公开(公告)号：US12119276B2

公开(公告)日：2024-10-15

申请号：US18360465

申请日：2023-07-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Wen-Yi Lin ,  Kuang-Chun Lee ,  Chien-Chen Li ,  Chen-Shien Chen

IPC分类号： H01L23/10 ,  H01L21/48 ,  H01L23/00 ,  H01L23/053 ,  H01L23/367 ,  H01L23/552

CPC分类号： H01L23/10 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/3675 ,  H01L23/552 ,  H01L23/562 ,  H01L24/06 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/16195

摘要： A package structure is provided. The package structure includes a substrate and a chip-containing structure over the substrate. The package structure also includes a protective lid attached to the substrate through a first adhesive element and a second adhesive element. The first adhesive element has a first electrical resistivity, and the second adhesive element has a second electrical resistivity. The second electrical resistivity is greater than the first electrical resistivity. The second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.

公开(公告)号：US11764118B2

公开(公告)日：2023-09-19

申请号：US17244686

申请日：2021-04-29

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Yi Lin ,  Kuang-Chun Lee ,  Chien-Chen Li ,  Chen-Shien Chen

IPC分类号： H01L23/10 ,  H01L21/48 ,  H01L23/053 ,  H01L23/367 ,  H01L23/552 ,  H01L23/00

CPC分类号： H01L23/10 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/3675 ,  H01L23/552 ,  H01L23/562 ,  H01L24/06 ,  H01L2924/16195

摘要： A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate, and forming a first adhesive element over the substrate. The first adhesive element has a first electrical resistivity. The method also includes forming a second adhesive element over the substrate. The second adhesive element has a second electrical resistivity, and the second electrical resistivity is greater than the first electrical resistivity. The method further includes attaching a protective lid to the substrate through the first adhesive element and the second adhesive element. The protective lid surrounds the chip structure and covers a top surface of the chip structure.

公开(公告)号：US11545463B2

公开(公告)日：2023-01-03

申请号：US17394621

申请日：2021-08-05

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Sheng-Yao Yang ,  Ling-Wei Li ,  Yu-Jui Wu ,  Cheng-Lin Huang ,  Chien-Chen Li ,  Lieh-Chuan Chen ,  Che-Jung Chu ,  Kuo-Chio Liu

IPC分类号： H01L23/00 ,  H01L21/768

摘要： A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.

公开(公告)号：US20170186632A1

公开(公告)日：2017-06-29

申请号：US15456566

申请日：2017-03-12

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ching Tasi Liu ,  Fu-Chen Chang ,  Chien-Chen Li ,  Te Lung Liu ,  Kuo Liang Lu

IPC分类号： H01L21/67 ,  H01L21/687 ,  B32B38/10 ,  H01L21/683

CPC分类号： H01L21/67132 ,  B32B38/10 ,  B32B2310/04 ,  B32B2457/14 ,  H01L21/6836 ,  H01L21/68714 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1111 ,  Y10T156/17

摘要： Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.

公开(公告)号：US09613845B2

公开(公告)日：2017-04-04

申请号：US14158503

申请日：2014-01-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ching Tasi Liu ,  Fu-Chen Chang ,  Chien-Chen Li ,  Te Lung Liu ,  Kuo Liang Lu

IPC分类号： B29C65/50 ,  B32B37/12 ,  B32B38/10 ,  B32B39/00 ,  H01L21/683

CPC分类号： H01L21/67132 ,  B32B38/10 ,  B32B2310/04 ,  B32B2457/14 ,  H01L21/6836 ,  H01L21/68714 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1111 ,  Y10T156/17

摘要： Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.

公开(公告)号：US09209048B2

公开(公告)日：2015-12-08

申请号：US14276832

申请日：2014-05-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Chun Huang ,  Chien-Chen Li ,  Kuo-Chio Liu ,  Ruey-Yun Shiue ,  Hsi-Kuei Cheng ,  Chih-Hsien Lin ,  Jing-Cheng Lin ,  Hsiang-Tai Lu ,  Tzi-Yi Shieh

IPC分类号： H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/60 ,  H01L25/065

CPC分类号： H01L21/565 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/145 ,  H01L23/147 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5329 ,  H01L23/5384 ,  H01L23/60 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/10342 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00012

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound having a first thickness over the die, and removing a portion, but not all, of the thickness of the mold compound over the die. The method further includes performing further processing on the device, and removing the remaining thickness of the mold compound over the die.

