-
公开(公告)号：US09209048B2
公开(公告)日：2015-12-08
申请号：US14276832
申请日：2014-05-13
发明人： Wen-Chun Huang , Chien-Chen Li , Kuo-Chio Liu , Ruey-Yun Shiue , Hsi-Kuei Cheng , Chih-Hsien Lin , Jing-Cheng Lin , Hsiang-Tai Lu , Tzi-Yi Shieh
CPC分类号： H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound having a first thickness over the die, and removing a portion, but not all, of the thickness of the mold compound over the die. The method further includes performing further processing on the device, and removing the remaining thickness of the mold compound over the die.
摘要翻译： 本公开的实施例包括半导体封装及其形成方法。 一个实施例是一种方法，包括将管芯安装到衬底的顶表面以形成器件，将衬底的管芯和顶表面封装在模具化合物中，模具化合物在模具上具有第一厚度，并且去除部分 但不是全部，模具上的模具化合物的厚度。 所述方法还包括对所述装置执行进一步的处理，以及去除所述模具上的所述模制化合物的剩余厚度。
-
公开(公告)号：US20150187607A1
公开(公告)日：2015-07-02
申请号：US14276832
申请日：2014-05-13
发明人： Wen-Chun Huang , Chien-Chen Li , Kuo-Chio Liu , Ruey-Yun Shiue , Hsi-Kuei Cheng , Chih-Hsien Lin , Jing-Cheng Lin , Hsiang-Tai Lu , Tzi-Yi Shieh
IPC分类号： H01L21/56 , H01L25/065 , H01L23/60 , H01L23/29 , H01L23/31
CPC分类号： H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound having a first thickness over the die, and removing a portion, but not all, of the thickness of the mold compound over the die. The method further includes performing further processing on the device, and removing the remaining thickness of the mold compound over the die.
摘要翻译： 本公开的实施例包括半导体封装及其形成方法。 一个实施例是一种方法，包括将管芯安装到衬底的顶表面以形成器件，将衬底的管芯和顶表面封装在模具化合物中，模具化合物在模具上具有第一厚度，并且去除部分 但不是全部，模具上的模具化合物的厚度。 所述方法还包括对所述装置执行进一步的处理，以及去除所述模具上的所述模制化合物的剩余厚度。
-
搜索结果
2 条记录 (耗时 0.016 秒)
