Invention Application
- Patent Title: Electronic Device and a Method for Fabricating an Electronic Device
- Patent Title (中): 电子设备及其制造方法
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Application No.: US13309163Application Date: 2011-12-01
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Publication No.: US20130140685A1Publication Date: 2013-06-06
- Inventor: Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt
- Applicant: Alexander Heinrich , Michael Juerss , Konrad Roesl , Oliver Eichinger , Kok Chai Goh , Tobias Schmidt
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/768 ; H01L23/485
Abstract:
The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.
Public/Granted literature
- US09490193B2 Electronic device with multi-layer contact Public/Granted day:2016-11-08
Information query
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