摘要翻译： 本公开的实施例包括半导体封装及其形成方法。 一个实施例是一种方法，包括将管芯安装到衬底的顶表面以形成器件，将衬底的管芯和顶表面封装在模具化合物中，模具化合物在模具上具有第一厚度，并且去除部分 但不是全部，模具上的模具化合物的厚度。 所述方法还包括对所述装置执行进一步的处理，以及去除所述模具上的所述模制化合物的剩余厚度。

公开(公告)号：US20150187607A1

公开(公告)日：2015-07-02

申请号：US14276832

申请日：2014-05-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Chun Huang ,  Chien-Chen Li ,  Kuo-Chio Liu ,  Ruey-Yun Shiue ,  Hsi-Kuei Cheng ,  Chih-Hsien Lin ,  Jing-Cheng Lin ,  Hsiang-Tai Lu ,  Tzi-Yi Shieh

IPC分类号： H01L21/56 ,  H01L25/065 ,  H01L23/60 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/145 ,  H01L23/147 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5329 ,  H01L23/5384 ,  H01L23/60 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/10342 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00012

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound having a first thickness over the die, and removing a portion, but not all, of the thickness of the mold compound over the die. The method further includes performing further processing on the device, and removing the remaining thickness of the mold compound over the die.

摘要翻译： 本公开的实施例包括半导体封装及其形成方法。 一个实施例是一种方法，包括将管芯安装到衬底的顶表面以形成器件，将衬底的管芯和顶表面封装在模具化合物中，模具化合物在模具上具有第一厚度，并且去除部分 但不是全部，模具上的模具化合物的厚度。 所述方法还包括对所述装置执行进一步的处理，以及去除所述模具上的所述模制化合物的剩余厚度。

公开(公告)号：US12019097B2

公开(公告)日：2024-06-25

申请号：US17460803

申请日：2021-08-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Yi Lin ,  Hao Chen ,  Chuan-Hsiang Sun ,  Mill-Jer Wang ,  Chien-Chen Li ,  Chen-Shien Chen

IPC分类号： G01R1/067 ,  G01R31/28

CPC分类号： G01R1/06761 ,  G01R1/06733 ,  G01R1/06794 ,  G01R31/2851

摘要： A probe head structure is provided. The probe head structure includes a flexible substrate having a top surface and a bottom surface. The probe head structure includes a first probe pillar passing through the flexible substrate. The first probe pillar has a first protruding portion protruding from the bottom surface. The probe head structure includes a redistribution structure on the top surface of the flexible substrate and the first probe pillar. The redistribution structure is in direct contact with the flexible substrate and the first probe pillar. The redistribution structure includes a dielectric structure and a wiring structure in the dielectric structure. The wiring structure is electrically connected to the first probe pillar. The probe head structure includes a wiring substrate over the redistribution structure. The probe head structure includes a first conductive bump connected between the wiring substrate and the redistribution structure.

公开(公告)号：US11984419B2

公开(公告)日：2024-05-14

申请号：US17874021

申请日：2022-07-26

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Hung Chen ,  Yu-Nu Hsu ,  Chun-Chen Liu ,  Heng-Chi Huang ,  Chien-Chen Li ,  Shih-Yen Chen ,  Cheng-Nan Hsieh ,  Kuo-Chio Liu ,  Chen-Shien Chen ,  Chin-Yu Ku ,  Te-Hsun Pang ,  Yuan-Feng Wu ,  Sen-Chi Chiang

IPC分类号： H01L23/00 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L24/13 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0362 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/10145 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11614 ,  H01L2224/11831 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/01327 ,  H01L2924/2064 ,  H01L2224/11849 ,  H01L2924/00014 ,  H01L2224/13014 ,  H01L2924/00012 ,  H01L2224/13013 ,  H01L2924/00012 ,  H01L2224/13012 ,  H01L2924/00012 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/1145 ,  H01L2924/00014 ,  H01L2224/81815 ,  H01L2924/00014

摘要： Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

公开(公告)号：US11848302B2

公开(公告)日：2023-12-19

申请号：US18065156

申请日：2022-12-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Sheng-Yao Yang ,  Ling-Wei Li ,  Yu-Jui Wu ,  Cheng-Lin Huang ,  Chien-Chen Li ,  Lieh-Chuan Chen ,  Che-Jung Chu ,  Kuo-Chio Liu

IPC分类号： H01L23/00 ,  H01L21/768

CPC分类号： H01L24/81 ,  H01L21/76816 ,  H01L21/76871 ,  H01L24/09 ,  H01L24/11 ,  H01L24/17 ,  H01L24/30

摘要： A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive bump over and electrically connected to the chip. The chip package structure includes a ring-like structure over and electrically insulated from the chip. The ring-like structure surrounds the conductive bump, and the ring-like structure and the conductive bump are made of a same material.