。
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公开(公告)号：US09953952B2
公开(公告)日：2018-04-24
申请号：US12195200
申请日：2008-08-20
Applicant: Joachim Mahler , Michael Juerss , Stefan Landau
Inventor： Joachim Mahler , Michael Juerss , Stefan Landau
CPC classification number: H01L24/85 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/3142 , H01L23/564 , H01L24/16 , H01L24/19 , H01L24/24 , H01L24/28 , H01L24/29 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24051 , H01L2224/24226 , H01L2224/24246 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/4554 , H01L2224/45669 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/73204 , H01L2224/73221 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801 , H01L2224/8385 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/06 , H01L2924/00012 , H01L2224/78 , H01L2924/00 , H01L2224/37099 , H01L2224/85399 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.
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公开(公告)号：US20100044841A1
公开(公告)日：2010-02-25
申请号：US12195200
申请日：2008-08-20
Applicant: Joachim Mahler , Michael Juerss , Stefan Landau
Inventor： Joachim Mahler , Michael Juerss , Stefan Landau
CPC classification number: H01L24/85 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/3142 , H01L23/564 , H01L24/16 , H01L24/19 , H01L24/24 , H01L24/28 , H01L24/29 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24051 , H01L2224/24226 , H01L2224/24246 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/4554 , H01L2224/45669 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/73204 , H01L2224/73221 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801 , H01L2224/8385 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/06 , H01L2924/00012 , H01L2224/78 , H01L2924/00 , H01L2224/37099 , H01L2224/85399 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.
Abstract translation: 半导体器件包括载体，附着到载体上的芯片，沉积在芯片和载体上的密封剂蒸气，以及沉积在密封芯片和密封载体上的封装材料。
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